Patents by Inventor Mitsuaki Chiba

Mitsuaki Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210357500
    Abstract: A calculation device receives input of a plurality of pieces of training data including a communication destination known to be malignant as data. The calculation device generates a model that calculates a malignant degree of an input communication destination from each piece of the training data. The calculation device gives weight to each of the models, and generates a mixed model using the model and the weight. The calculation device calculates a malignant degree of a communication destination unknown whether the communication destination is malignant using the mixed model.
    Type: Application
    Filed: April 16, 2019
    Publication date: November 18, 2021
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Daiki CHIBA, Yuta TAKATA, Mitsuaki AKIYAMA
  • Patent number: 11168974
    Abstract: A dielectric elastomer sensor system A1 is provided with an oscillation circuit 1 including a dielectric elastomer sensor element 11 having a dielectric elastomer layer 111 and a pair of electrode layers 112 sandwiching the dielectric elastomer layer 111, and with a determination circuit 2 configured to determine a change in a capacitance of the dielectric elastomer sensor element 11, based on an output signal from the oscillation circuit 1. The dielectric elastomer sensor element 11 changes in capacitance due to deformation caused by external forces of at least two mutually different directions. Such a configuration enables provision of a multifunctional dielectric elastomer sensor system and dielectric elastomer sensor element.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: November 9, 2021
    Assignees: ZEON CORPORATION
    Inventors: Seiki Chiba, Mikio Waki, Mitsuaki Ito, Makoto Sawada
  • Publication number: 20210342651
    Abstract: A data classification device includes: a known data input unit that receives an input of known data, the known data being data already classified into a class and a subclass subordinate to the class; a feature extraction unit that extracts, from features included in the known data, a feature that causes classification of the known data belonging to the same class into a subclass using the feature to fail; and a classification unit that classifies classification target data into a class using the feature extracted by the feature extraction unit.
    Type: Application
    Filed: October 7, 2019
    Publication date: November 4, 2021
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Toshiki SHIBAHARA, Daiki CHIBA, Mitsuaki AKIYAMA, Kunio HATO
  • Publication number: 20210279497
    Abstract: An analysis device includes an input unit that receives input of communication destination information to be analyzed, a conversion unit that converts a partial character string included in the communication destination information into an image, a search unit that obtains a character string that is visually similar to an image converted by the conversion unit and searches for known communication destination information that is visually similar to the communication destination information based on the character string obtained, and an output unit that outputs a combination of the communication destination information and the known communication destination information that is visually similar to the communication destination information.
    Type: Application
    Filed: April 26, 2019
    Publication date: September 9, 2021
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Daiki CHIBA, Mitsuaki AKIYAMA
  • Publication number: 20210281540
    Abstract: An identification device specifies a boundary which divides rows of IP addresses, which are included in an IP address block and sorted in a predetermined order, into a plurality of parts based on AS numbers, e2LDs, PTR records, etc. of the IP addresses. When the number of the IP addresses included in the part divided by the boundary is equal to or more than a parameter N, which can be arbitrarily set, an identification unit identifies the IP addresses included in the part as dynamic IP addresses.
    Type: Application
    Filed: April 16, 2019
    Publication date: September 9, 2021
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Daiki CHIBA, Mitsuaki AKIYAMA
  • Patent number: 7372132
    Abstract: A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 ?m are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: May 13, 2008
    Assignees: Hitachi, Ltd., Hitachi Metals, Ltd.
    Inventors: Kazuhiro Suzuki, Toshiaki Morita, Hisayuki Imamura, Junichi Watanabe, Mitsuaki Chiba
  • Publication number: 20050258550
    Abstract: There is provided a thinner high frequency power module structure having reduced the mounting area. An insulated board is provided with a composite metal board in which the Cu2O powder particles are dispersed into a matrix metal (Cu) (amount of addition of Cu2O: 20 vol %; thermal expansion coefficient: 10.0 ppm/° C.; thermal conductivity: 280 W/m•K; thickness: 1 mm; size: 42.4×85 mm), a silicon nitride board (thermal expansion coefficient: 3.4 ppm/° C.; thermal conductivity: 90 W/m•K; thickness: 0.3 mm; size: 30×50 mm) deposited with Ag-system bonding metal layer to one principal surface of the composite metal board, and a wiring metal board formed of copper or copper alloy provided to the other principal surface of the ceramics insulated board. For example, the bonding metal layer is adjusted in the thickness to 50 ?m, while the wiring metal board is also adjusted in the thickness to 0.4 mm.
    Type: Application
    Filed: February 25, 2005
    Publication date: November 24, 2005
    Inventors: Toshiaki Morita, Kazuhiro Suzuki, Hisayuki Imamura, Junichi Watanabe, Mitsuaki Chiba
  • Publication number: 20050221538
    Abstract: A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 ?m are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed.
    Type: Application
    Filed: February 23, 2005
    Publication date: October 6, 2005
    Inventors: Kazuhiro Suzuki, Toshiaki Morita, Hisayuki Imamura, Junichi Watanabe, Mitsuaki Chiba