Patents by Inventor Mitsugu Miyamoto

Mitsugu Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5418603
    Abstract: An image forming apparatus includes an original placement portion and a reference original portion outside of the original placement portion, a scanning device capable of selectively scanning either the original placement portion or the reference original portion, an image forming device for forming an image in accordance with the scanning device, a selection device for selecting the scanning of the original placement portion or the scanning of the reference original portion, and a reading device for reading an image of the reference original portion formed by the image forming device to evaluate a performance of the image forming device.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: May 23, 1995
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Hiroshi Kusumoto, Daisuke Hayashi, Hideki Ishida, Shoichi Kitagawa, Takashi Nagashima, Mitsugu Miyamoto
  • Patent number: 5392099
    Abstract: An image forming apparatus includes a charger for charging a photosensitive drum, the charger having a charging wire extending in a lengthwise direction of the photosensitive drum, an optical system for illuminating a document and introducing a reflected light to the photosensitive drum to produce a latent image of the document, a detector for detecting a target portion of the charging wire causing a white line based on a copied image on copy paper, a cleaning member movable along the charging wire and adapted for cleaning the charging wire, a driver for moving the cleaning member along the charging wire, and a controller responsive to the detector for controlling the driver to move the cleaning member to the target portion of the charging wire and clean the target portion.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: February 21, 1995
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Hiroshi Kusumoto, Daisuke Hayashi, Hideki Ishida, Shoichi Kitagawa, Mitsugu Miyamoto
  • Patent number: 5355195
    Abstract: A copying machine including a lower body, an upper body, a damper contractively arranged between the upper body and the lower body, and an adjusting member provided in the upper body is disclosed. The lower body end the upper body are rotatably connected with each other at ends thereof and can be opened at the other ends thereof. An original cover and an ADF are selectably mounted on the upper body so as to be replaced with each other. The adjusting member contracts the damper when the ADF is mounted on the upper body.
    Type: Grant
    Filed: April 5, 1993
    Date of Patent: October 11, 1994
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Mitsugu Miyamoto, Koji Ujino, Hiroyuki Sakamoto
  • Patent number: 5339137
    Abstract: An image forming apparatus includes a photosensitive body, a charge wire disposed along the photosensitive body at a specified spacing from the photosensitive body and adapted for charging the photosensitive body, the charge wire being tiltable on a plane passing an entirety of the charge wire and perpendicularly intersecting a surface of the photosensitive body. This apparatus is provided with a detector for detecting an image density distribution in a main scanning direction of copy paper, tilt angle calculator for calculating, based on a detected image density distribution, a correcting tilt angle of the charge wire to obtain a desired image density distribution in the main scanning direction, and a tilt angle controller for controlling the tilt angle in accordance with a calculated correcting tilt angle.
    Type: Grant
    Filed: September 13, 1993
    Date of Patent: August 16, 1994
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Hiroshi Kusumoto, Daisuke Hayashi, Hideki Ishida, Shoichi Kitagawa, Takashi Nagashima, Mitsugu Miyamoto
  • Patent number: 5327198
    Abstract: The exposure apparatus is provided with a first mirror frame movement hampering means for hampering the movement of the first mirror frame in the exposing direction. The first mirror frame movement hampering means has a closure mounted on an operating opening on the main body and a movement hampering member mounted on the closure and positioned near a linking portion of the driving device of the first mirror frame and at a position at which the movement in the exposing direction is interfered. The movement hampering member is mounted on the closure to adjust its position freely within a predetermined range in the reciprocatingly moving direction of the first mirror frame.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: July 5, 1994
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Shoichi Kitagawa, Mitsugu Miyamoto, Daisuke Hayashi, Hideki Ishida, Hiroshi Kusumoto
  • Patent number: 5319419
    Abstract: A scanning system driving device capable of quickly and gently starting a scanning system. This driving device includes an electromagnetic clutch for forward rotation, for transmitting a driving force from a driving source to a moving body for an optical system, and a control circuit for controlling the application of a voltage to the electromagnetic clutch. The control circuit applies a rated voltage in the form of pulses to the electromagnetic clutch at intervals of such OFF time that the moving speed of the moving body is reduced once when the illumination and the scanning of a document by the moving body are started.
    Type: Grant
    Filed: November 27, 1992
    Date of Patent: June 7, 1994
    Assignee: Mita Industrial Co., Ltd.
    Inventors: Hideki Ishida, Mitsugu Miyamoto, Shoichi Kitagawa, Takashi Nagashima, Daisuke Hayashi, Hiroshi Kusumoto
  • Patent number: 5252051
    Abstract: According to this invention, there is disclosed a resin-seal apparatus for a semiconductor element, including cavity blocks arranged to be opposite to each other and having a semiconductor element to be molded, ejector plates arranged to correspond to the cavity blocks, respectively, ejector pins and support pins arranged between the ejector plates and the cavity blocks, a pair of first annular heat-plate molding die sets arranged to surround the ejector plates arranged to correspond to the cavity blocks, a second heat-plate molding die set arranged below a corresponding one of the ejector plates, a plate holder below the second heat-plate molding die set, a gap portion and an elastic member formed between the plate holder and the second heat-plate molding die set, vertically movable connecting rods arranged through the gap portion and each having one end connected to a side surface of the corresponding one of the ejector plates, a stepped bolt engaged with the other end of each of the connecting rods, and pu
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: October 12, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Mitsugu Miyamoto, Minoru Togashi, Fumio Takahashi, Yutaka Fukuoka
  • Patent number: 5198883
    Abstract: First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.
    Type: Grant
    Filed: July 19, 1989
    Date of Patent: March 30, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Takahashi, Yasuhiro Yamaji, Susumu Harada, Kazuichi Komenaka, Mitsugu Miyamoto, Masashi Muromachi, Hiroshi Harada, Kazuo Numajiri, Haruyuki Shimakawa, Toshiharu Sakurai
  • Patent number: 5135034
    Abstract: An outer lead forming apparatus for a semiconductor device, includes a first die block incorporating dies for performing punching steps of a lead frame, a second die block incorporating dies for performing bending steps of leads, and convey means for conveying a workpiece from the first die block to the second die block.
    Type: Grant
    Filed: February 27, 1991
    Date of Patent: August 4, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Mitsugu Miyamoto