Patents by Inventor Mitsukazu Ochi

Mitsukazu Ochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090131609
    Abstract: Disclosed is an episulfide group-substituted silicon compound (A) having a backbone structure represented by the following formula (1). (1) (In the formula, R1s respectively represent a substituent having an episulfide group, an unsubstituted or unsaturated acyloxy group-substituted (C1-C10) alkyl group or an aryl group. R1s may be the same as or different from one another, but at least one R1 in a molecule is a substituent having an episulfide group.
    Type: Application
    Filed: July 24, 2006
    Publication date: May 21, 2009
    Inventors: Mitsukazu Ochi, Koji Nakayama
  • Publication number: 20070116938
    Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (a) of orientation in a range of 0.5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5×10?6 to 50×10?6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30×10?6 (/K) or less.
    Type: Application
    Filed: February 18, 2005
    Publication date: May 24, 2007
    Inventors: Masayuki Tobita, Toru Kimura, Hisashi Aoki, Naoyuki Shimoyama, Tsukasa Ishigaki, Mitsukazu Ochi, Miyuki Harada
  • Publication number: 20050171318
    Abstract: A curable resin composition includes a silane compound (a) having an epoxy group, and at least one selected from a silane compound (b) having an amino group, a silane compound (c) having a mercapto group, and a silane compound (d) having an acid anhydride group. At least a part of at least one selected from the silane compounds (a) to (d) includes a condensate. This composition has excellent heat resistance with a small change in storage modulus due to temperatures.
    Type: Application
    Filed: February 2, 2005
    Publication date: August 4, 2005
    Inventors: Hiroyuki Okuhira, Tomoyuki Matsumura, Kazunori Ishikawa, Natsuki Hamada, Keiko Miura, Hiroyuki Hosoda, Mitsukazu Ochi
  • Publication number: 20040224163
    Abstract: A thermally-conductive epoxy resin molded article comprises an epoxy resin having molecular chains that contain an azomethine group (—CH═N—). The molded article has a thermal conductivity in a range of 0.5 to 30 W/(m·K). It is preferred that the molecular chains of the epoxy resin are oriented in a specific direction, and in that direction, the molded article has a thermal conductivity in a range of 0.5 to 30 W/(m·K). The thermally-conductive epoxy resin molded article is produced by applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction and then curing the epoxy resin composition.
    Type: Application
    Filed: April 26, 2004
    Publication date: November 11, 2004
    Applicant: POLYMATECH CO., LTD.
    Inventors: Masayuki Tobita, Toru Kimura, Tsukasa Ishigaki, Naoyuki Shimoyama, Hisashi Aoki, Mitsukazu Ochi, Miyuki Harada
  • Publication number: 20040102597
    Abstract: A thermally-conductive epoxy resin molded article conducting heat generated from electronic components and the like, and a method of manufacturing the same are disclosed. The thermally-conductive epoxy resin molded article according to the present invention is obtained by curing an epoxy resin composition containing an epoxy resin. The epoxy resin contained in the thermally-conductive epoxy resin molded article has the degree of orientation &agr; equal to or larger than 0.5 and smaller than 1.0.
    Type: Application
    Filed: October 14, 2003
    Publication date: May 27, 2004
    Inventors: Masayuki Tobita, Tsukasa Ishigaki, Toru Kimura, Naoyuki Shimoyama, Hisashi Aoki, Mitsukazu Ochi
  • Patent number: 6005060
    Abstract: The present invention provides an epoxy resin composition which can provide a cured composite product having a high heat resistance, and an excellent mechanical strength at a high temperature.The present invention provides an epoxy resin composition comprising, as essential components: (a) an epoxy resin; (b) a curing agent for epoxy resins, (c) a silane compound having at least one epoxy group or a group being capable of reacting by addition to an epoxy group in a molecule, and at least two alkoxy groups connected to silicone atom in a molecule, and (d) a catalyst for condensation polymerization of a silane compound, and a cured composite product obtained by curing the composition.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: December 21, 1999
    Assignee: Shell Oil Company
    Inventors: Yasuyuki Murata, Mitsukazu Ochi, Norio Tohriiwa
  • Patent number: 5597876
    Abstract: An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: January 28, 1997
    Assignee: Shell Oil Company
    Inventors: Yasuyuki Murata, Yoshinori Nakanishi, Mitsukazu Ochi
  • Patent number: 5334661
    Abstract: An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to 400; n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material is useful as a cationic electrodeposition coating.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: August 2, 1994
    Assignees: Tomoegawa Paper Co., Ltd., Mitsukazu Ochi
    Inventors: Mitsukazu Ochi, Toshio Tagami, Osamu Kiyohara
  • Patent number: 5334662
    Abstract: An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material and a carboxyl-terminated polybutadiene-acrylonitrile copolymer is useful as a cationic electrodeposition coating.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: August 2, 1994
    Assignees: Tomoegawa Paper Co., Ltd., Mitsukazu Ochi
    Inventors: Mitsukazu Ochi, Toshio Tagami, Osamu Kiyohara
  • Patent number: 5258456
    Abstract: An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to 400; n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material is also disclosed.
    Type: Grant
    Filed: March 16, 1992
    Date of Patent: November 2, 1993
    Assignees: Tomoegawa Paper Co., Ltd., Mitsukazu Ochi
    Inventors: Mitsukazu Ochi, Toshio Tagami, Osamu Kiyohara