Abstract: A multi-chip module includes metal frame segments including a plurality of die-bonding pads and a plurality of terminals, a plurality of electronic components mounted on the die-bonding pads in electrical connection to the terminals, and a resin package for enclosing the electronic components and the metal frame segments with each of the terminals partially projecting outwardly from the resin package. Selected ones of the electronic components are electrically connected to each other via the metal frame segments and wires within the resin package.

Abstract: A noise protection sheet 1 is stuck on an IC chip C loaded on a circuit board 31 to control the noise generated from the IC chip C. The noise protection sheet 1 includes a metallic sheet 2 and insulating films 3 sandwiching the metallic sheet from both front and rear surfaces thereof. The metallic sheet 2 has, at its one end, an extending portion 7 to be connected to a land 32 serving as a grounding terminal on the circuit board 31. In this configuration, the noise protection sheet can effectively solve a noise problem in an electronic component.