Patents by Inventor Mitsunori Sano
Mitsunori Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7337513Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.Type: GrantFiled: July 25, 2006Date of Patent: March 4, 2008Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
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Publication number: 20060270115Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.Type: ApplicationFiled: July 25, 2006Publication date: November 30, 2006Applicants: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
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Patent number: 7135754Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.Type: GrantFiled: January 13, 2004Date of Patent: November 14, 2006Assignees: Nec Tokin Corporation, Nec Tokin Toyama, Ltd.Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
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Publication number: 20050168921Abstract: A chip type capacitor is disclosed which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability. A method for preparing the chip type capacitor and an anode terminal used in the preparation method are also disclosed. The chip type capacitor comprises: a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body; and an anode terminal electrically connected to the anode lead wire, the anode lead wire having such a site that about 75% or more of a periphery of a section thereof in the direction substantially perpendicular to the extending direction of the anode lead wire is covered with solidified matter resulting from solidification of a melt, the anode terminal and the anode lead wire being bonded to each other by the solidified matter.Type: ApplicationFiled: April 4, 2005Publication date: August 4, 2005Inventors: Mitsunori Sano, Takashi Kono
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Patent number: 6920037Abstract: In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.Type: GrantFiled: July 18, 2003Date of Patent: July 19, 2005Assignee: NEC TOKIN CorporationInventors: Mitsunori Sano, Takashi Kono, Kazuto Yoshida, Takashige Suzuki
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Patent number: 6903922Abstract: A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about 75% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.Type: GrantFiled: March 14, 2003Date of Patent: June 7, 2005Assignee: NEC Tokin CorporationInventors: Mitsunori Sano, Takashi Kono
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Publication number: 20040145065Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.Type: ApplicationFiled: January 13, 2004Publication date: July 29, 2004Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
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Publication number: 20040052033Abstract: In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.Type: ApplicationFiled: July 18, 2003Publication date: March 18, 2004Applicant: NEC TOKIN CorporationInventors: Mitsunori Sano, Takashi Kono, Kazuto Yoshida, Takashige Suzuki
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Publication number: 20030174460Abstract: A chip type capacitor is disclosed which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability. A method for preparing the chip type capacitor and an anode terminal used in the preparation method are also disclosed. The chip type capacitor comprises: a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body; and an anode terminal electrically connected to the anode lead wire, the anode lead wire having such a site that about 75% or more of a periphery of a section thereof in the direction substantially perpendicular to the extending direction of the anode lead wire is covered with solidified matter resulting from solidification of a melt, the anode terminal and the anode lead wire being bonded to each other by the solidified matter.Type: ApplicationFiled: March 14, 2003Publication date: September 18, 2003Applicant: NEC TOKIN CORPORATIONInventors: Mitsunori Sano, Takashi Kono
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Patent number: 6616713Abstract: An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.Type: GrantFiled: November 14, 2001Date of Patent: September 9, 2003Assignee: NEC Tokin CorporationInventors: Mitsunori Sano, Takashi Kono, Kazunori Watanabe
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Patent number: 6519135Abstract: A chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode lead 17 is embedded so as to project from embedding surface 21a, resin-based insulating film layer 24 containing a white pigment and disposed on the embedding surface of capacitor component 14, water-repellent layer 25 disposed on resin-based insulating film layer 24, anode terminal 12 having a portion bent into joint tongue 31, with anode lead 17 being placed on joint tongue 31, joint tongue 31 and anode lead 17 being welded to each other into anode terminal 12, and antireflection member 34 extending from a proximal end of joint tongue 31 of anode terminal 12 toward sintered body 21. When joint tongue 31 and anode lead 17 are welded to each other by a laser beam, antireflection member 34 prevents the laser beam from being reflected from the welded region.Type: GrantFiled: May 8, 2002Date of Patent: February 11, 2003Assignee: NEC Tokin CorporationInventors: Mitsunori Sano, Takashi Kono
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Publication number: 20020167786Abstract: A chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode lead 17 is embedded so as to project from embedding surface 21a, resin-based insulating film layer 24 containing a white pigment and disposed on the embedding surface of capacitor component 14, water-repellent layer 25 disposed on resin-based insulating film layer 24, anode terminal 12 having a portion bent into joint tongue 31, with anode lead 17 being placed on joint tongue 31, joint tongue 31 and anode lead 17 being welded to each other into anode terminal 12, and antireflection member 34 extending from a proximal end of joint tongue 31 of anode terminal 12 toward sintered body 21. When joint tongue 31 and anode lead 17 are welded to each other by a laser beam, antireflection member 34 prevents the laser beam from being reflected from the welded region.Type: ApplicationFiled: May 8, 2002Publication date: November 14, 2002Applicant: NEC TOKIN CORPORATIONInventors: Mitsunori Sano, Takashi Kono
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Patent number: 6430034Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 32 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.Type: GrantFiled: April 4, 2001Date of Patent: August 6, 2002Assignee: NEC CorporationInventors: Mitsunori Sano, Kazunori Watanabe, Hideaki Sato, Kazuhiro Mine
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Publication number: 20020061613Abstract: An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.Type: ApplicationFiled: November 14, 2001Publication date: May 23, 2002Applicant: NEC CORPORATIONInventors: Mitsunori Sano, Takashi Kono, Kazunori Watanabe
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Publication number: 20010028544Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 23 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.Type: ApplicationFiled: April 4, 2001Publication date: October 11, 2001Applicant: NEC CorporationInventors: Mitsunori Sano, Kazunori Watanabe, Hideaki Sato, Kazuhiro Mine
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Patent number: 5479064Abstract: A piezoelectric actuator has a housing having a top portion with an opening. A Y-shaped member comprising a bottom arm and divided two top arms. The bottom arm is fixed on a bottom portion of the housing and the divided two top arms are placed in a movable state. A detachable member is so fitted into the opening of the housing as to be detachable from the opening of the housing. A piezoelectric device has one end being fixed to the detachable member and the opposite end being in contact with a valley portion of the Y-shaped member so that when the piezoelectric device extends in a longitudinal direction by a voltage application then the opposite end presses down the alley portion thereby a distance between the tops of the divided two top arms of the Y-shaped member is enlarged. A beam has opposite ends being fixed to topes of the divided top arms and a center portion displaceable in a vertical direction when a distance between the tops of the divided top arms of the Y-shaped member is changed.Type: GrantFiled: December 28, 1994Date of Patent: December 26, 1995Assignee: NEC CorporationInventor: Mitsunori Sano
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Patent number: 5455477Abstract: A strain generating element for generating a strain in accordance with an externally provided driver voltage, a diaphragm secured to one end surface of the strain generating element and having a projecting portion, a case for encasing the strain generating element therein, a first coupler attached to the case, and a second coupler attached to the other end. A first coupler of a first piezoelectric actuator is connectable to a second coupler of a second piezoelectric actuator so that an elongation of the first actuator is transferred to the second actuator through a projecting portion of the first actuator to thereby add the elongation of the first actuator to an elongation of the second actuator in a uniform direction of elongation.Type: GrantFiled: September 9, 1994Date of Patent: October 3, 1995Assignee: NEC CorporationInventors: Mitsunori Sano, Masako Inagawa
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Patent number: 5351789Abstract: A positioning mechanism includes a housing, at least one holding member inserted into a lateral opening formed in the housing at the side wall, thereof and an electrostrictive effect element mounted on the holding member. When the electrostrictive effect element is energized, it expands to urge the holding member against a moving member which is to be stopped and held a desired location.Type: GrantFiled: February 27, 1992Date of Patent: October 4, 1994Assignee: NEC CorporationInventors: Isao Tochihara, Osamu Yamashita, Mitsunori Sano, Tomoyuki Takahashi, Makoto Nakano
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Patent number: 5191252Abstract: The invention relates to a device using a leverage mechanism for amplifying a mechanical displacement produced by applying a voltage to a piezoelectric element. The device has a central support part, a pair of lever arms which are arranged oppositely and symmetrically with respect to a center axis of the support part and each connected to the support part by a hinge section, a piezoelectric element which has a longitudinal axis normal to the center axis of the support part and is fixed at two opposite ends to root ends of the two lever arms, respectively, and a resilient metal sheet beam which is fixed at its two oposite ends to the tip ends of two lever arms, respectively. A displacement of each end of the piezoelectric element is transmitted to the adjacent lever arm and amplified by lever action of each lever arm.Type: GrantFiled: April 24, 1992Date of Patent: March 2, 1993Assignee: NEC CorporationInventor: Mitsunori Sano
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Patent number: D348433Type: GrantFiled: October 22, 1992Date of Patent: July 5, 1994Assignee: NEC CorporationInventors: Isao Tochihara, Mitsunori Sano