Patents by Inventor Mitsunori Sano

Mitsunori Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7337513
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: March 4, 2008
    Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Publication number: 20060270115
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Application
    Filed: July 25, 2006
    Publication date: November 30, 2006
    Applicants: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Patent number: 7135754
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: November 14, 2006
    Assignees: Nec Tokin Corporation, Nec Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Publication number: 20050168921
    Abstract: A chip type capacitor is disclosed which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability. A method for preparing the chip type capacitor and an anode terminal used in the preparation method are also disclosed. The chip type capacitor comprises: a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body; and an anode terminal electrically connected to the anode lead wire, the anode lead wire having such a site that about 75% or more of a periphery of a section thereof in the direction substantially perpendicular to the extending direction of the anode lead wire is covered with solidified matter resulting from solidification of a melt, the anode terminal and the anode lead wire being bonded to each other by the solidified matter.
    Type: Application
    Filed: April 4, 2005
    Publication date: August 4, 2005
    Inventors: Mitsunori Sano, Takashi Kono
  • Patent number: 6920037
    Abstract: In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: July 19, 2005
    Assignee: NEC TOKIN Corporation
    Inventors: Mitsunori Sano, Takashi Kono, Kazuto Yoshida, Takashige Suzuki
  • Patent number: 6903922
    Abstract: A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about 75% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: June 7, 2005
    Assignee: NEC Tokin Corporation
    Inventors: Mitsunori Sano, Takashi Kono
  • Publication number: 20040145065
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 29, 2004
    Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Publication number: 20040052033
    Abstract: In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.
    Type: Application
    Filed: July 18, 2003
    Publication date: March 18, 2004
    Applicant: NEC TOKIN Corporation
    Inventors: Mitsunori Sano, Takashi Kono, Kazuto Yoshida, Takashige Suzuki
  • Publication number: 20030174460
    Abstract: A chip type capacitor is disclosed which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability. A method for preparing the chip type capacitor and an anode terminal used in the preparation method are also disclosed. The chip type capacitor comprises: a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body; and an anode terminal electrically connected to the anode lead wire, the anode lead wire having such a site that about 75% or more of a periphery of a section thereof in the direction substantially perpendicular to the extending direction of the anode lead wire is covered with solidified matter resulting from solidification of a melt, the anode terminal and the anode lead wire being bonded to each other by the solidified matter.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 18, 2003
    Applicant: NEC TOKIN CORPORATION
    Inventors: Mitsunori Sano, Takashi Kono
  • Patent number: 6616713
    Abstract: An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: September 9, 2003
    Assignee: NEC Tokin Corporation
    Inventors: Mitsunori Sano, Takashi Kono, Kazunori Watanabe
  • Patent number: 6519135
    Abstract: A chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode lead 17 is embedded so as to project from embedding surface 21a, resin-based insulating film layer 24 containing a white pigment and disposed on the embedding surface of capacitor component 14, water-repellent layer 25 disposed on resin-based insulating film layer 24, anode terminal 12 having a portion bent into joint tongue 31, with anode lead 17 being placed on joint tongue 31, joint tongue 31 and anode lead 17 being welded to each other into anode terminal 12, and antireflection member 34 extending from a proximal end of joint tongue 31 of anode terminal 12 toward sintered body 21. When joint tongue 31 and anode lead 17 are welded to each other by a laser beam, antireflection member 34 prevents the laser beam from being reflected from the welded region.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: February 11, 2003
    Assignee: NEC Tokin Corporation
    Inventors: Mitsunori Sano, Takashi Kono
  • Publication number: 20020167786
    Abstract: A chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode lead 17 is embedded so as to project from embedding surface 21a, resin-based insulating film layer 24 containing a white pigment and disposed on the embedding surface of capacitor component 14, water-repellent layer 25 disposed on resin-based insulating film layer 24, anode terminal 12 having a portion bent into joint tongue 31, with anode lead 17 being placed on joint tongue 31, joint tongue 31 and anode lead 17 being welded to each other into anode terminal 12, and antireflection member 34 extending from a proximal end of joint tongue 31 of anode terminal 12 toward sintered body 21. When joint tongue 31 and anode lead 17 are welded to each other by a laser beam, antireflection member 34 prevents the laser beam from being reflected from the welded region.
    Type: Application
    Filed: May 8, 2002
    Publication date: November 14, 2002
    Applicant: NEC TOKIN CORPORATION
    Inventors: Mitsunori Sano, Takashi Kono
  • Patent number: 6430034
    Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 32 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: August 6, 2002
    Assignee: NEC Corporation
    Inventors: Mitsunori Sano, Kazunori Watanabe, Hideaki Sato, Kazuhiro Mine
  • Publication number: 20020061613
    Abstract: An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.
    Type: Application
    Filed: November 14, 2001
    Publication date: May 23, 2002
    Applicant: NEC CORPORATION
    Inventors: Mitsunori Sano, Takashi Kono, Kazunori Watanabe
  • Publication number: 20010028544
    Abstract: The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 23 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.
    Type: Application
    Filed: April 4, 2001
    Publication date: October 11, 2001
    Applicant: NEC Corporation
    Inventors: Mitsunori Sano, Kazunori Watanabe, Hideaki Sato, Kazuhiro Mine
  • Patent number: 5479064
    Abstract: A piezoelectric actuator has a housing having a top portion with an opening. A Y-shaped member comprising a bottom arm and divided two top arms. The bottom arm is fixed on a bottom portion of the housing and the divided two top arms are placed in a movable state. A detachable member is so fitted into the opening of the housing as to be detachable from the opening of the housing. A piezoelectric device has one end being fixed to the detachable member and the opposite end being in contact with a valley portion of the Y-shaped member so that when the piezoelectric device extends in a longitudinal direction by a voltage application then the opposite end presses down the alley portion thereby a distance between the tops of the divided two top arms of the Y-shaped member is enlarged. A beam has opposite ends being fixed to topes of the divided top arms and a center portion displaceable in a vertical direction when a distance between the tops of the divided top arms of the Y-shaped member is changed.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: December 26, 1995
    Assignee: NEC Corporation
    Inventor: Mitsunori Sano
  • Patent number: 5455477
    Abstract: A strain generating element for generating a strain in accordance with an externally provided driver voltage, a diaphragm secured to one end surface of the strain generating element and having a projecting portion, a case for encasing the strain generating element therein, a first coupler attached to the case, and a second coupler attached to the other end. A first coupler of a first piezoelectric actuator is connectable to a second coupler of a second piezoelectric actuator so that an elongation of the first actuator is transferred to the second actuator through a projecting portion of the first actuator to thereby add the elongation of the first actuator to an elongation of the second actuator in a uniform direction of elongation.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: October 3, 1995
    Assignee: NEC Corporation
    Inventors: Mitsunori Sano, Masako Inagawa
  • Patent number: 5351789
    Abstract: A positioning mechanism includes a housing, at least one holding member inserted into a lateral opening formed in the housing at the side wall, thereof and an electrostrictive effect element mounted on the holding member. When the electrostrictive effect element is energized, it expands to urge the holding member against a moving member which is to be stopped and held a desired location.
    Type: Grant
    Filed: February 27, 1992
    Date of Patent: October 4, 1994
    Assignee: NEC Corporation
    Inventors: Isao Tochihara, Osamu Yamashita, Mitsunori Sano, Tomoyuki Takahashi, Makoto Nakano
  • Patent number: 5191252
    Abstract: The invention relates to a device using a leverage mechanism for amplifying a mechanical displacement produced by applying a voltage to a piezoelectric element. The device has a central support part, a pair of lever arms which are arranged oppositely and symmetrically with respect to a center axis of the support part and each connected to the support part by a hinge section, a piezoelectric element which has a longitudinal axis normal to the center axis of the support part and is fixed at two opposite ends to root ends of the two lever arms, respectively, and a resilient metal sheet beam which is fixed at its two oposite ends to the tip ends of two lever arms, respectively. A displacement of each end of the piezoelectric element is transmitted to the adjacent lever arm and amplified by lever action of each lever arm.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: March 2, 1993
    Assignee: NEC Corporation
    Inventor: Mitsunori Sano
  • Patent number: D348433
    Type: Grant
    Filed: October 22, 1992
    Date of Patent: July 5, 1994
    Assignee: NEC Corporation
    Inventors: Isao Tochihara, Mitsunori Sano