Abstract: In a steerage locking system for a vehicle, including a control knob mounted to a rotor capable of being turned from a LOCK position via an ACC position and an ON position to a START position, the control knob is detachably fastened to a front end of the rotor by a screw member from axially outside the rotor. Thus, the maintenance such as exchange of the control knob is facilitated.

Abstract: The present invention is a method of making an acceleration sensor chip. The sensor chip is prepared from a SOI wafer having a silicon substrate, a SiO2 layer and a silicon thin film. A dopant is ion implanted at a position corresponding to a semiconductor strain gauge on the silicon thin film to form a diffusion resistor, and for forming devices necessary for circuit construction on said silicon thin film. A protective film is provided on the entire surface of the wafer, and a plurality of through holes penetrating the silicon thin film are formed by patterning and etching to make a weight part and a beam part connected to a support frame part on the periphery. The SiO2 layer under the weight part and the beam part is removed by wet etching to form the through holes, while leaving the protective film in place. The protective film is removed and a resist coated over the entire surface of the wafer. A slit for dividing the chip is formed part way through the wafer by dicing.

Abstract: A power steering system is provided which comprises a bypass conduit connecting between first and second communication conduits and having bypass conduit ports. A pair of valves disposed in the bypass conduit for selectively opening and closing the bypass conduit ports in response to the pressure fluid from the pressure source. The valves are adapted to provide communication between the first and second communication conduits when the hydraulic pressure source is inoperative.

Abstract: The present invention is a semiconductor sensor package for incorporating a semiconductor sensor chip. The main surface for mounting the semiconductor sensor chip is formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides for connecting with the input/output terminals of the semiconductor sensor chip and a bottom surface perpendicular to the main surface with a plurality of pins respectively formed along two sides parallel to the main surface. The plurality of pins are inserted into mounting holes formed in the printed circuit board, and the plurality of terminals provided along parallel sides the pins are electrically connected.

Abstract: A laser beam transmission apparatus comprises a light-incidence optical system (22) converging and focusing a laser beam emitted from a solid-state laser apparatus (1), and an optical fiber (8) which transmits the laser beam that has been converged and focused by the light-incidence optical system. The light-incidence optical system (22) has at least first and second lenses (13, 14) disposed on the same optical path. A first distance (a) between an output end of the solid-state laser apparatus and the first lens or a second distance (b) between the second lens and a light-incidence end of the optical fiber is freely set according to a relational formula based on a focal distance (f1, f2) of each of the first and second lenses.

Abstract: The present invention is an acceleration sensor chip comprising a support frame part and a sensor structure. The sensor structure includes a displaceable weight part with a magnetic thin film formed on the surface and at least one beam part for connecting the weight part to the frame part. The support frame part and sensor structure are formed on a silicon substrate through an insulating layer. The insulating layer between the sensor structure and the silicon substrate is removed and a coil is formed to surround the weight part on the support frame part at the periphery of the weight part. In some embodiments, the accelerator sensor chip comprises a plurality of such sensor structures.

Abstract: The present invention is a semiconductor sensor having a semiconductor sensor chip for detecting a physical value applied in a direction perpendicular to the chip surface; and a package for incorporating the semiconductor sensor chip. The main surface for mounting the semiconductor sensor chip is formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides for connecting with input/output terminals of the semiconductor sensor chip. A bottom surface, perpendicular to the main surface, is provided with a plurality of pins formed along the two sides parallel to the main surface, so that the plurality of pins are inserted into mounting holes formed in the printed circuit board.

Abstract: A method and apparatus for manufacturing a semiconductor physical quantity sensor according to the present invention achieves the high sensing accuracy and reliability and prevents a sticking phenomenon. Specifically, a semiconductor physical quantity sensor is cleaned by a displacement liquid and is dried while a SOI substrate is revolving. The number of revolutions is determined so that a suction force (FS), which acts on a silicon substrate by a surface tension of the displacement liquid, a sensor spring force FK and a centrifugal force (Fr) generated by the acceleration in the revolution can satisfy the following condition: (FK+Fr)>FS. In order to prevent the sticking phenomenon after the stop of the spray, the semiconductor physical quantity sensor is dried by spraying an inert gas such as nitrogen including minus ions so that the revolving SOI substrate can eliminate static electricity generated by friction of the air flow.

Abstract: A high-concentration impurity region is formed on all or a part of a surface of an Si forming the third layer, an oxide film (SiO2) forming the second layer is formed on the entire surface of the third layer, the third layer and an Si substrate forming the first layer are bonded together, and the Si forming the third layer is mirror-polished to manufacture an SOI wafer. A resist is then patterned on the SOI wafer, grooves and holes for specifying the contour of the structure are formed in the Si forming the third layer, and the oxide film SiO2 forming the second layer opposed to the formed detecting structure is removed. At the same time, an uneveness of about 0.01 to 0.5 &mgr;m is formed on the surface of the third layer, on which the high-concentration impurity region is formed.

Abstract: The present invention is an acceleration sensor chip having characterized a third layer formed on a first layer of a support substrate through an insulating second layer, where the third layer has a sensor structure. The second layer between the detection surface of the sensor structure and the first layer is removed. A beam part with a detection device, and a weight part with a plurality of cutouts of a same width are formed over the entire detection surface.

Abstract: A power steering system is provided which comprises a bypass conduit connecting between first and second communication conduits and having bypass conduit ports. A pair of valves disposed in the bypass conduit for selectively opening and closing the bypass conduit ports in response to the pressure fluid from the pressure source. The valves are adapted to provide communication between the first and second communication conduits when the hydraulic pressure source is inoperative.

Abstract: A sensor chip has a support frame part, and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part, the sensor structure is formed on a silicon substrate through an insulating layer, the insulating layer between the sensor structure and the silicon substrate is removed, the beam part is formed of two parallel beams, the weight part is connected to the support frame part by two parallel beams, and at least two semiconductor strain gauges are formed on the surface of the two respective parallel beams.

Abstract: A sensor chip has a support frame part, and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part, the sensor structure is formed on a silicon substrate through an insulating layer, the insulating layer between the sensor structure and the silicon substrate is removed, the beam part is formed of two parallel beams, the weight part is connected to the support frame part by two parallel beams, and at least two semiconductor strain gauges are formed on the surface of the two respective parallel beams.

Abstract: A semiconductor device includes a deformable sensor structure spaced apart from a substrate, and convexities are formed on the lower surface of the sensor structure with tips of the convexities pointing to the substrate. The convexities of the deformable sensor structure facilitate reducing the contact area between the sensor structure and the substrate and attractive force caused by surface tension of an etchant or washing liquid. Thus, the structure prevents the sticking phenomena, improves the throughput and reduces the manufacturing costs.

Abstract: A sensor chip has a support frame part, and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part, the sensor structure is formed on a silicon substrate through an insulating layer, the insulating layer between the sensor structure and the silicon substrate is removed, the beam part is formed of two parallel beams, the weight part is connected to the support frame part by two parallel beams, and at least two semiconductor strain gauges are formed on the surface of the two respective parallel beams.

Abstract: A sensor chip has a support frame part, and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part, the sensor structure is formed on a silicon substrate through an insulating layer, the insulating layer between the sensor structure and the silicon substrate is removed, the beam part is formed of two parallel beams, the weight part is connected to the support frame part by two parallel beams, and at least two semiconductor strain gauges are formed on the surface of the two respective parallel beams.

Abstract: A sensor chip has a support frame part, and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part, the sensor structure is formed on a silicon substrate through an insulating layer, the insulating layer between the sensor structure and the silicon substrate is removed, the beam part is formed of two parallel beams, the weight part is connected to the support frame part by two parallel beams, and at least two semiconductor strain gauges are formed on the surface of the two respective parallel beams.

Abstract: A sensor chip having a support frame part and sensor structure including at least one displaceable weight part, and a beam part for connecting the weight part to the support frame part. The sensor structure is formed on a silicon substrate through an insulating layer and the insulating layer between the sensor structure and the silicon substrate is removed. The beam part is formed of two parallel beams and the weight part is connected to the support frame part by two parallel beams. At least two semiconductor strain gauges are formed on the surface of the two respective parallel beams. The semiconductor chip may be contained in a package having a main surface for mounting the semiconductor sensor chip formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides thereof for connecting with input/output terminals of the semiconductor sensor chip.

Abstract: A method and apparatus for manufacturing a semiconductor physical quantity sensor according to the present invention achieves the high sensing accuracy and reliability and prevents a sticking phenomenon. Specifically, a semiconductor physical quantity sensor is cleaned by a displacement liquid and is dried while a SOI substrate is revolving. The number of revolutions is determined so that a suction force (FS), which acts on a silicon substrate by a surface tension of the displacement liquid, a sensor spring force FK and a centrifugal force (Fr) generated by the acceleration in the revolution can satisfy the following condition: (FK+Fr)>FS. In order to prevent the sticking phenomenon after the stop of the spray, the semiconductor physical quantity sensor is dried by spraying an inert gas such as nitrogen including minus ions so that the revolving SOI substrate can eliminate static electricity generated by friction of the air flow.

Abstract: A method and apparatus for manufacturing a semiconductor physical quantity sensor according to the present invention achieves the high sensing accuracy and reliability and prevents a sticking phenomenon. Specifically, a semiconductor physical quantity sensor is cleaned by a displacement liquid and is dried while a SOI substrate is revolving. The number of revolutions is determined so that a suction force (Fs), which acts on a silicon substrate by a surface tension of the displacement liquid, a sensor spring force FK and a centrifugal force (Fr) generated by the acceleration in the revolution can satisfy the following condition: (FK+Fr)>FS. In order to prevent the sticking phenomenon after the stop of the spray, the semiconductor physical quantity sensor is dried by spraying an inert gas such as nitrogen including minus ions so that the revolving SOI substrate can eliminate static electricity generated by friction of the air flow.