Patents by Inventor Mitsuo Takada

Mitsuo Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220122937
    Abstract: A palladium-coated copper bonding wire includes: a core material containing copper as a main component; and a palladium layer on the core material, in which a concentration of palladium relative to the entire wire is 1.0 mass % or more and 4.0 mass % or less, and a work hardening coefficient in an amount of change of an elongation rate 2% or more and a maximum elongation rate ?max % or less of the wire, is 0.20 or less.
    Type: Application
    Filed: November 30, 2021
    Publication date: April 21, 2022
    Inventors: Mitsuo TAKADA, Nanako MAEDA, Osamu MATSUZAWA, Ryo ISHIKAWA, Takuya KOBAYASHI
  • Patent number: 11185902
    Abstract: A platinum-based material element wire is coated with gold or gold alloy, and drawing-processed with a carbon-containing die. The thin wire manufactured in this manner is covered with gold or gold alloy, and the coverage of gold or gold alloy is 40% or more on an area basis. The thin wire formed of a platinum-based material is manufactured in a state of suppressing breakage in a drawing processing step, and has favorable performance in electric properties and the like. In addition, this manufacturing process is capable of efficiently manufacturing a platinum-based material thin wire while suppressing breakage when the thin wire is manufactured by drawing processing.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: November 30, 2021
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Yuki Horinouchi, Mitsuo Takada
  • Publication number: 20200384517
    Abstract: A platinum-based material element wire is coated with gold or gold alloy, and drawing-processed with a carbon-containing die. The thin wire manufactured in this manner is covered with gold or gold alloy, and the coverage of gold or gold alloy is 40% or more on an area basis. The thin wire formed of a platinum-based material is manufactured in a state of suppressing breakage in a drawing processing step, and has favorable performance in electric properties and the like. In addition, this manufacturing process is capable of efficiently manufacturing a platinum-based material thin wire while suppressing breakage when the thin wire is manufactured by drawing processing.
    Type: Application
    Filed: January 17, 2019
    Publication date: December 10, 2020
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Yuki HORINOUCHI, Mitsuo TAKADA
  • Patent number: 8147750
    Abstract: There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: April 3, 2012
    Assignee: Tanaka Denshi Kogyo KK
    Inventors: Mitsuo Takada, Satoshi Teshima, Takeshi Kuwahara
  • Publication number: 20100314156
    Abstract: [Issues to be Solved] To provide Au alloy wire for ball bonding, which is superior in wire strength, and also is superior in formability of molten ball and roundness of compressed ball. Moreover it is superior at stitch bondability, and is available for high density wiring of semiconductor devices. [Solution Means] An Au alloy wire for ball bonding comprising: 15-50 wt ppm Mg, 10-30 wt ppm Ca, 5-20 wt ppm Eu, 5-20 wt ppm Y, 5-20 wt ppm La and residual Au is 99.998 wt % purity or higher, moreover, purity of more than 99.98 wt % Au. The mass of additive Ca is less than the value of total amount of additive Eu and additive La, and the mass of additive Y is less than the value of the total amount of additive Ca and additive Eu, and the mass of Mg is 20-40 wt ppm.
    Type: Application
    Filed: October 15, 2008
    Publication date: December 16, 2010
    Applicant: TANAKA DENSHI KOGYO K. K.
    Inventors: Mitsuo Takada, Satoshi Teshima, Takeshi Kuwahara
  • Publication number: 20100226816
    Abstract: There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).
    Type: Application
    Filed: June 23, 2008
    Publication date: September 9, 2010
    Applicant: TANAKA DENSHI KOGYO K.K.
    Inventors: Mitsuo Takada, Satoshi Teshima, Takeshi Kuwahara
  • Patent number: 4636596
    Abstract: A power switch for a battery is disclosed, which includes a battery-receiving chamber having anodic and cathodic contacts for the battery, an aperture provided centrally in the anodic contact, and a switching mechanism having a protrusion which is movable through the aperture relative to the anode of the battery. The switching device comprises an on-off switch which is positioned within the battery receiving case to minimize damage to the switch. The switch operates by moving the anode of a battery towards and away from a contact to make or break a series circuit between a plurality of batteries located in the battery-receiving chamber. Movement of the anode in an axial direction is effected by axial movement of a protuberance on the switching device.
    Type: Grant
    Filed: September 11, 1985
    Date of Patent: January 13, 1987
    Assignee: Nikko Co., Ltd.
    Inventor: Mitsuo Takada