Patents by Inventor Mitsuo Yanagisawa

Mitsuo Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8029152
    Abstract: A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: October 4, 2011
    Assignee: Kyocera Corporation
    Inventors: Fumiaki Sekine, Daisuke Sakumoto, Yuki Mori, Mitsuo Yanagisawa, Shingo Matsuura
  • Patent number: 7994528
    Abstract: A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: August 9, 2011
    Assignee: KYOCERA Corporation
    Inventors: Shingo Matsuura, Mitsuo Yanagisawa, Daisuke Sakumoto
  • Patent number: 7943953
    Abstract: To provide a light emitting device and a light emitting module which can suppress deterioration caused by light emitted from a light emitting chip, even in the case of using a light emitting chip emitted light of which has a short wavelength and in which deterioration of emission brightness and the like does not easily occur even if used for a long period of time. The device is characterized by including a container (20) which is formed of a transparent inorganic material and has a recessed opening, a light emitting chip (1) which is disposed in the recessed opening of the container (20) with a glass bonding member (4) interposed therebetween and in which a first conduction type layer (11), a light emitting layer (12), and a second conduction layer (13) are formed on a substrate (10), and a lid (21) which is formed of a transparent inorganic material and blocks the recessed opening of the container.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: May 17, 2011
    Assignee: Kyocera Corporation
    Inventors: Daisuke Sakamoto, Mitsuo Yanagisawa
  • Publication number: 20090296367
    Abstract: A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.
    Type: Application
    Filed: March 23, 2006
    Publication date: December 3, 2009
    Applicant: KYOCERA CORPORATION
    Inventors: Fumiaki Sekine, Daisuke Sakumoto, Yuki Mori, Mitsuo Yanagisawa, Shingo Matsuura
  • Publication number: 20090224273
    Abstract: [Problems] To provide a light emitting device and a light emitting module which can suppress deterioration caused by light emitted from a light emitting chip, even in the case of using a light emitting chip emitted light of which has a short wavelength and in which deterioration of emission brightness and the like does not easily occur even if used for a long period of time. [Means for Solving Problems] The device is characterized by including a container (20) which is formed of a transparent inorganic material and has a recessed opening, a light emitting chip (1) which is disposed in the recessed opening of the container (20) with a glass bonding member (4) interposed therebetween and in which a first conduction type layer (11), a light emitting layer (12), and a second conduction layer (13) are formed on a substrate (10), and a lid (21) which is formed of a transparent inorganic material and blocks the recessed opening of the container.
    Type: Application
    Filed: January 31, 2007
    Publication date: September 10, 2009
    Applicant: KYOCERA CORPORATION
    Inventors: Daisuke Sakamoto, Mitsuo Yanagisawa
  • Publication number: 20090152580
    Abstract: A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.
    Type: Application
    Filed: March 27, 2008
    Publication date: June 18, 2009
    Applicant: KYOCERA Corporation
    Inventors: Shingo Matsuura, Mitsuo Yanagisawa, Daisuke Sakumoto
  • Publication number: 20050133808
    Abstract: A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 ?m.
    Type: Application
    Filed: October 29, 2004
    Publication date: June 23, 2005
    Inventors: Mitsugu Uraya, Daisuke Sakumoto, Akira Miyake, Fumiaki Sekine, Yuki Mori, Mitsuo Yanagisawa, Hiroshi Shibayama, Shingo Matsuura
  • Patent number: 6426591
    Abstract: A package for housing a photosemiconductor element comprises a substrate having a mounting portion on a top surface of which a photosemiconductor element is mounted, a frame attached onto the substrate to surround the mounting portion and having a through hole on a side thereof, a cylindrical fixing member attached around the through hole of the frame and having a space therein for transmitting an optical signal, a light transmitting member attached to the cylindrical fixing member, for clogging the inside of the fixing member and a lid attached onto a top surface of the frame, hermetically sealing the photosemiconductor element. The fixing member is made of an alloy of from 40 to 60 wt % iron and from 40 to 60 wt % nickel. The coefficient of thermal expansion of the fixing member is about 9.5×10−6/° C. (room temperature to 400° C.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: July 30, 2002
    Assignee: Kyocera Corporation
    Inventors: Mitsuo Yanagisawa, Hisaki Masuda
  • Patent number: 6036375
    Abstract: The invention relates to an optical semiconductor device housing package comprising a base having a mounting portion on an upper surface of which an optical semiconductor device is mounted; a frame attached to the base so as to encircle the mounting portion, the frame having a through-hole in one side thereof; a cylindrically shaped fixing member into which an optical fiber is inserted, the cylindrically shaped fixing member being fixed to the through-hole of the frame; a light-transmitting member attached to one end portion of the fixing member; and a lid member mounted on an upper face of the frame, for hermetically sealing the optical semiconductor device, wherein the light-transmitting member is formed of amorphous glass.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: March 14, 2000
    Assignee: Kyocera Corporation
    Inventors: Mitsuo Yanagisawa, Kenichi Ura, Satoru Tomie
  • Patent number: 5895873
    Abstract: A snare drum design attaches snare string(s) in a manner to protect the snare string(s) from damage at the snare gate. More particularly, the snare drum design prolongs the useful life of snare strings by providing a friction resistance member along an inner periphery of a snare gate formed in the snare rim.
    Type: Grant
    Filed: April 22, 1997
    Date of Patent: April 20, 1999
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: 5881981
    Abstract: A spring formed of an elastomeric body suitable to isolate vibrations transmitted from a support structure. A recess is formed in one end of the body to retain a portion of the supporting structure. A second end is adapted to be placed on an underlying surface such that the spring is disposed between the underlying surface and the support structure. A channel or hollow portion extends through the body to allow the second end to deform and thereby isolate vibrations from the underlying surface. The spring is particularly useful in isolating vibrations generated from a musical drum.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: March 16, 1999
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: 5726370
    Abstract: The hoop clamping system for bass drum assemblies features an assembly attached to the foot pedal's floor plate into which the handle bolt is attached and made easily accessible from the side of the pedal. The toe clamp is activated by a pivoting cam, one end of which is under the heel of the toe clamp; the other in contact with the handle bolt. Turning the handle bolt causes the cam to lift or lower the heel of the toe clamp resulting in the desired clamping action. This hoop clamp system provides greater range of travel for the foot board, and substantially improves accessibility to the handle bolt for ease of adjusting the toe clamp. This hoop clamping system further reduces unwanted vibration and lowers manufacturing costs.
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: March 10, 1998
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: 5684257
    Abstract: An improved strainer that has click stops in between the fully on and fully off settings allowing the artist to instantly change the tension of the snares by simply moving the lever to the desired click stop. Without having to manipulate the cumbersome tension knob, the artist is free to instantly choose between relatively loose, medium and tight settings of the snares.
    Type: Grant
    Filed: December 8, 1995
    Date of Patent: November 4, 1997
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: 5610351
    Abstract: A multi-task beater head having multiple striking surfaces for producing a variety of attack sounds, wherein the beater head may be adjusted or oriented in a convenient manner to achieve the desired attack sound. The drum beater incorporates a shaft that clamps into a receptor of a bass drum pedal, and a striker head that attaches to the other end of the shaft. The improved bass drum beater is molded from a hard plastic-type material or the like, and features a cube-like head with flat top and bottom surfaces and four faces, each with uniquely oriented convex shaped surfaces. The beater can be rotated by loosening the receptor of the bass drum pedal so that any of the plurality of surfaces is in position to strike the drum head. Thus, the percussionist can achieve a plurality of distinctly different bass drum sounds by choosing the appropriate surface.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: March 11, 1997
    Assignee: Pearl Musical Instrument, Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: 5574237
    Abstract: An improved foot pedal features a moveable heel piece and footboard with fore and aft motion along the pedal's base plate. By sliding the heel piece and footboard, the position of the top of the footboard can be changed in relation to the position of the pedal's wheel section, in turn changing the pulling direction of the chain which links the top of the footboard with the wheel section. By altering the pulling direction of the chain, the feel and action of the pedal is made relatively lighter or heavier allowing the drummer to customize the performance characteristics of the pedal beyond the typical range of the pedal adjustments.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: November 12, 1996
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: 4928566
    Abstract: A pair of tension bolts for applying tension to a pair of drum heads are screwed individually into nuts. These nuts are held individually by means of a pair of lug bodies which are fixed to a drum shell. The lug bodies, which are formed by die casting, are connected to each other by means of a connecting member. The connecting member, which has a uniform cross-sectional shape throughout its length, is formed by pressing a metal plate with a predetermined length, or by cutting a metal pipe into a predetermined length. Two opposite end portions of the connecting member are fitted individually in openings at the respective end portions of the lug bodies. A hole is formed in each end portion of the connecting member. The lug bodies and the connecting member are connected so that projections on the lug bodies are fitted individually in the holes of the connecting member.
    Type: Grant
    Filed: May 15, 1989
    Date of Patent: May 29, 1990
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: D310537
    Type: Grant
    Filed: April 22, 1988
    Date of Patent: September 11, 1990
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: D310538
    Type: Grant
    Filed: April 22, 1988
    Date of Patent: September 11, 1990
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: D311203
    Type: Grant
    Filed: April 22, 1988
    Date of Patent: October 9, 1990
    Assignee: Pearl Musical Instrument Co.
    Inventor: Mitsuo Yanagisawa
  • Patent number: D353612
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: December 20, 1994
    Assignee: Pearl Musical Instrument Company
    Inventor: Mitsuo Yanagisawa