Abstract: An oxychloride phosphor of the present disclosure includes divalent Eu arranged as an augmenting agent, at part of locations. The locations correspond to site of at least two kinds of predetermined substances included in a host crystal. A rate of the number of the divalent Eu with respect to the sum of the number of moles of the predetermined substance and the number of moles of the divalent Eu is less than 2%. When the predetermined substance is represented by A, the oxychloride phosphor is represented by a general formula of xAO.yEuO.SiO2.zCl. In this formula, A represents Sr and Ca, or Sr, Ca, and Mg, y indicates a value of not less than 0.002 and not more than 0.02, x+y indicates a value of more than 1.00 and not more than 1.30, and z indicates a value of not less than 0.20 and not more than 0.70.

Abstract: A phosphor material according to an embodiment of the present disclosure contains a major component represented by the formula A2-v-w-x-yBvLnwEuxSmyM2-zDzO8, where A is one or more elements selected from the group consisting of alkaline-earth metal elements; B is one or more elements selected from the group consisting of alkali metal elements; Ln is one or more elements selected from the group consisting of rare-earth elements other than Eu and Sm; M is one or more elements selected from the group consisting of W and Mo; D is one or more elements selected from the group consisting of Nb and Ta; and v, w, x, y, and z satisfy the inequalities 0?v?0.5, 0.15?x+y?0.7, 0?y?0.05, and 0<z?1.7 and the equation w+x+y=v+z.

Abstract: The present invention provides a wavelength conversion board comprising a substrate; one or more fluorescence members each containing a fluorescence substance for converting excitation light into fluorescence, the fluorescence member being disposed on or above the substrate; and a flexible gel disposed around the fluorescence member. The present invention also provides a wavelength conversion board comprising a substrate; a fluorescence member containing fluorescence substance for converting excitation light into fluorescence, the fluorescence member being disposed on or above the substrate; a fluent material disposed around the fluorescence member; a light-transmissive plate parallel to the substrate; and a sealing member disposed around the fluent material in a cross section of the wavelength conversion board. The fluorescence member is interposed between the light-transmissive plate and the substrate in the cross section of the wavelength conversion board.

Abstract: A light source device is provided. The light source device comprises a semiconductor light-emitting element; and a wavelength conversion member for converting a wavelength of a light emitted from the semiconductor light-emitting element. The semiconductor light-emitting element has a light-emitting peak wavelength of not less than 380 nanometers and not more than 420 nanometers. The light emitted from the semiconductor light-emitting element has a light energy density of not less than 0.2 kW/cm2. The wavelength conversion member contains at least one fluorescent substance selected from the group consisting of a (Sr1-x,Bax)3MgSi2O8:Eu2+ (0?x?1) fluorescent substance, a (Y1-y,Gdy)3(Al1-z,Gaz)5O12:Ce3+ (0?y<1, 0?z<1) fluorescent substance, and an Eu3+-activated fluorescent substance. The light source device has a high output and a high light-emitting efficiency.

Abstract: The present invention provides an oxynitride silicate fluorescent substance capable of output a light having a high luminance even when irradiated by an exciting light having a high energy density. The present invention is a yellow fluorescent substance represented by a chemical formula (Ba1-x-y-z,Srx)aSibOcNd:Eu2+y,Y3+z (0.9?a?1.1, 1.9?b?2.1, 1.9?c?2.1, 1.9?d?2.1, 0?x?1, 0<y<0.01, and 0?z<0.01).

Abstract: The present disclosure provides a (Ba1?z,Srz)3MgSi2O8:Eu2+ based phosphor with high emission quantum efficiency. Specifically, the present disclosure provides a blue light emitting phosphor including: a (Ba1?z,Srz)3MgSi2O8 based crystal where z satisfies 0?z<1 and a (Ba1?z,Srz)MgSiO4 based crystal where z satisfies 0?z<1 as a host crystal; and Eu2+ as a luminescent center.

Abstract: An embodiment of a probe card comprising: a probe base plate including a ceramic base plate and a plurality of conductive paths; and a plurality of contacts disposed on one face of the probe base plate and electrically connected to the conductive paths. The ceramic base plate may be provided with: a plurality of first layers having a heating element which generates heat by electric power and disposed at intervals in the thickness direction of the ceramic base plate; second layers each interposed between adjoining first layers; and a power supply path for supplying electric power for heating to the heating element.

Abstract: An embodiment of a probe card comprising: a probe base plate including a ceramic base plate and a plurality of conductive paths; and a plurality of contacts disposed on one face of the probe base plate and electrically connected to the conductive paths. The ceramic base plate may be provided with: a plurality of first layers having a heating element which generates heat by electric power and disposed at intervals in the thickness direction of the ceramic base plate; second layers each interposed between adjoining first layers; and a power supply path for supplying electric power for heating to the heating element.

Abstract: A large scale integrated circuit package is described wherein insulating layers of an organic material are provided between wiring layers to reduce the characteristic impedance of signal wiring. To avoid deformation of the organic insulating layers and subsequent damage to wiring layers, leads for connecting the circuits of an integrated circuit chip to electrode pads are mechanically connected to the electrode pads on an upper layer of organic insulating material by a gold-tin eutectic alloy.

Abstract: A mounting structure for a chip has a substrate having electrodes on an upper surface, terminals on a lower surface, and wirings to connect the electrodes and the terminals inside the substrate, pins on the upper surface of the substrate, and an integrated circuit chip with flexible lead terminals, which are interconnected to the electrodes, around a lower surface, and a heat radiation plate having openings in which the pins are received in one-to-one correspondence. The plate makes contact with an upper surface of the chip by a good heat-conductive material and is fixed to the pins by an adhesive. The substrate may be a multilayer ceramic section having wirings whose major component is gold; the ceramic section may be made of an inorganic composition which can be sintered in air at a temperature of less than 1400.degree. C.