Patents by Inventor Mitsuteru Mutsuda

Mitsuteru Mutsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11859058
    Abstract: Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: January 2, 2024
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Hiroaki Arita
  • Publication number: 20230241816
    Abstract: Prepared is a laminate including: a first layer formed of a first resin composition containing a first resin; and a second layer formed of a second resin composition containing a second resin, the first layer and the second layer being in contact with each other and integrated. The first resin includes an alicyclic polyamide resin having 20 mmol/kg or greater of amino groups, and the second resin includes an acid-modified (meth)acrylic resin. The second resin may have 100 mmol/kg or greater of carboxyl groups. The acid-modified (meth)acrylic resin may be an acid-modified polymethylmethacrylate resin. An average thickness of the first layer may be 0.15 times or more of an average thickness of the second layer. The average thickness of the first layer may be 200 ?m or greater. When a weight is dropped onto the second layer side, the laminate may have a DuPont impact strength of 500 N/inch or greater. The laminate has excellent transparency, lightness, light resistance, and impact resistance.
    Type: Application
    Filed: June 9, 2021
    Publication date: August 3, 2023
    Applicant: Polyplastics-Evonik Corporation
    Inventors: Mitsuteru MUTSUDA, Toshihiko FUJINAKA, Daisuke FUJIKI, Yoshiki NAKAIE
  • Patent number: 11673162
    Abstract: The present invention provides a composite molded body in which a rubber layer in the form of a thin film is formed on a surface of a resin molded body and a production method therefor. According to an embodiment of the present invention, a liquid composition containing a rubber component such as a rubber latex and a peroxide is applied to a surface of a resin molded body such as a polyamide-based resin having an amino group, causing crosslinking to occur in an uncrosslinked rubber layer and forming a crosslinked rubber layer in the form of a thin film. When a co-crosslinking agent is used in combination, adhesion to the resin molded body can be improved even when the thickness of the crosslinked rubber layer is small.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: June 13, 2023
    Assignees: DAICEL-EVONIK LTD., NAKANO MANUFACTURING CO., LTD.
    Inventors: Mitsuteru Mutsuda, Masaru Kitada
  • Patent number: 11407864
    Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 9, 2022
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Takayuki Uno
  • Patent number: 11142613
    Abstract: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 ?m and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 ?m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: October 12, 2021
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Takayuki Uno
  • Publication number: 20210308719
    Abstract: The present invention provides a composite molded body in which a rubber layer in the form of a thin film is formed on a surface of a resin molded body and a production method therefor. According to an embodiment of the present invention, a liquid composition containing a rubber component such as a rubber latex and a peroxide is applied to a surface of a resin molded body such as a polyamide-based resin having an amino group, causing crosslinking to occur in an uncrosslinked rubber layer and forming a crosslinked rubber layer in the form of a thin film. When a co-crosslinking agent is used in combination, adhesion to the resin molded body can be improved even when the thickness of the crosslinked rubber layer is small.
    Type: Application
    Filed: August 8, 2019
    Publication date: October 7, 2021
    Applicants: DAICEL-EVONIK LTD., NAKANO MANUFACTURING CO., LTD.
    Inventors: Mitsuteru MUTSUDA, Masaru KITADA
  • Publication number: 20210222031
    Abstract: [Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.
    Type: Application
    Filed: December 18, 2020
    Publication date: July 22, 2021
    Applicant: Daicel-Evonik Ltd.
    Inventors: Mitsuteru MUTSUDA, Hirofumi IGUCHI, Toshiaki NAKAMURA
  • Patent number: 11066529
    Abstract: Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: July 20, 2021
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Hiroaki Arita
  • Publication number: 20210198541
    Abstract: Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C8-18 alkylene chain and has a melting point from 160 to 250° C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.
    Type: Application
    Filed: August 7, 2019
    Publication date: July 1, 2021
    Applicants: DAICEL-EVONIK LTD., HONDA MOTOR CO.,LTD.
    Inventors: Mitsuteru MUTSUDA, Hirofumi IGUCHI, Toshiaki NAKAMURA, Nao SATO, Mutsuo TEZUKA, Yasufumi NAKAJIMA
  • Patent number: 10750815
    Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: August 25, 2020
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Hiroaki Arita, Tomohiro Kawahara
  • Publication number: 20200207931
    Abstract: Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Application
    Filed: June 6, 2018
    Publication date: July 2, 2020
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Hiroaki ARITA
  • Publication number: 20200079916
    Abstract: Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Application
    Filed: June 6, 2018
    Publication date: March 12, 2020
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Hiroaki ARITA
  • Patent number: 10519338
    Abstract: A resin powder containing an aromatic polyetherketone resin (e.g., a polyetheretherketone) is deformed into a plate-like form, and the resulting powder is used as a resin powder for a coating material. The plate-like resin powder may have an average thickness of, for example, not more than 2 ?m. The coating material may contain a dispersing agent or may be dispersed in a dispersion medium, such as water. The coating material may particularly be used as a coating material for covering a metal substrate. The plate-like resin powder, which comprise an aromatic polyetherketone resin, allows formation of a coating layer which has a high adhesion to a substrate and in which the generation of pinholes is efficiently prevented or reduced.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: December 31, 2019
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Hirofumi Iguchi, Ryo Nakahama, Kimihiko Oya
  • Patent number: 10370509
    Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: August 6, 2019
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Takayuki Uno
  • Patent number: 10316181
    Abstract: In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin (C), the resin particle (B) comprises a spherical resin particle having an average particle diameter of 12 to 70 ?m. In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin, the resin particle (B) comprises (B1) a spherical small resin particle having a particle diameter less than an average fiber diameter of the reinforcing fiber (A) and (B2) a spherical large resin particle having a particle diameter not less than the average fiber diameter of the reinforcing fiber (A). The reinforcing fiber (A) may particularly comprise a carbon fiber. The resin particle (B) may particularly comprise a polyamide resin particle. The resin particle (B) may have an average particle diameter of 1 to 10 times as large as the average fiber diameter of the reinforcing fiber (A).
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: June 11, 2019
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Thomas Grosse-Puppendahal
  • Publication number: 20190161587
    Abstract: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 ?m and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 ?m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).
    Type: Application
    Filed: April 10, 2017
    Publication date: May 30, 2019
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
  • Patent number: 10246586
    Abstract: Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: April 2, 2019
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Tatsuki Akashi, Mitsuteru Mutsuda
  • Publication number: 20190048153
    Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.
    Type: Application
    Filed: September 27, 2018
    Publication date: February 14, 2019
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
  • Publication number: 20180258240
    Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.
    Type: Application
    Filed: October 5, 2016
    Publication date: September 13, 2018
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
  • Patent number: 9644080
    Abstract: Provided is an additive that increases or improves a light resistance (or whiteness) of a non-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin and an inorganic white pigment (e.g., titanium oxide). The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: May 9, 2017
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Tatsuki Akashi, Mitsuteru Mutsuda