Abstract: A waterjet nozzle is provided for deflashing a leadless package device. The waterjet nozzle has a central core having a conically shaped passage between a nozzle inlet, lying in a first plane, and a nozzle outlet, lying in a second plane. The nozzle includes a groove, in the waterjet nozzle, above a third plane defining an end of the waterjet nozzle, along a first line in the third plane. A tube connects the nozzle outlet to the groove. The nozzle includes a flange, lying below the third plane along a second line, in the third plane, intersecting the first line. The waterjet nozzle may be used to deflash a leadframe package by inserting the flange from a waterjet nozzle into a singulation cut on a lead frame; and injecting a waterjet through the conically-shaped passage from the nozzle inlet through the nozzle outlet.

Abstract: A waterjet nozzle is provided for deflashing a leadless package device. The waterjet nozzle has a central core having a conically shaped passage between a nozzle inlet, lying in a first plane, and a nozzle outlet, lying in a second plane. The nozzle includes a groove, in the waterjet nozzle, above a third plane defining an end of the waterjet nozzle, along a first line in the third plane. A tube connects the nozzle outlet to the groove. The nozzle includes a flange, lying below the third plane along a second line, in the third plane, intersecting the first line. The waterjet nozzle may be used to deflash a leadframe package by inserting the flange from a waterjet nozzle into a singulation cut on a lead frame; and injecting a waterjet through the conically-shaped passage from the nozzle inlet through the nozzle outlet.

Abstract: A packaged semiconductor device (100) has a first (110) and a second (111) side, the second side including a plurality of metal terminals (120) extending to the first side. Each terminal includes an oblong groove (122) extending to the first side and ending in an orifice (123) at the first side. The terminals are made of a base metal and may have a solder-wettable surface except for the terminal surface (121) exposed at the first device side.

Abstract: According to an embodiment of the invention, a semiconductor package has been provided that includes a die, a first lead pad, a second lead pad, a circuit component, a first wire bond, and a second wire bond. The die is supported on a die pad. The circuit component has a first end and a second end. The first end is communicatively coupled to the first lead pad and the second end is communicatively coupled to the second lead pad. The first wire bond is communicatively coupled to the die and the first lead pad and provides a communication path between the die and the first end of the circuit component through the first lead pad. The second wire bond is communicatively coupled to the die and the second lead pad and provides a communication path between the die and the second end of the circuit component through the second lead pad.