Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

Abstract: A production method for a micromechanical sensor apparatus. The method includes: providing a bonded wafer stack comprising an ASIC wafer and a MEMS wafer, the ASIC wafer including ASIC switching devices and the MEMS wafer including MEMS sensor devices, an ASIC switching device and a corresponding MEMS sensor device are arranged one above the other such that they form a respective micromechanical sensor apparatus in the bonded wafer stack; providing a first packaging wafer having first front and rear faces; in the first rear face, the first packaging wafer has blind holes assigned to corresponding sensor detection regions of a respective MEMS sensor device; bonding the first rear face to the wafer stack such that the blind holes are each in fluid connection with the corresponding sensor detection region; backthinning, on the first front face, the first packaging wafer bonded to the wafer stack to expose the blind holes.

Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.

Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.

Abstract: A microelectromechanical transducer includes: a semiconductor body, having a first surface and a second surface opposite to one another; a first structural body, coupled to the first surface of the semiconductor body; a first sealed cavity between the semiconductor body and the first structural body; and an active area housed in the first sealed cavity, including at least two trenches and a sensor element between the trenches. The trenches extend along a vertical direction from the first surface towards the second surface of the semiconductor body.

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.

Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.

Abstract: A microelectromechanical transducer includes: a semiconductor body, having a first surface and a second surface opposite to one another; a first structural body, coupled to the first surface of the semiconductor body; a first sealed cavity between the semiconductor body and the first structural body; and an active area housed in the first sealed cavity, including at least two trenches and a sensor element between the trenches. The trenches extend along a vertical direction from the first surface towards the second surface of the semiconductor body.

Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.

Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.