Patents by Inventor Mohd Kahar Bajuri

Mohd Kahar Bajuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105564
    Abstract: A semiconductor package includes: a semiconductor die attached to a leadframe and having a first bond pad at a side of the semiconductor die facing away from the leadframe; a metal clip having a first bonding region attached to the first bond pad of the semiconductor die by a plurality of first wire bonds which extend through a plurality of first openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die; and a joint between the plurality of first wire bonds and the metal clip at a side of the metal clip facing away from the semiconductor die. Additional semiconductor package embodiments and related methods of manufacture are also described.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Inventors: Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew
  • Patent number: 11842953
    Abstract: A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality of first wire bonds to the first bond pad of the semiconductor die through a plurality of openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die. Additional methods and related semiconductor packages produced from such methods are also described.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: December 12, 2023
    Assignee: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew
  • Patent number: 11705387
    Abstract: A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: July 18, 2023
    Assignee: Infineon Technologies AG
    Inventors: Emil Lamco Jocson, Mohd Kahar Bajuri, Ryan Tordillo Comadre
  • Publication number: 20220352056
    Abstract: A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality of first wire bonds to the first bond pad of the semiconductor die through a plurality of openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die. Additional methods and related semiconductor packages produced from such methods are also described.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 3, 2022
    Inventors: Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew
  • Publication number: 20220068770
    Abstract: A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 3, 2022
    Inventors: Emil Lamco Jocson, Mohd Kahar Bajuri, Ryan Tordillo Comadre
  • Patent number: 11211353
    Abstract: A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: December 28, 2021
    Assignee: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Abdul Rahman Mohamed, Siang Kuan Chua, Ke Yan Tean
  • Publication number: 20210013171
    Abstract: A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Applicant: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Abdul Rahman Mohamed, Siang Kuan Chua, Ke Yan Tean
  • Patent number: 10083899
    Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: September 25, 2018
    Assignee: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee, Norbert Joson Santos, Chiew Li Tai, Chin Wei Yang
  • Publication number: 20180211907
    Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.
    Type: Application
    Filed: January 23, 2017
    Publication date: July 26, 2018
    Inventors: Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Teck Sim Lee, Norbert Joson Santos, Chiew Li Tai, Chin Wei Yang