Patents by Inventor Mohinder Singh Bhatti

Mohinder Singh Bhatti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8210246
    Abstract: A heat exchanger assembly includes a pair of outer headers each defining an outer cavity and a pair of inner headers each defining an inner cavity. Each inner header is disposed in one of the outer headers, and each header defines a plurality of header slots. A plurality of first fluid tubes extend between the outer headers from one of the header slots of each outer header to fluidly interconnect the outer cavities defined by the outer headers and a plurality of second fluid tubes are interleaved with the first refrigerant tubes and extend between the outer headers and through one of the header slots of each outer header and through the associated outer cavities defined by the outer headers and to the one of the header slots of each inner header to fluidly interconnect the inner cavities defined by the inner headers.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: July 3, 2012
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Mark James Zima, Prasad Shripad Kadle
  • Patent number: 7934540
    Abstract: An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: May 3, 2011
    Assignee: Delphi Technologies, Inc.
    Inventors: Shrikant Mukund Joshi, Mohinder Singh Bhatti, Ilya Reyzin
  • Patent number: 7770632
    Abstract: The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: August 10, 2010
    Assignee: Coolit Systems, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, James Alan Bright, Stephen Michael Vetter, Shrikant Mukund Joshi
  • Patent number: 7673468
    Abstract: A heat exchanger having a plurality of tubes that define refrigerant passages extending vertically from a lower end to an upper end. A bottom header is in fluid communication with the passage at the lower end of the tube, and a top header is in fluid communication with the passage at the upper end of the tube. A plurality of plates extends rearwardly from the tubes to a distal edge. Adjacent plates extending from adjacent tubes are closed off at the distal edges by a connector, and adjacent plates extending from the same tube have a rear opening between the distal edges for receiving air into the assembly. A plurality of orifices is disposed along the plates to allow air from the rear opening to flow downstream between the tubes. A water tank and wicking material are provided for wetting the plates.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: March 9, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Publication number: 20100043230
    Abstract: A method of manufacturing a metal-plastic hybrid heat exchanger including the steps of providing a plurality of metallic fins, providing a plastic tank with a melting point above a predetermined temperature and having a header plate that includes a plurality slots, and providing a plurality of plastic tubes with a melting point above the predetermined temperature. The plastic tubes are inserted into the corresponding slots of the plastic tank to form an assembly. The metal fins are inserted between the plastic tubes of the assembly. A thermoplastic adhesive is applied onto the mating surfaces of the metal fins and the plastic tubes, and onto mating surfaces of the slots and the plastic tubes of the assembly. The metal plastic heat exchanger assembly is then heated with infrared radiation to the predetermined temperature to cure the thermoplastic adhesive, thereby bonding the metal fins and the slotted headers to the tubes.
    Type: Application
    Filed: December 16, 2008
    Publication date: February 25, 2010
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventor: Mohinder Singh Bhatti
  • Patent number: 7665511
    Abstract: The invention provides a heat exchanger assembly having a housing which defines a boiling chamber extending along an axis between opposite ends. A plurality of first condensing tubes extend axially and downwardly in one direction at a first predetermined angle to and below the axis (A) from the housing and a plurality of second condensing tubes extend axially and upwardly in the opposite direction at the same predetermined angle to and above the axis (A) from the housing. The volume of refrigerant in the housing is greater than the volume of the second condensing tubes and the volume of the boiling chamber.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: February 23, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Publication number: 20100031507
    Abstract: A manifold assembly for a heat exchanger is manufactured and assembled by separately molding a tank portion and a header portion, and assembling the tank and header portions together by positioning them relative to each other and injecting a sealing substance in a cavity that is formed when the portions are so positioned. Ribs are incorporated in the tank and header portions to increase the interface area between the molded portions and the sealing substance, to achieve a mechanically sound, leak proof assembly without using gaskets or fasteners.
    Type: Application
    Filed: August 5, 2008
    Publication date: February 11, 2010
    Inventors: Suresh Deepchand Shah, Mohinder Singh Bhatti, Karl Paul Kroetsch, Gary Christopher Victor
  • Patent number: 7658084
    Abstract: A refrigeration assembly includes a pair of refrigerated chambers defined within a working chamber. The refrigerated chambers include channel walls extending parallel to one another and spaced apart, and first and second panels extending channel walls to define a working channel for separating the working chamber into sub-chambers. Apertures defined in the panels allow airflow from the sub-chambers into the working channel, and a supply of water wets the panels and a first section of the refrigerated chambers. Air enters the sub-chambers and flows over the first sections of the refrigerated chambers for direct evaporative cooling. A portion of the air bleeds through the apertures and evaporates water from the panels prior to flowing over the second sections of the refrigerated chambers for indirect evaporative cooling.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: February 9, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin
  • Patent number: 7654307
    Abstract: An automotive air conditioning system is disclosed comprising an evaporative cooler in series with the conventional vapor compression system. The evaporative cooler comprises an array of dry channels and a contiguous array of wet channels. The primary air stream to be conditioned by the evaporator of the conventional air conditioning system is preconditioned by the evaporative cooler by lowering its dry bulb temperature without changing its absolute humidity. An evaporator core is supported downstream of the evaporative cooler for receiving the primary air from the dry channels and thereby produces liquid condensate. The system is distinguished by conducting the liquid condensate from the evaporator core to the wicking tank for use in the wet channels of the evaporative cooler.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: February 2, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Kurt Dale Hollasch
  • Patent number: 7650928
    Abstract: A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: January 26, 2010
    Assignee: Coolit Systems Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, David P Rusch, Shrikant Mukund Joshi
  • Patent number: 7650757
    Abstract: A thermoelectric heat transfer system is provided. The thermoelectric heat transfer system comprises a coolant circuit with a pump circulating coolant through the circuit. A first heat exchanger is in fluid communication with the coolant circuit to remove heat from the coolant. At the same time, a second heat exchanger is in fluid communication with the coolant circuit. Thermoelectric modules (TEMs) are integrated into the second heat exchanger to create a temperature differential between fins and conduits of the second heat exchanger. The coolant flows through the conduits to draw heat from the TEMs, while a fan assembly conveys air through the fins into a climate-controlled area to cool the climate-controlled area to a desired temperature. In other embodiments, a sleeve acts as the second heat exchanger. The sleeve is adapted to receive and cool beverage containers and like items.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: January 26, 2010
    Assignee: Delphi Technologies, Inc.
    Inventor: Mohinder Singh Bhatti
  • Patent number: 7644983
    Abstract: An evaporatively pre-cooled seat assembly comprising a seat cushion, an auxiliary cooler, and an evaporative cooler. The evaporative cooler includes a plurality of parallel tubular dry channels and a plurality of tubular wet channels. The dry channels and wet channels are arranged such that they alternate from dry channel to wet channel from channel to channel. Each of the channels is defined by two parallel side walls, a top, and a bottom. A first plurality of dry channels defines a plurality of apertures in the side walls thereof for conveying air out of the respective dry channel and into an adjacent wet channel. A second plurality of dry channels alternates with the first plurality and is disposed between two wet channels and defines a plurality of cooler apertures in the tops thereof for conveying cooled air out of the second plurality of alternating dry channels and to the auxiliary cooler.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: January 12, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Edward Wolfe, IV, Prasad Shripad Kadle, Ilya Reyzin, Mohinder Singh Bhatti
  • Patent number: 7644753
    Abstract: Three embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1-2, 3 and 4 and each comprises a flange, a dome, a plurality of condensing tubes, a shroud, and a boiler plate. In the first embodiment shown in FIG. 1, the dome is semi-spherical in shape and the distance measured axially along the center axis equals the distance measured laterally from or perpendicular to the center axis. In the second and third embodiments shown in FIGS. 3 and, 4, respectively, the distance measured axially along the center axis is greater than the distance measured laterally from or perpendicular to the center axis. The domes in the second and third embodiments are an ellipsoid and a semi-logarithmic body, respectively. In all embodiments, a plurality of condensing tubes aligned in fan rows and arced rows extend from the dome to distal ends to facilitate more-efficient heat transfer.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: January 12, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti
  • Patent number: 7604040
    Abstract: A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling housing from the lower portion. A heat rejecter is disposed on and above the upper wall of the cooling housing with a first header extending from and in fluid communication with the liquid coolant outlet. A second header extends upwardly from a rejecter outlet. A plurality of first tubes extend between and in fluid communication with the first header and the second header with a plurality of first air fins disposed between the upper wall and the first tubes. A single unit defines both the cooling housing and the air cooled heat rejecter to thereby allow the manufacture of the unit in a single process with the attendant reduction in shipping, handling and installation.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: October 20, 2009
    Assignee: Coolit Systems Inc.
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti
  • Patent number: 7597135
    Abstract: Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG. 1, the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG. 3, the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: October 6, 2009
    Assignee: Coolit Systems Inc.
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti
  • Publication number: 20090229800
    Abstract: A heat exchanger assembly includes a pair of outer headers each defining an outer cavity and a pair of inner headers each defining an inner cavity. Each inner header is disposed in one of the outer headers, and each header defines a plurality of header slots. A plurality of first fluid tubes extend between the outer headers from one of the header slots of each outer header to fluidly interconnect the outer cavities defined by the outer headers and a plurality of second fluid tubes are interleaved with the first refrigerant tubes and extend between the outer headers and through one of the header slots of each outer header and through the associated outer cavities defined by the outer headers and to the one of the header slots of each inner header to fluidly interconnect the inner cavities defined by the inner headers.
    Type: Application
    Filed: March 11, 2008
    Publication date: September 17, 2009
    Inventors: Mohinder Singh Bhatti, Mark James Zima, Prasad Shripad Kadle
  • Publication number: 20090223803
    Abstract: The invention provides an assembly for desalinating water comprising a cold air duct open to the dry channels of the evaporative cooler and extending around a humidification chamber disposed between the evaporative cooler and the condenser. The invention provides for a film valve including a flexible sheet intersecting the cold air duct for controlling air flow along the cold air duct to the condenser. The film valve allows for a fraction, or all of the cool air in the cold air duct to be utilized for comfort cooling.
    Type: Application
    Filed: March 5, 2008
    Publication date: September 10, 2009
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi, John Benoit
  • Publication number: 20090178426
    Abstract: An evaporative heat exchanger for cooling a hot refrigerant having a core of alternatively stacked dry and wet plates. Each dry plate includes a dry side defining a plurality of dry channels in a first direction, a series of ports distributed along the dry channels, a wet side, and a refrigerant cooling section. Each wet plate includes a wet side adjacent to and cooperates with the wet side of the dry plate to define a plurality of wet channels in a second direction. The dry channels, ports, and wet channels define a labyrinth for the air flow, which evaporates the liquid contained in the wet channels resulting in a cooling of the refrigerant. The refrigerant cooling section is integral with the outboard of the dry plate and adjacent to an end section of the wet channels to provide enhanced refrigerant cooling.
    Type: Application
    Filed: January 16, 2008
    Publication date: July 16, 2009
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Patent number: 7556088
    Abstract: A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: July 7, 2009
    Assignee: Coolit Systems, Inc.
    Inventors: Shrikant Mukund Joshi, Mohinder Singh Bhatti, Ilya Reyzin
  • Patent number: D613841
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: April 13, 2010
    Assignee: Delphi Technologies, Inc.
    Inventor: Mohinder Singh Bhatti