Patents by Inventor Mon Nan Ho
Mon Nan Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12048228Abstract: An image capture device including an image capture module and a display panel is provided. The display panel is disposed on the image capture module and includes multiple pixels. Each of the pixels includes a first light-emitting region and a second light-emitting region. The first light-emitting region emits a first light beam. The first light beam is transmitted to the image capture module through a region outside the first light-emitting region. In each of the pixels, a total area of the first light-emitting region is smaller than a total area of the second light-emitting region.Type: GrantFiled: June 2, 2021Date of Patent: July 23, 2024Assignee: Gingy Technology Inc.Inventors: Chung Hao Tseng, Mon-Nan Ho
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Patent number: 11783621Abstract: An optical fingerprint imaging device, including a substrate, an imaging module, at least one light emitting element, a light shielding element, a case, and a pressing substrate, is provided. The light shielding element is disposed between the imaging module and the light emitting element. The optical fingerprint imaging device satisfies conditional expressions, h?H?h+(R/tan(?/2)) and Ravg<S<5Ravg, where h is a height from a field angle origin of the imaging module to the substrate, H is a height of the light shielding element at a measurement position, R is a distance from a center of the imaging module to the measurement position, ? is an angle of a field angle of the imaging module, Ravg is an average value of distances from the center to measurement positions of the light shielding element, and S is a distance from the center to a center of the light emitting element.Type: GrantFiled: November 18, 2022Date of Patent: October 10, 2023Assignee: Gingy Technology Inc.Inventors: Ping-Chen Chen, Mon-Nan Ho, Chuan Min Lee, Chung Hao Tseng
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Publication number: 20220359624Abstract: An image capture device including an image capture module and a display panel is provided. The display panel is disposed on the image capture module and includes multiple pixels. Each of the pixels includes a first light-emitting region and a second light-emitting region. The first light-emitting region emits a first light beam. The first light beam is transmitted to the image capture module through a region outside the first light-emitting region. In each of the pixels, a total area of the first light-emitting region is smaller than a total area of the second light-emitting region.Type: ApplicationFiled: June 2, 2021Publication date: November 10, 2022Applicant: Gingy Technology Inc.Inventors: Chung Hao Tseng, Mon-Nan Ho
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Publication number: 20200381470Abstract: An image capture device including an image sensor and a light collimator is provided. The light collimator is located on the image sensor and includes a light channel layer, a plurality of micro lenses and a wall structure. The plurality of micro lenses are disposed on the light channel layer, and the plurality of micro lenses and the image sensor are located on opposite sides of the light channel layer, respectively. The wall structure is disposed on the light channel layer and located at a periphery of the plurality of micro lenses, wherein a height of the wall structure is greater than a height of each of the plurality of micro lenses.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Applicant: Gingy Technology Inc.Inventors: Mon-Nan Ho, Jen-Chieh Wu, Hao-Xiang Lin
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Publication number: 20150214416Abstract: A method of package for sensor chip includes the steps of: a) providing a sensor chip having a plurality of conducting contacts and a sensing area, b) using an adhesive to bond the sensor chip on a circuit substrate, c) mounting a dam between the sensing area and conducting contacts of the sensor chip, d) connecting metal conducting wires between the conducting contacts of the circuit substrate and the conducting contacts of the sensor chip, and e) molding a molding compound on the circuit substrate and the sensor chip to cover the metal conducting wires and the dam. Thus, the dam can buffer the impact of stress on the sensor chip during the step e). Further, an open type sensing space is defined after the step e), facilitating signal or status sensing and improving the sensor chip package yield rate.Type: ApplicationFiled: January 28, 2014Publication date: July 30, 2015Applicant: STACK DEVICES CORP.Inventors: Mon-Nan HO, Chien-Heng LIN, Ching-Shui CHENG, Po-Wen CHOU
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Patent number: 8847146Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.Type: GrantFiled: October 15, 2009Date of Patent: September 30, 2014Assignee: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nan Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Publication number: 20140170796Abstract: A image sensor packaging method includes the steps of: a) installing an image sensor chip in a circuit substrate and then covering a light transmissive cover on the image sensor chip over a sensing zone of the image sensor chip and then covering a passivation layer on the light transmissive cover, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, and d) removing the passivation layer. Thus, the light transmissive cover and the passivation layer protect the sensing zone of the image sensor chip and the light transmissive cover against contamination and damage, and therefore, this image sensor chip packaging method has high-yield performance.Type: ApplicationFiled: December 17, 2012Publication date: June 19, 2014Applicant: STACK DEVICES CORP.Inventors: Mon-Nan HO, Chien-Heng LIN, Ching-Shui CHENG, Po-Wen CHOU
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Publication number: 20140170797Abstract: A sensor chip protective image sensor packaging method includes the steps of a) installing an image sensor chip in a circuit substrate and then covering a passivation layer on a sensing zone of the image sensor chip, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, d) removing the passivation layer, and e) mounting a light transmissive cover in the encapsulation over the sensing zone of the image sensor chip. Thus, the passivation layer protects the sensing zone of the image sensor chip against contamination and damage prior before having been protected by the cover, and therefore, this image sensor chip packaging method has high-yield performance.Type: ApplicationFiled: December 17, 2012Publication date: June 19, 2014Applicant: Stack Devices Corp.Inventors: Mon-Nan HO, Chien-Heng LIN, Ching-Shui CHENG, Po-Wen CHOU
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Patent number: 8093674Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.Type: GrantFiled: October 22, 2009Date of Patent: January 10, 2012Assignee: Kingpak Technology, Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nan Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Publication number: 20110024610Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.Type: ApplicationFiled: October 15, 2009Publication date: February 3, 2011Applicant: Kingpak Technology Inc.Inventors: Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nan Ho, Chih-Cheng Hsu, Chin-Fu Lin, Chung-Hsien Hsin
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Patent number: 7554599Abstract: An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.Type: GrantFiled: March 2, 2006Date of Patent: June 30, 2009Assignee: Kingpak Technology, Inc.Inventors: Hsiu wen Tu, Mon nan Ho, Jason Chuang, Chen pin Peng, Chung hsien Hsin, Wei Chang
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Patent number: 7423334Abstract: An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.Type: GrantFiled: November 17, 2005Date of Patent: September 9, 2008Assignee: Kingpak Technology Inc.Inventors: Hsiu Wen Tu, Chen Pin Peng, Mon Nan Ho, Chung Hsien Hsin
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Publication number: 20080067334Abstract: An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.Type: ApplicationFiled: November 19, 2007Publication date: March 20, 2008Inventors: Jason Chuang, Mon Nan Ho, Hsiu Wen Tu, Chen Pin Peng, Chung Hsien Hsin, Wei Chang
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Publication number: 20070206109Abstract: An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.Type: ApplicationFiled: March 2, 2006Publication date: September 6, 2007Inventors: Hsiu wen Tu, Mon nan Ho, Jason Chuang, Chen pin Peng, Chung hsien Hsin, Wei Chang
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Patent number: 6737720Abstract: A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.Type: GrantFiled: January 23, 2001Date of Patent: May 18, 2004Inventors: Mon Nan Ho, Hsiu Wen Tu, Ching Shui Cheng, Li Huan Chen, Joe Liu, Jichen Wu, Wen Chuan Chen
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Patent number: 6627983Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.Type: GrantFiled: January 24, 2001Date of Patent: September 30, 2003Inventors: Hsiu Wen Tu, Wen Chuan Chen, Mon Nan Ho, Li Huan Chen, Nai Hua Yeh, Yen Cheng Huang, Yung Sheng Chiu, Jichen Wu, Joe Liu, Wu Hsiang Lee
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Patent number: 6590269Abstract: A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.Type: GrantFiled: April 1, 2002Date of Patent: July 8, 2003Assignee: Kingpak Technology Inc.Inventors: Jason Chuang, Allis Chen, Jachson Hsieh, Hsiu Wen Tu, Meng Ru Tsai, Mon Nan Ho, Fu Yung Huang, Yung Sheng Chiu, Jichen Wu, Chih Cheng Hsu
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Publication number: 20030116846Abstract: A stacked structure of a BGA (Ball Grid Array) integrated circuit package arranged on a printed circuit board includes a lower IC package body, an upper IC package body and glue. The lower IC package body has a first surface and a second surface opposite to the first surface. The first surface is formed with a plurality of first contacts for electrically connecting to the printed circuit board. The second surface is formed with a plurality of second contacts for electrically connecting to the upper IC package body. The upper IC package body is stacked above the lower IC package body and electrically connected to the second contacts on the second surface of the lower IC package body. The glue is provided between the lower IC package body and the upper IC package body for covering and protecting the plurality of second contacts.Type: ApplicationFiled: December 20, 2001Publication date: June 26, 2003Inventors: Nai Hua Yeh, Chen Pin Peng, Rong Fong Ding, Hsiu Wen Tu, Mon Nan Ho
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Publication number: 20030116817Abstract: The image sensor structure of the invention is used for electrically connecting to a printed circuit board. The image sensor structure includes a substrate, a projecting layer, an image sensing chip, a plurality of wires, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal output terminals for electrically connecting to the printed circuit board. The projecting layer has an upper surface and a lower surface. The lower surface is adhered to the second surface of the substrate to form a cavity with the substrate. The upper surface is formed with signal input terminals. The image sensing chip is placed within the cavity formed by the substrate and the projecting layer, and is adhered onto the second surface of the substrate. The plurality of wires each has a first terminal and a second terminal. The first terminals are electrically connected to the image sensing chip.Type: ApplicationFiled: December 20, 2001Publication date: June 26, 2003Inventors: Nai Hua Yeh, Chen Pin Peng, Jason Chuang, Hsiu Wen Tu, Kuang Yu Fan, Mon Nan Ho, Fu Yung Huang, Meng Ru Tsai, Allis Chen, Chih Hsien Chung, Chih Cheng Hsu, Yung Sheng Chiu
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Patent number: 6565008Abstract: A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.Type: GrantFiled: December 4, 2001Date of Patent: May 20, 2003Assignee: Kingpak Technology Inc.Inventors: Mon Nan Ho, Hsiu Wen Tu, Kuo Feng Feng, Yung Sheng Chiu, Joe Liu, Nai Hua Yeh, Wen Chuan Chen, Allis Chen