Patents by Inventor Motokazu Yamada
Motokazu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250056942Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.Type: ApplicationFiled: October 30, 2024Publication date: February 13, 2025Inventors: Motokazu YAMADA, Yuichi YAMADA, Shinsaku IKUTA, Takeshi TAMURA
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Publication number: 20250044641Abstract: A planar light source includes a reflective member. The reflective member defines at least one slit including at least one first slit arranged in a first region extending in a first direction and intersecting a first virtual straight line at a prescribed position in the first region. The first virtual straight line is parallel to the first direction.Type: ApplicationFiled: October 23, 2024Publication date: February 6, 2025Inventor: Motokazu YAMADA
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Publication number: 20240405171Abstract: A light-emitting device includes: a light-emitting element configured to emit first light; a light-transmissive member covering an upper surface of the light-emitting element and including a wavelength conversion material configured to absorb a portion of the first light and emit second light; a light-scattering member disposed on the light-transmissive member, including a light-scattering material, and having a higher reflectance at a peak wavelength of the first light than at a peak wavelength of the second light; and a light-adjustment member located in or on the light-scattering member and having either (i) a higher absorptance at the peak wavelength of the second light than at the peak wavelength of the first light, or (ii) a higher reflectance at the peak wavelength of the second light than at the peak wavelength of the first light. A lateral surface of the light-transmissive member is exposed from the light-scattering member and the light-adjustment member.Type: ApplicationFiled: May 14, 2024Publication date: December 5, 2024Applicant: NICHIA CORPORATIONInventor: Motokazu YAMADA
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Patent number: 12158659Abstract: A planar light source includes a substrate, a reflective member having a plurality of openings and at least one slit, and a light source disposed in each of the openings. The plurality of openings are arranged in m rows along a first direction and in n columns along a second direction that intersects the first direction. The at least one slit includes at least one first slit arranged in a first region and intersecting a first virtual straight line at a prescribed position in the first region. The first virtual straight line is parallel to the first direction. The first region is located between one or more openings in a kth row (k is an integer equal to or greater than 1 and less than or equal to m?1) and one or more openings in a (k+1)th row and extends in the first direction.Type: GrantFiled: August 21, 2023Date of Patent: December 3, 2024Assignee: NICHIA CORPORATIONInventor: Motokazu Yamada
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Patent number: 12148870Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.Type: GrantFiled: October 28, 2022Date of Patent: November 19, 2024Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Yuichi Yamada, Shinsaku Ikuta, Takeshi Tamura
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Publication number: 20240282758Abstract: A integrated light-emitting device includes: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.Type: ApplicationFiled: April 30, 2024Publication date: August 22, 2024Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Yuichi YAMADA
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Patent number: 11978725Abstract: A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.Type: GrantFiled: October 27, 2022Date of Patent: May 7, 2024Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Yuichi Yamada
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Publication number: 20240118572Abstract: A planar light source includes a substrate, light sources, and at least one partitioning member. The partitioning member includes first wall parts, second wall parts, and partitioned regions. The first wall parts define first ridges extending in a first direction. The second wall parts define second ridges extending in a second direction. The partitioned regions each is surrounded by the first ridges and the second ridges in a plan view. the partitioned regions are arranged in the first and second directions. At least one first cut is defined on at least one of the first ridges. At least one second cut is defined on at least one of the second ridges. The at least one first cut and the at least one second cut are spaced apart from each other. At least one of the light sources is arranged in a corresponding one of the partitioned regions.Type: ApplicationFiled: December 11, 2023Publication date: April 11, 2024Inventors: Koki SHIBAI, Yoshihiro SHO, Motokazu YAMADA, Naoya KASHIWAGI, Shimpei SASAOKA
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Publication number: 20240069380Abstract: A planar light source includes a substrate, a reflective member having a plurality of openings and at least one slit, and a light source disposed in each of the openings. The plurality of openings are arranged in m rows along a first direction and in n columns along a second direction that intersects the first direction. The at least one slit includes at least one first slit arranged in a first region and intersecting a first virtual straight line at a prescribed position in the first region. The first virtual straight line is parallel to the first direction. The first region is located between one or more openings in a kth row (k is an integer equal to or greater than 1 and less than or equal to m?1) and one or more openings in a (k+1)th row and extends in the first direction.Type: ApplicationFiled: August 21, 2023Publication date: February 29, 2024Inventor: Motokazu YAMADA
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Patent number: 11906156Abstract: A light emitting device includes: a mounting board; a light source positioned on the mounting board; a light diffusion plate; a diffuse reflector positioned between the mounting board and the light diffusion plate, and above at least part of an emission face of the light source; and a wavelength conversion layer positioned on or above the diffuse reflector.Type: GrantFiled: January 20, 2023Date of Patent: February 20, 2024Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Takeshi Tamura, Hiroshi Fujimori
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Patent number: 11892157Abstract: A light-emitting device includes a base member, a plurality of light sources on or above an upper surface of the base member, and a reflector that comprises a plurality of surrounding portions. Each of the plurality of surrounding portions surrounds a respective one of the plurality of light sources in a plan view. Each of the plurality of surrounding portions has inclined lateral surfaces widened upward. Intervals between adjacent ones of the plurality of light sources are constant in the plan view. Upper peripheries of the inclined lateral surfaces of each of the plurality of surrounding portions define an opening having a substantially rectangular shape. The plurality of surrounding portions include a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the plurality of first surrounding portions.Type: GrantFiled: June 23, 2021Date of Patent: February 6, 2024Assignee: Nichia CorporationInventor: Motokazu Yamada
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Patent number: 11868005Abstract: A planar light source includes a substrate, light sources, and a partitioning member. The partitioning member defines partitioned regions arranged in a first direction and in a second direction that intersects the first direction. At least one of the light sources is arranged in a corresponding one of the partitioned regions. The partitioning member includes a plurality of first wall parts defining a plurality of first ridges extending in the first direction, and a plurality of second wall parts defining a plurality of second ridges extending in the second direction. The first wall parts define at least one first cut on at least one of the first ridges. At least one of the partitioned regions is surrounded by the first ridges and the second ridges in a plan view and includes an opposing pair of the first wall parts and an opposing pair of the second wall parts.Type: GrantFiled: June 10, 2022Date of Patent: January 9, 2024Assignee: NICHIA CORPORATIONInventors: Koki Shibai, Yoshihiro Sho, Motokazu Yamada, Naoya Kashiwagi, Shimpei Sasaoka
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Patent number: 11735690Abstract: A light emitting device includes a wiring substrate, and light emitting elements. The light emitting elements are aligned in a first array, and each includes a sapphire substrate having a lower surface, a pair of first lateral surfaces slanted with respect to the lower surface, and a pair of second lateral surfaces perpendicular to the lower surface, with the pair of first lateral surfaces has an acute angle lateral surface and an obtuse angle lateral surface, and a semiconductor layered structure disposed on the sapphire substrate. In a plan view, a direction along which the second lateral surfaces of one of the light emitting elements in the first array extend forms an angle of 45° with respect to a direction along which the second lateral surfaces of an adjacent one of the light emitting elements in the first array extend.Type: GrantFiled: May 12, 2021Date of Patent: August 22, 2023Assignee: NICHIA CORPORATIONInventor: Motokazu Yamada
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Publication number: 20230207756Abstract: A method for producing a light-emitting unit includes providing a solder composition on a wiring layer of a substrate. The solder composition contains a solder, a flux, and light-reflective particles. The method further includes placing a light-emitting element having an electrode on the solder composition such that the electrode of the light-emitting element faces the solder composition, and melting the solder by a reflow process to allow the light-reflective particles to move to a surface of the solder composition, and to electrically couple the electrode with the wiring layer via the solder.Type: ApplicationFiled: December 16, 2022Publication date: June 29, 2023Applicant: NICHIA CORPORATIONInventor: Motokazu YAMADA
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Publication number: 20230151945Abstract: A light emitting device includes: a mounting board; a light source positioned on the mounting board; a light diffusion plate; a diffuse reflector positioned between the mounting board and the light diffusion plate, and above at least part of an emission face of the light source; and a wavelength conversion layer positioned on or above the diffuse reflector.Type: ApplicationFiled: January 20, 2023Publication date: May 18, 2023Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Takeshi TAMURA, Hiroshi FUJIMORI
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Patent number: 11649947Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.Type: GrantFiled: June 21, 2021Date of Patent: May 16, 2023Assignee: NICHIA CORPORATIONInventors: Yuichi Yamada, Motokazu Yamada
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Patent number: 11646298Abstract: A light-emitting device includes a base member, conductor wiring on an upper surface of the base member, a reflective member covering the upper surfaces of the base member and the conductor wiring and having apertures to expose part of the upper surface of the base member and part of the upper surface of the conductor wiring, a plurality of light sources bonded to the part of the upper surface of the conductor wiring located in the apertures with bonding members, and a reflector that is disposed on the reflective member and includes a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the first surrounding portions, which respectively surround the light sources in a plan view. Each surrounding portion has inclined lateral surfaces that widen in an upward direction. An aperture in each second surrounding portion is smaller than an aperture in each first surrounding portion in the plan view.Type: GrantFiled: December 17, 2020Date of Patent: May 9, 2023Assignee: Nichia CorporationInventor: Motokazu Yamada
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Patent number: 11631789Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.Type: GrantFiled: September 27, 2021Date of Patent: April 18, 2023Assignee: NICHIA CORPORATIONInventors: Yuichi Yamada, Motokazu Yamada
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Publication number: 20230096212Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.Type: ApplicationFiled: October 28, 2022Publication date: March 30, 2023Inventors: Motokazu YAMADA, Yuichi YAMADA, Shinsaku IKUTA, Takeshi TAMURA
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Publication number: 20230067018Abstract: A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.Type: ApplicationFiled: October 27, 2022Publication date: March 2, 2023Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Yuichi YAMADA