Patents by Inventor Motokazu Yamada

Motokazu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11067250
    Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 20, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Yuichi Yamada, Motokazu Yamada
  • Patent number: 11047551
    Abstract: A light emitting device includes a plurality of light sources, a substrate, a partitioning member, a diffuser sheet, a plurality of first reflectors, and a second reflector. Each of the light sources includes a light emitting element and an encapsulant covering the light emitting element. The light sources are disposed on the substrate. The partitioning member surrounds the light sources and has a plurality of areas formed by walls having top parts. The walls include surfaces inclined with respect to an upper surface of the substrate to spread out from bottom parts toward the top parts. The diffuser sheet is provided over the partitioning member. The first reflectors are provided directly over the light sources, on an upper surface or a lower surface of the diffuser sheet. The second reflector is provided directly over the top parts, on the upper surface or the lower surface of the diffuser sheet.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: June 29, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Takeshi Tamura, Hiroshi Fujimori, Motokazu Yamada
  • Patent number: 11037911
    Abstract: A light emitting device includes a wiring substrate, light emitting elements, light-reflecting films, and a light diffusing member. The light emitting elements are mounted in a matrix on the wiring substrate. Each of the light emitting elements includes a sapphire substrate having a lower surface, first lateral surfaces inclined to the lower surface, and second lateral surfaces perpendicular to the lower surface, and a semiconductor layered structure disposed on the lower surface. The light-reflecting films are respectively disposed on the light emitting elements. The light diffusing member is disposed above the light emitting elements. At least a group of the light emitting elements is arranged such that, in every adjacent ones of the light emitting elements in at least one of a row direction and a column direction, the first lateral surface of the light emitting element faces the second lateral surface of the adjacent light emitting element.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: June 15, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Patent number: 11031532
    Abstract: A light emitting device includes at least one LED package, and at least one light transmissive sealing member. Each of the at least one LED package includes a light emitting element, a wavelength converter, and a reflection member. The light emitting element is mounted on a mounting surface of a base and electrically connected to a conductor wiring. The wavelength converter is provided on an upper surface of the light emitting element. The reflection member covers a side surface and a lower surface of the light emitting element. Each of the at least one light transmissive sealing member includes a light diffusion material and covers each of the at least one LED package. Each of the at least one light transmissive sealing member has a projection shape with a substantially circular bottom surface facing the base and with a height in the light axis direction of the light emitting element.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: June 8, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Yuichi Yamada
  • Publication number: 20210167263
    Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 3, 2021
    Inventors: Motokazu YAMADA, Yuichi YAMADA, Shinsaku IKUTA, Takeshi TAMURA
  • Patent number: 11015784
    Abstract: A light emitting device includes a base, light sources, wall portions, and a half mirror. The base has a light reflecting surface and has a first side on which the light reflecting surface is provided. The light sources are mounted on the first side of the base. Each of the wall portions surrounds each of the plurality of light sources. The half mirror is to reflect a part of incident light and to transmit another part of the incident light. The half mirror is disposed opposite to the base such that the light sources are provided between the half mirror and the base.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: May 25, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20210140607
    Abstract: A light-emitting device includes: a base member that includes conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Yuichi YAMADA
  • Patent number: 10993296
    Abstract: A light-emitting module includes: a base body including electrical conductor wirings; a light-emitting element disposed on the base body and electrically connected to the electrical conductor wirings; a light reflection film disposed on an upper surface of the light-emitting element; and a half mirror disposed on a light extraction surface side of the light-emitting element and spaced apart from the light-emitting element. A spectral reflectance of the half mirror under perpendicular incidence at a wavelength longer than a peak emission wavelength of a light emitted from the light-emitting element is greater than a spectral reflectance of the half mirror under perpendicular incidence at the peak emission wavelength.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: April 27, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20210104502
    Abstract: A light-emitting device includes a base member, conductor wiring on an upper surface of the base member, a reflective member covering the upper surfaces of the base member and the conductor wiring and having apertures to expose part of the upper surface of the base member and part of the upper surface of the conductor wiring, a plurality of light sources bonded to the part of the upper surface of the conductor wiring located in the apertures with bonding members, and a reflector that is disposed on the reflective member and includes a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the first surrounding portions, which respectively surround the light sources in a plan view. Each surrounding portion has inclined lateral surfaces that widen in an upward direction. An aperture in each second surrounding portion is smaller than an aperture in each first surrounding portion in the plan view.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Applicant: NICHIA CORPORATION
    Inventor: Motokazu YAMADA
  • Patent number: 10967588
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: April 6, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Patent number: 10920960
    Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: February 16, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Yuichi Yamada
  • Patent number: 10903193
    Abstract: A light-emitting device includes a base member, conductor wiring on an upper surface of the base member, a reflective member covering the upper surfaces of the base member and the conductor wiring and having apertures to expose part of the upper surface of the base member and part of the upper surface of the conductor wiring, a plurality of light sources bonded to the part of the upper surface of the conductor wiring located in the apertures with bonding members, and a reflector that is disposed on the reflective member and includes a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the first surrounding portions, which respectively surround the light sources in a plan view. Each surrounding portion has inclined lateral surfaces that widen in an upward direction. An aperture in each second surrounding portion is smaller than an aperture in each first surrounding portion in the plan view.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 26, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20200411737
    Abstract: A light emitting device includes at least one LED package, and at least one light transmissive sealing member. Each of the at least one LED package includes a light emitting element, a wavelength converter, and a reflection member. The light emitting element is mounted on a mounting surface of a base and electrically connected to a conductor wiring. The wavelength converter is provided on an upper surface of the light emitting element. The reflection member covers a side surface and a lower surface of the light emitting element. Each of the at least one light transmissive sealing member includes a light diffusion material and covers each of the at least one LED package. Each of the at least one light transmissive sealing member has a projection shape with a substantially circular bottom surface facing the base and with a height in the light axis direction of the light emitting element.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 31, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Yuichi YAMADA
  • Patent number: 10879436
    Abstract: A light emitting device having a light-emitting element, a covering resin covering the light-emitting element, a wavelength converting material contained in the covering resin, and a light diffusing agent contained in the covering resin is provided. The light diffusing agent contains glass particles. A first refractive index n1 of the covering resin at a peak wavelength of a light emitted by the light-emitting element and at 25° C. is in a range of 1.48 to 1.60, a second refractive index n2 of the covering resin at the peak wavelength and at 100° C. is at least 0.0075 lower than the first refractive index n1, and a third refractive index n3 of the light diffusing agent at the peak wavelength and at 25° C. is higher than the first refractive index n1.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: December 29, 2020
    Inventors: Motokazu Yamada, Tomonori Ozaki
  • Patent number: 10847688
    Abstract: A light emitting device includes a base having a conductor wiring, at least one light emitting element mounted on the base and electrically connected to the conductor wiring, and a light transmissive sealing member. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface. The light transmissive sealing member has a maximum length when the light transmissive sealing member is viewed from the light axis direction. The diameter of the substantially circular bottom surface is smaller than the maximum length of the light transmissive sealing member.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: November 24, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Yuichi Yamada
  • Publication number: 20200350472
    Abstract: A backlight includes: a light-emitting module including: a base member including a conductive pattern; a plurality of light-emitting devices, each of which is flip-chip bonded on the base member and electrically connected to the conductive pattern, and each of which includes: a light-emitting element, and a dielectric multi-layer film located on an upper surface of the light-emitting element; a plurality of light reflective members arranged between the plurality of light-emitting elements; a transparent laminate located above the plurality of light-emitting devices and including: a wavelength converting member adapted to absorb a portion of light from the light-emitting elements and to emit light of a wavelength that is different from an emission wavelength of the light-emitting elements, and a diffuser plate; and a reflective member facing a lateral surface of the transparent laminate.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Applicant: NICHIA CORPORATION
    Inventor: Motokazu YAMADA
  • Publication number: 20200335666
    Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a cover member, a reflective member and a light transmissive member. The flexible substrate has a first surface and a second surface opposite to the first surface, and includes a flexible base member and a plurality of wiring portions disposed on a first surface side. The light emitting element is arranged on the first surface of the flexible substrate and electrically connected to the wiring portions. The cover member is arranged on the second surface of the flexible substrate and defines a through hole at a position overlapping the light emitting element in a plan view. The reflective member covers at least a part of a lower surface and at least a part of a side surface of the light emitting element. The light transmissive member covers a top surface of the light emitting element.
    Type: Application
    Filed: July 7, 2020
    Publication date: October 22, 2020
    Inventor: Motokazu YAMADA
  • Patent number: 10801704
    Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: October 13, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Yasuo Fujikawa, Takuya Wasa, Tomohiro Ikeda, Yohei Inayoshi, Motokazu Yamada
  • Publication number: 20200318808
    Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.
    Type: Application
    Filed: February 7, 2020
    Publication date: October 8, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Yuichi YAMADA
  • Publication number: 20200313043
    Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.
    Type: Application
    Filed: June 10, 2020
    Publication date: October 1, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Yuichi YAMADA, Motokazu YAMADA