Patents by Inventor Motokazu Yamada

Motokazu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200147908
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ā€˜Cā€™, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
  • Publication number: 20200135979
    Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Yuichi YAMADA, Motokazu YAMADA
  • Publication number: 20200137842
    Abstract: A light-emitting module includes: a base body including electrical conductor wirings; a light-emitting element disposed on the base body and electrically connected to the electrical conductor wirings; a light reflection film disposed on an upper surface of the light-emitting element; and a half mirror disposed on a light extraction surface side of the light-emitting element and spaced apart from the light-emitting element. A spectral reflectance of the half mirror under perpendicular incidence at a wavelength longer than a peak emission wavelength of a light emitted from the light-emitting element is greater than a spectral reflectance of the half mirror under perpendicular incidence at the peak emission wavelength.
    Type: Application
    Filed: December 31, 2019
    Publication date: April 30, 2020
    Applicant: NICHIA CORPORATION
    Inventor: Motokazu YAMADA
  • Publication number: 20200096175
    Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources. The diffuse reflectors comprise a resin, and particles dispersed in the resin. Each of the diffuse reflectors is positioned in an area that, in the top view, is larger than and includes the emission face of each light source. A density of the particles in said area, in the top view, is higher in a first portion located immediately above the emission face of each light source than in a second portion located around a periphery of the first portion.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Takeshi TAMURA, Hiroshi FUJIMORI
  • Patent number: 10598342
    Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: March 24, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Yuichi Yamada
  • Patent number: 10593833
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: March 17, 2020
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji
  • Patent number: 10595367
    Abstract: A light-emitting module includes: a base body including electrical conductor wirings; a light-emitting element disposed on the base body and electrically connected to the electrical conductor wirings; a light reflection film disposed on an upper surface of the light-emitting element; and a half mirror disposed on a light extraction surface side of the light-emitting element and spaced apart from the light-emitting element. A spectral reflectance of the half mirror under perpendicular incidence at a wavelength longer than a peak emission wavelength of a light emitted from the light-emitting element is greater than a spectral reflectance of the half mirror under perpendicular incidence at the peak emission wavelength.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: March 17, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Patent number: 10569487
    Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ā€˜Cā€™, or a rectangular shape. A covering member having a recess portion is provided above the light source.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: February 25, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Patent number: 10559721
    Abstract: A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: February 11, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Mototaka Inobe
  • Patent number: 10553763
    Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: February 4, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Yuichi Yamada, Motokazu Yamada
  • Patent number: 10527257
    Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: January 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Takeshi Tamura, Hiroshi Fujimori
  • Publication number: 20200006297
    Abstract: A light-emitting device includes a base member, conductor wiring on an upper surface of the base member, a reflective member covering the upper surfaces of the base member and the conductor wiring and having apertures to expose part of the upper surface of the base member and part of the upper surface of the conductor wiring, a plurality of light sources bonded to the part of the upper surface of the conductor wiring located in the apertures with bonding members, and a reflector that is disposed on the reflective member and includes a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the first surrounding portions, which respectively surround the light sources in a plan view. Each surrounding portion has inclined lateral surfaces that widen in an upward direction. An aperture in each second surrounding portion is smaller than an aperture in each first surrounding portion in the plan view.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Applicant: NICHIA CORPORATION
    Inventor: Motokazu Yamada
  • Publication number: 20200003370
    Abstract: A lighting module includes a mounting board; a plurality of first light sources located on the mounting board; and one or more second light sources located on the mounting board. A wavelength range and/or a correlated color temperature of the plurality of first light sources is different from a wavelength range and/or a correlated color temperature of the one or more second light sources. A quantity of the first light sources is greater than a quantity of the one or more second light sources. A light distribution angle of each of the one or more second light sources is greater than a light distribution angle of each of the plurality of first light sources.
    Type: Application
    Filed: September 11, 2019
    Publication date: January 2, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Tomonori OZAKI, Motokazu YAMADA
  • Patent number: 10505089
    Abstract: A method of manufacturing a light emitting device includes providing a substrate and establishing metallization on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. Light reflective resin is provided at a position surrounding the light emitting element to reflect light from the light emitting element. The surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin are covered continuously, with insulating material. An inside surrounded by the light reflective resin is filled with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: December 10, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Mototaka Inobe, Motokazu Yamada, Kazuhiro Kamada
  • Publication number: 20190326472
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Applicant: Nichia Corporation
    Inventors: Isamu NIKI, Motokazu YAMADA, Masahiko SANO, Shuji SHIOJI
  • Publication number: 20190326479
    Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, and a cover member. The flexible substrate has a first surface and a second surface, and includes a flexible base member and wiring portions disposed on a first surface side. The cover member is arranged on the second surface of the flexible substrate and defines at least a part of a recess defining an air layer. The recess is positioned so that a total maximum thickness of the flexible substrate and the cover member in a region corresponding to a region on the first surface where the at least one light emitting element is arranged is smaller than a total maximum thickness of the flexible substrate and the cover member in a region other than the region corresponding to the region on the first surface where the at least one light emitting element is arranged.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Inventor: Motokazu YAMADA
  • Patent number: 10451225
    Abstract: A lighting module includes a mounting board; a plurality of first light sources located on the mounting board; and one or more second light sources located on the mounting board. A wavelength range and/or a correlated color temperature of the plurality of first light sources is different from a wavelength range and/or a correlated color temperature of the one or more second light sources. A quantity of the first light sources is greater than a quantity of the one or more second light sources. A light distribution angle of each of the one or more second light sources is greater than a light distribution angle of each of the plurality of first light sources.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: October 22, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Tomonori Ozaki, Motokazu Yamada
  • Publication number: 20190305197
    Abstract: A backlight includes: a light-emitting module including: a base member including a conductive pattern; a plurality of light-emitting devices, each of which is flip-chip bonded on the base member and electrically connected to the conductive pattern, and each of which includes: a light-emiting element, and a dielectric multi-layer film located on an upper surface of the light-emitting element; a plurality of light reflective members arranged between the plurality of light-emitting elements; a transparent laminate located above the plurality of light-emitting devices and including: a wavelength converting member adapted to absorb a portion of light from the light-emitting elements and to emit light of a wavelength that is different from an emission wavelength of the light-emitting elements, and a diffuser plate; and a reflective member facing a lateral surface of the transparent laminate.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 3, 2019
    Applicant: NICHIA CORPORATION
    Inventor: Motokazu YAMADA
  • Patent number: 10391727
    Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 27, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
  • Patent number: 10396242
    Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: August 27, 2019
    Assignee: Nichia Corporation
    Inventors: Isamu Niki, Motokazu Yamada, Masahiko Sano, Shuji Shioji