Abstract: The present invention provides an anti-Myl9 antibody or a Myl9 binding fragment thereof that binds to Myl9 and may inhibit the interaction between Myl9 and CD69 in humans, as well as a pharmaceutical composition comprising the same. A mouse anti-human/mouse Myl9 monoclonal antibody having binding affinity against Myl9 was obtained, and the sequence for the complementarity determining region (CDR) of said mouse anti-human/mouse Myl9 monoclonal antibody was identified. Accordingly, a humanized antibody comprising the CDR sequence of said mouse anti-human/mouse Myl9 monoclonal antibody in the variable region of heavy and light chains was produced.

Abstract: The present invention provides an anti-Myl9 antibody or a Myl9 binding fragment thereof that binds to Myl9 and may inhibit the interaction between Myl9 and CD69 in humans, as well as a pharmaceutical composition comprising the same. A mouse anti-human/mouse Myl9 monoclonal antibody having binding affinity against Myl9 was obtained, and the sequence for the complementarity determining region (CDR) of said mouse anti-human/mouse Myl9 monoclonal antibody was identified. Accordingly, a humanized antibody comprising the CDR sequence of said mouse anti-human/mouse Myl9 monoclonal antibody in the variable region of heavy and light chains was produced.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: An ophthalmic suspension comprising difluprednate as an active ingredient. The ophthalmic suspension of the present invention shows superior antiinflammatory action and antiallergic action by local administration. Accordingly, the suspension of the present invention is useful for the treatment and prevention of disorders of the eye, such as allergic conjunctivitis, vernal conjunctivitis, blepharitis marginalis, catarrhal conjunctivitis and uveitis.

Abstract: There is disclosed an antiallergic composition for ophthalmic or nasal use, comprising cetirizine or a salt thereof as an active ingredient. The antiallergic composition may further contain a cyclodextrin compound, as well as a surfactant and/or a water soluble polymer.