Abstract: A substrate processing system configured to process a substrate includes a carry-in/out unit configured to carry the substrate from/to an outside thereof; a processing unit configured to process a processing surface of the substrate; a cleaning unit provided between the carry-in/out unit and the processing unit when viewed from a top, and configured to clean the processing surface after being processed in the processing unit; a first transfer unit stacked on top of the cleaning unit, and configured to transfer the substrate; and a second transfer unit provided between the processing unit and the first transfer unit when viewed from the top, and configured to transfer the substrate. The first transfer unit transfers the substrate between the carry-in/out unit and the second transfer unit. The second transfer unit transfers the substrate between the first transfer unit and the processing unit and between the processing unit and the cleaning unit.

Abstract: A substrate processing system configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a processing apparatus configured to grind the first substrate; a first thickness measuring apparatus configured to measure a thickness of the first substrate before being ground by the processing apparatus and a total thickness of the combined substrate including the first substrate; and a second thickness measuring apparatus configured to measure the thickness of the first substrate after being ground by the processing apparatus.

Abstract: A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.

Abstract: A grinding apparatus includes a chuck, a housing, a tool driving unit, a nozzle, a sensor and a sensor cover. The chuck is configured to hold a substrate. The housing accommodates the chuck therein. The tool driving unit is configured to drive a grinding tool pressed against the substrate within the housing. The nozzle is configured to supply a grinding liquid to the substrate within the housing. The sensor is disposed at an inside of the housing and is configured to detect a liquid level of a liquid collected within the housing. The sensor cover is located between the chuck and the sensor.

Abstract: A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.

Abstract: A thickness measuring device configured to measure a thickness of a substrate includes a substrate holder configured to hold the substrate; a measurer configured to measure the thickness of the substrate held by the substrate holder; and a moving mechanism configured to move the substrate holder and the measurer relatively in a horizontal direction. The substrate holder is provided with a notch portion which extends in a diametrical direction from a center of the substrate holder to an outer end thereof, and the measurer is configured to be relatively advanced into or retreated from the notch portion.

Abstract: A removing apparatus includes a table, multiple chucks, a nozzle and a table cover. The table is horizontally provided and configured to be rotated around a vertical rotation center line. The multiple chucks are disposed at a distance therebetween around the rotation center line of the table. The nozzle is configured to supply a processing liquid to a substrate held by the chuck. The table cover is configured to receive the processing liquid from above the table. The table cover has an inclined member of a conical shape having a decreasing height as the inclined member goes away from the rotation center line of the table while having a constant height in a rotation direction.

Abstract: A bonding apparatus is configured to bond a first substrate and a second substrate to prepare a combined substrate. The first substrate includes a base substrate, and a device layer formed on a surface of the base substrate facing the second substrate. The bonding apparatus includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a moving unit configured to move the first holder and the second holder relative to each other; and a total thickness measurement controller configured to control a thickness detector, which is configured to measure a total thickness of the combined substrate, to measure the total thickness at multiple points.

Abstract: A substrate processing apparatus includes a pair of first substrate chucks each configured to hold a substrate from below while allowing a first main surface of the substrate to face upwards; a pair of second substrate chucks each configured to hold the substrate from below while allowing a second main surface of the substrate opposite to the first main surface to face upwards; a rotary table which is configured to be rotated about a rotation axis; a first processing unit equipped with a first processing tool configured to process the first main surface of the substrate held by the first substrate chuck; and a second processing unit equipped with a second processing tool configured to process the second main surface of the substrate held by the second substrate chuck.

Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.

Abstract: A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.

Abstract: A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; a periphery removing unit configured to remove, starting from a periphery modification layer formed on the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and a collection unit equipped with a collection mechanism configured to collect the peripheral portion removed by the periphery removing unit.

Abstract: A substrate processing system includes a first main surface grinding device configured to grind, while holding a substrate from below with a first main surface of the substrate facing upwards, the first main surface of the substrate; a first inverting device configured to invert the substrate ground by the first main surface grinding device; and a second main surface grinding device configured to grin, while holding the ground first main surface of the substrate from below with a second main surface of the substrate facing upwards, the second main surface of the substrate.

Abstract: A substrate transfer device configured to transfer a substrate while holding a first surface of the substrate by a substrate holder and configured to deliver a second surface of the substrate is provided. The substrate transfer device includes a tilting mechanism configured to perform tilting of the substrate holder when viewed from a side; and a fixing mechanism configured to stop the tilting of the substrate holder when viewed from the side.

Abstract: A substrate processing system configured to process a substrate includes a carry-in/out unit configured to carry the substrate from/to an outside thereof; a processing unit configured to process a processing surface of the substrate; a cleaning unit provided between the carry-in/out unit and the processing unit when viewed from a top, and configured to clean the processing surface after being processed in the processing unit; a first transfer unit stacked on top of the cleaning unit, and configured to transfer the substrate; and a second transfer unit provided between the processing unit and the first transfer unit when viewed from the top, and configured to transfer the substrate. The first transfer unit transfers the substrate between the carry-in/out unit and the second transfer unit. The second transfer unit transfers the substrate between the first transfer unit and the processing unit and between the processing unit and the cleaning unit.

Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.

Abstract: A substrate transfer device configured to transfer a substrate while holding a first surface of the substrate by a substrate holder and configured to deliver a second surface of the substrate is provided. The substrate transfer device includes a tilting mechanism configured to perform tilting of the substrate holder when viewed from a side; and a fixing mechanism configured to stop the tilting of the substrate holder when viewed from the side.

Abstract: A substrate processing method includes processing a substrate, which has a first main surface to which a protection tape is attached, from a side of a second main surface thereof, which is opposite from the first main surface; and transferring the substrate in a state that an electrostatic supporter configured to be attracted by an electrostatic attraction force is connected to the substrate after being processed in the processing of the substrate. Since the substrate after being processed is transferred in the state that the electrostatic supporter is connected thereto, weakness of the substrate can be supported by the electrostatic supporter, so that deformation or damage of the substrate during the transfer thereof can be suppressed.

Abstract: A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.

Abstract: A grinding apparatus configured to grind a substrate includes a substrate holder configured to hold the substrate; and an annular grinder configured to come into contact with at least a central portion and a peripheral portion of the substrate held by the substrate holder to grind the substrate. The substrate holder includes multiple substrate holders and the grinder includes multiple grinders. A diameter of at least one of the multiple grinders is different from a diameter of others of the multiple grinders.