Patents by Inventor Myoung Taek SHIM

Myoung Taek SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240158628
    Abstract: The present invention relates to an epoxy resin composition for molding, and a semiconductor device sealed using the same or a vehicle part molded using the same.
    Type: Application
    Filed: August 5, 2022
    Publication date: May 16, 2024
    Inventors: Chan Young PARK, Myoung Taek SHIM, Eun Han LEE, Byung Seon KONG
  • Publication number: 20200165414
    Abstract: The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 ?m, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.
    Type: Application
    Filed: June 29, 2018
    Publication date: May 28, 2020
    Inventors: Ji Seung PARK, Chan Young PARK, Myoung Taek SHIM, Ki Young JEON, Sang Sun LEE