Abstract: The present invention relates to a pharmaceutical composition containing a monoacetyldiacyiglycerol compound as an active ingredient for preventing or treating asthma, and a functional health food composition for preventing or treating asthma. The monoacetyldiacylglycerol compound of the present invention inhibits the expression of IL-4 in EL-4 cells, which are mouse T cell lymphoma cells, reduces hypersensitivity of airway in an asthma-induced animal model, and inhibits the infiltration of inflammatory cells into the bronchial tube. In addition, the compounds of the present invention inhibit the generation of IgE in the serum and bronchoalveolar lavage fluid, have an excellent effect of inhibiting the expression of Th2 cytokines (IL-4, IL-5, and IL-13) in the lung, thereby overcome side effects of the currently used therapeutic agents for asthma, have no toxicity, and exhibit a superior therapeutic effect, and thus can be useful as a composition for preventing, treating, and alleviating asthma.

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.

Abstract: The present invention relates to a pharmaceutical composition containing a monoacetyldiacyiglycerol compound as an active ingredient for preventing or treating asthma, and a functional health food composition for preventing or treating asthma. The monoacetyldiacylglycerol compound of the present invention inhibits the expression of IL-4 in EL-4 cells, which are mouse T cell lymphoma cells, reduces hypersensitivity of airway in an asthma-induced animal model, and inhibits the infiltration of inflammatory cells into the bronchial tube. In addition, the compounds of the present invention inhibit the generation of IgE in the serum and bronchoalveolar lavage fluid, have an excellent effect of inhibiting the expression of Th2 cytokines (IL-4, IL-5, and IL-13) in the lung, thereby overcome side effects of the currently used therapeutic agents for asthma, have no toxicity, and exhibit a superior therapeutic effect, and thus can be useful as a composition for preventing, treating, and alleviating asthma.

Abstract: The present invention relates to a pharmaceutical composition containing a monoacetyldiacylglycerol compound as an active ingredient for preventing or treating asthma, and a functional health food composition for preventing or treating asthma. The monoacetyldiacylglycerol compound of the present invention inhibits the expression of IL-4 in EL-4 cells, which are mouse T cell lymphoma cells, reduces hypersensitivity of airway in an asthma-induced animal model, and inhibits the infiltration of inflammatory cells into the bronchial tube. In addition, the compounds of the present invention inhibit the generation of IgE in the serum and bronchoalveolar lavage fluid, have an excellent effect of inhibiting the expression of Th2 cytokines (IL-4, IL-5, and IL-13) in the lung, thereby overcome side effects of the currently used therapeutic agents for asthma, have no toxicity, and exhibit a superior therapeutic effect, and thus can be useful as a composition for preventing, treating, and alleviating asthma.

Abstract: A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.

Abstract: A chip on film (COF) package includes a film substrate, first leads on a first surface of the film substrate, the first leads having a first length, and second leads on the first surface of the film substrate, the second leads having a second length larger than the first length, first via plugs penetrating the film substrate and connected to first ends of the first leads, and second via plugs penetrating the film substrate and connected to first ends of the second leads, and first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs, and second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs.

Abstract: The present invention relates to a pharmaceutical composition containing a monoacetyldiacylglycerol compound as an active ingredient for preventing or treating asthma, and a functional health food composition for preventing or treating asthma. The monoacetyldiacylglycerol compound of the present invention inhibits the expression of IL-4 in EL-4 cells, which are mouse T cell lymphoma cells, reduces hypersensitivity of airway in an asthma-induced animal model, and inhibits the infiltration of inflammatory cells into the bronchial tube. In addition, the compounds of the present invention inhibit the generation of IgE in the serum and bronchoalveolar lavage fluid, have an excellent effect of inhibiting the expression of Th2 cytokines (IL-4, IL-5, and IL-13) in the lung, thereby overcome side effects of the currently used therapeutic agents for asthma, have no toxicity, and exhibit a superior therapeutic effect, and thus can be useful as a composition for preventing, treating, and alleviating asthma.

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract: A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

Abstract: A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film.

Abstract: A chip on film (COF) package includes a film substrate, first leads on a first surface of the film substrate, the first leads having a first length, and second leads on the first surface of the film substrate, the second leads having a second length larger than the first length, first via plugs penetrating the film substrate and connected to first ends of the first leads, and second via plugs penetrating the film substrate and connected to first ends of the second leads, and first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs, and second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs.

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract: A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film.

Abstract: Provided are a semiconductor package with a reduced lead pitch, and a display panel assembly having the semiconductor package. The semiconductor package includes a film having a hole formed therein, a plating pattern formed under the film and forming a wire; a semiconductor chip placed in the hole and electrically connected to the plating pattern; and a first passivation layer formed at a side opposite to the semiconductor chip about the plating pattern and protecting the plating pattern.

Abstract: Example embodiments relate to an interconnection substrate and a semiconductor chip package and a display system including the same. The interconnection substrate may include a base film, a signal line provided on the base film, a power line provided on the base film as a line pattern including a plurality of bent portions, and a ground line provided on the base film in parallel with the power line. The interconnection substrate may further include a semiconductor chip provided on the base film, wherein the power, ground, and/or signal lines are electrically connected to the semiconductor chip to form a semiconductor chip package. A display system may include the above semiconductor chip package, a screen displaying an image, and a PCB generating a signal. The semiconductor chip may be connected between the PCB and the screen and relay the generated signal from the PCB to the screen.

Abstract: A TAB tape for a tape carrier package may have at least one opening formed in a connection portion. The at least one opening may be provided in the connection portion and a portion of the corresponding second lead. The at least one opening may be arranged near a boundary between the corresponding first lead and the connection portion. The at least one opening may be sized to reduce the change of the lead width from the first lead to the second lead.

Abstract: A semiconductor package comprising alignment members is provided. The semiconductor package includes a semiconductor die, first connection terminals disposed on a first surface of the semiconductor die, and a tape substrate including a substrate portion, and second connection terminals disposed on the substrate portion and disposed corresponding to the first connection terminals. The semiconductor package further includes a first alignment member disposed on the first surface of the semiconductor die, and a second alignment member disposed on the substrate portion of the tape substrate and disposed corresponding to the first alignment member.

Abstract: A semiconductor package comprising alignment members is provided. The semiconductor package includes a semiconductor die, first connection terminals disposed on a first surface of the semiconductor die, and a tape substrate including a substrate portion, and second connection terminals disposed on the substrate portion and disposed corresponding to the first connection terminals. The semiconductor package further includes a first alignment member disposed on the first surface of the semiconductor die, and a second alignment member disposed on the substrate portion of the tape substrate and disposed corresponding to the first alignment member.