Patents by Inventor Naamah ARGAMAN
Naamah ARGAMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230230991Abstract: An imaging system and a method of creating composite images are provided. The imaging system includes one or more lens assemblies coupled to a sensor. When reflected light from an object enters the imaging system, incident light on the metalens filter systems creates filtered light, which is turned into composite images by the corresponding sensors. Each metalens filter system focuses the light into a specific wavelength, creating the metalens images. The metalens images are sent to the processor, wherein the processor combines the metalens images into one or more composite images. The metalens images are combined into a composite image, and the composite image has reduced chromatic aberrations.Type: ApplicationFiled: March 17, 2023Publication date: July 20, 2023Inventors: Jinxin FU, Yongan XU, Ludovic GODET, Naamah ARGAMAN, Robert Jan VISSER
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Patent number: 11699383Abstract: A display is created using “smart pixels.” A smart pixel is a pixel of a display that integrates the pixel pipeline as part of the pixel, rather than using separate integrated circuits. A smart pixel may be based on an integrated stack that includes light emitting elements, an external data contact for receiving digital data for that pixel, and also the pixel pipeline from the digital data to the light emitting elements.Type: GrantFiled: June 9, 2022Date of Patent: July 11, 2023Assignee: Tectus CorporationInventors: Paul Scott Martin, Naamah Argaman, Michael West Wiemer
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Patent number: 11626321Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: GrantFiled: May 22, 2020Date of Patent: April 11, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Naamah Argaman, Tapashree Roy, Sage Toko Garrett Doshay
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Patent number: 11610925Abstract: An imaging system and a method of creating composite images are provided. The imaging system includes one or more lens assemblies coupled to a sensor. When reflected light from an object enters the imaging system, incident light on the metalens filter systems creates filtered light, which is turned into composite images by the corresponding sensors. Each metalens filter system focuses the light into a specific wavelength, creating the metalens images. The metalens images are sent to the processor, wherein the processor combines the metalens images into one or more composite images. The metalens images are combined into a composite image, and the composite image has reduced chromatic aberrations.Type: GrantFiled: April 27, 2020Date of Patent: March 21, 2023Assignee: Applied Materials, Inc.Inventors: Jinxin Fu, Yongan Xu, Ludovic Godet, Naamah Argaman, Robert Jan Visser
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Patent number: 11557987Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: GrantFiled: November 17, 2021Date of Patent: January 17, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Wayne McMillan, Visweswaren Sivaramakrishnan, Joseph C. Olson, Ludovic Godet, Rutger Meyer Timmerman Thijssen, Naamah Argaman
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Publication number: 20220392395Abstract: A display is created using “smart pixels.” A smart pixel is a pixel of a display that integrates the pixel pipeline as part of the pixel, rather than using separate integrated circuits. A smart pixel may be based on an integrated stack that includes light emitting elements, an external data contact for receiving digital data for that pixel, and also the pixel pipeline from the digital data to the light emitting elements.Type: ApplicationFiled: June 9, 2022Publication date: December 8, 2022Inventors: Paul Scott Martin, Naamah Argaman, Michael West Wiemer
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Publication number: 20220336270Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: ApplicationFiled: July 1, 2022Publication date: October 20, 2022Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage Toko Garrett DOSHAY
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Publication number: 20220308460Abstract: Methods of fabricating large-scale optical devices having sub-micron dimensions are provided. A method is provided that includes projecting a beam to a mask, the mask corresponding to a section of an optical device pattern, the optical device pattern divided into four or more equal portions, each portion corresponding to a section of a substrate. The method further includes scanning the mask over a first section of the substrate to pattern a first portion of the optical device pattern, the substrate is positioned at a first rotation angle relative to the mask. The method further includes rotating the substrate to a second rotation angle, the second rotation angle corresponding to 360° divided by a total number of portions of the optical device pattern, scanning the mask over a second section of the substrate from the initial position to the final position to pattern a second portion of the optical device pattern.Type: ApplicationFiled: March 22, 2022Publication date: September 29, 2022Inventors: Yongan XU, Naamah ARGAMAN, David SELL, Ludovic GODET
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Publication number: 20220082738Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a film stack disposed on a substrate without planarization. The method includes forming a hardmask on a top surface of a film stack. Forming a mask material on a portion of the top surface and a portion of the hardmask. Etching the top surface. Trimming the mask. Etching the top surface again. Trimming the mask a second time. Etching the top surface yet again and then stripping the mask material.Type: ApplicationFiled: November 24, 2021Publication date: March 17, 2022Inventors: Michael Yu-tak YOUNG, Ludovic GODET, Robert Jan VISSER, Naamah ARGAMAN, Christopher Dennis BENCHER, Wayne MCMILLAN
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Publication number: 20220077794Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Inventors: Wayne MCMILLAN, Visweswaren SIVARAMAKRISHNAN, Joseph C. OLSON, Ludovic GODET, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN
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Publication number: 20220018998Abstract: Embodiments of the present disclosure generally relate to optical devices. Specifically, embodiments of the present disclosure relate to optical devices with one or more optical component circuits. The optical devices including one or more optical component circuits prevent the user from exposure to light when a conductive pathway is interrupted via aperture breakage, for example, from the user dropping the substrate, or from the user dropping the optical device. The conductive pathway allows for current to flow from a power source through the apertures and to one or more light sources and, in some embodiments, one or more light detectors. Aperture breakage resulting in the interruption of the conductive pathway prevents current from being provided to the one or more light sources and/or one or more light detectors to prevent (e.g., automatically prevent) light exposure to the user.Type: ApplicationFiled: July 9, 2021Publication date: January 20, 2022Inventors: Sage Toko Garrett DOSHAY, Naamah ARGAMAN
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Patent number: 11205978Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: GrantFiled: December 13, 2019Date of Patent: December 21, 2021Assignee: Applied Materials, Inc.Inventors: Wayne McMillan, Visweswaren Sivaramakrishnan, Joseph C. Olson, Ludovic Godet, Rutger Meyer Timmerman Thijssen, Naamah Argaman
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Patent number: 11187836Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a substrate without planarization. The method includes depositing a material stack to be patterned on a substrate, depositing and patterning a thick mask material on a portion of the material stack, etching the material stack down one level, trimming a side portion of the thick mask material, etching the material stack down one more level, repeating trim and etch steps above ‘n’ times, and stripping the thick mask material from the material stack.Type: GrantFiled: March 5, 2019Date of Patent: November 30, 2021Assignee: Applied Materials, Inc.Inventors: Michael Yu-tak Young, Ludovic Godet, Robert Jan Visser, Naamah Argaman, Christopher Dennis Bencher, Wayne McMillan
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Publication number: 20200388642Abstract: An imaging system and a method of creating composite images are provided. The imaging system includes one or more lens assemblies coupled to a sensor. When reflected light from an object enters the imaging system, incident light on the metalens filter systems creates filtered light, which is turned into composite images by the corresponding sensors. Each metalens filter system focuses the light into a specific wavelength, creating the metalens images. The metalens images are sent to the processor, wherein the processor combines the metalens images into one or more composite images. The metalens images are combined into a composite image, and the composite image has reduced chromatic aberrations.Type: ApplicationFiled: April 27, 2020Publication date: December 10, 2020Inventors: Jinxin FU, Yongan XU, Ludovic GODET, Naamah ARGAMAN, Robert Jan VISSER
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Publication number: 20200286778Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: ApplicationFiled: May 22, 2020Publication date: September 10, 2020Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage Toko Garrett DOSHAY
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Patent number: 10707118Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: GrantFiled: February 22, 2019Date of Patent: July 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Naamah Argaman, Tapashree Roy, Sage Doshay
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Publication number: 20200195172Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: ApplicationFiled: December 13, 2019Publication date: June 18, 2020Inventors: Wayne MCMILLAN, Visweswaren SIVARAMAKRISHNAN, Joseph C. OLSON, Ludovic GODET, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN
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Publication number: 20200194319Abstract: Embodiments described herein relate to semiconductor processing. More specifically, embodiments described herein relate to processing of transparent substrates. A film is deposited on a backside of the transparent substrate. A thickness of the film is determined such that the film reflects particular wavelengths of light and substantially prevents bowing of the substrate. The film provides constructive interference to the particular wavelengths of light.Type: ApplicationFiled: October 25, 2019Publication date: June 18, 2020Inventors: Sage Toko Garrett DOSHAY, Rutger MEYER TIMMERMAN THIJSSEN, Ludovic GODET, Mingwei ZHU, Naamah ARGAMAN, Wayne MCMILLAN, Siddarth KRISHNAN
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Publication number: 20190318957Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: ApplicationFiled: February 22, 2019Publication date: October 17, 2019Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage DOSHAY
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Publication number: 20190278005Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a substrate without planarization. The method includes depositing a material stack to be patterned on a substrate, depositing and patterning a thick mask material on a portion of the material stack, etching the material stack down one level, trimming a side portion of the thick mask material, etching the material stack down one more level, repeating trim and etch steps above ‘n’ times, and stripping the thick mask material from the material stack.Type: ApplicationFiled: March 5, 2019Publication date: September 12, 2019Inventors: Michael Yu-tak YOUNG, Ludovic GODET, Robert Jan VISSER, Naamah ARGAMAN, Christopher Dennis BENCHER, Wayne MCMILLAN