Patents by Inventor Nai-Kuei Kuo
Nai-Kuei Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11823483Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.Type: GrantFiled: September 17, 2021Date of Patent: November 21, 2023Assignee: QUALCOMM IncorporatedInventors: Jessica Liu Strohmann, Hrishikesh Vijaykumar Panchawagh, Nai-Kuei Kuo, Yipeng Lu, Ali Lopez, Kostadin Dimitrov Djordjev
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Patent number: 11798308Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.Type: GrantFiled: September 17, 2021Date of Patent: October 24, 2023Assignee: QUALCOMM IncorporatedInventors: Jessica Liu Strohmann, Hrishikesh Vijaykumar Panchawagh, Nai-Kuei Kuo, Yipeng Lu, Ali Lopez, Kostadin Dimitrov Djordjev
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Publication number: 20230088820Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.Type: ApplicationFiled: September 17, 2021Publication date: March 23, 2023Inventors: Jessica Liu STROHMANN, Hrishikesh Vijaykumar PANCHAWAGH, Nai-Kuei KUO, Yipeng LU, Ali LOPEZ, Kostadin Dimitrov DJORDJEV
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Publication number: 20230086418Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.Type: ApplicationFiled: September 17, 2021Publication date: March 23, 2023Inventors: Jessica Liu STROHMANN, Hrishikesh Vijaykumar PANCHAWAGH, Nai-Kuei KUO, Yipeng LU, Ali LOPEZ, Kostadin Dimitrov DJORDJEV
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Patent number: 10503948Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.Type: GrantFiled: March 5, 2015Date of Patent: December 10, 2019Assignee: QUALCOMM IncorporatedInventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
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Patent number: 10478858Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.Type: GrantFiled: December 12, 2014Date of Patent: November 19, 2019Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Evgeni Petrovich Gousev, Hrishikesh Panchawagh, David William Burns, Nai-Kuei Kuo, Jonathan Charles Griffiths, Suryaprakash Ganti
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Patent number: 10274590Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: GrantFiled: October 12, 2017Date of Patent: April 30, 2019Assignee: QUALCOMM IncorporatedInventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
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Patent number: 10001552Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.Type: GrantFiled: October 14, 2015Date of Patent: June 19, 2018Assignee: QUALCOMM IncorporatedInventors: Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, David William Burns, Ravindra Vaman Shenoy, Jon Bradley Lasiter, Nai-Kuei Kuo, Firas Sammoura
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Patent number: 9945818Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.Type: GrantFiled: February 20, 2015Date of Patent: April 17, 2018Assignee: QUALCOMM IncorporatedInventors: Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai-Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker
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Publication number: 20180031686Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: ApplicationFiled: October 12, 2017Publication date: February 1, 2018Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
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Patent number: 9817108Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: GrantFiled: January 5, 2015Date of Patent: November 14, 2017Assignee: QUALCOMM IncorporatedInventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei
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Publication number: 20160350573Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.Type: ApplicationFiled: March 5, 2015Publication date: December 1, 2016Applicant: Qualcomm IncorporatedInventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
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Publication number: 20160107194Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.Type: ApplicationFiled: October 14, 2015Publication date: April 21, 2016Inventors: Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, David William Burns, Ravindra Vaman Shenoy, Jon Bradley Lasiter, Nai-Kuei Kuo, Firas Sammoura
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Publication number: 20150241393Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.Type: ApplicationFiled: February 20, 2015Publication date: August 27, 2015Inventors: Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai-Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker
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Publication number: 20150198699Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.Type: ApplicationFiled: January 5, 2015Publication date: July 16, 2015Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei
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Publication number: 20150165479Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.Type: ApplicationFiled: December 12, 2014Publication date: June 18, 2015Inventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Evgeni Petrovich Gousev, Hrishikesh Panchawagh, David William Burns, Nai-Kuei Kuo, Jonathan Charles Griffiths, Suryaprakash Ganti