Patents by Inventor Nai-Kuei Kuo

Nai-Kuei Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11823483
    Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: November 21, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Jessica Liu Strohmann, Hrishikesh Vijaykumar Panchawagh, Nai-Kuei Kuo, Yipeng Lu, Ali Lopez, Kostadin Dimitrov Djordjev
  • Patent number: 11798308
    Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: October 24, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Jessica Liu Strohmann, Hrishikesh Vijaykumar Panchawagh, Nai-Kuei Kuo, Yipeng Lu, Ali Lopez, Kostadin Dimitrov Djordjev
  • Publication number: 20230088820
    Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Inventors: Jessica Liu STROHMANN, Hrishikesh Vijaykumar PANCHAWAGH, Nai-Kuei KUO, Yipeng LU, Ali LOPEZ, Kostadin Dimitrov DJORDJEV
  • Publication number: 20230086418
    Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Inventors: Jessica Liu STROHMANN, Hrishikesh Vijaykumar PANCHAWAGH, Nai-Kuei KUO, Yipeng LU, Ali LOPEZ, Kostadin Dimitrov DJORDJEV
  • Patent number: 10503948
    Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: December 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
  • Patent number: 10478858
    Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: November 19, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Evgeni Petrovich Gousev, Hrishikesh Panchawagh, David William Burns, Nai-Kuei Kuo, Jonathan Charles Griffiths, Suryaprakash Ganti
  • Patent number: 10274590
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: April 30, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
  • Patent number: 10001552
    Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: June 19, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, David William Burns, Ravindra Vaman Shenoy, Jon Bradley Lasiter, Nai-Kuei Kuo, Firas Sammoura
  • Patent number: 9945818
    Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: April 17, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai-Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker
  • Publication number: 20180031686
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Application
    Filed: October 12, 2017
    Publication date: February 1, 2018
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei, Ashish Hinger, David William Burns
  • Patent number: 9817108
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: November 14, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei
  • Publication number: 20160350573
    Abstract: Systems and methods for multi-spectral ultrasonic imaging are disclosed. In one embodiment, a finger is scanned at a plurality of ultrasonic scan frequencies. Each scan frequency provides an image information set describing a plurality of pixels of the finger including a signal-strength indicating an amount of energy reflected from a surface of a platen on which a finger is provided. For each of the pixels, the pixel output value corresponding to each of the scan frequencies is combined to produce a combined pixel out put value for each pixel. Systems and methods for improving the data capture of multi-spectral ultrasonic imaging are also disclosed.
    Type: Application
    Filed: March 5, 2015
    Publication date: December 1, 2016
    Applicant: Qualcomm Incorporated
    Inventors: Jack Conway Kitchens, II, John Keith Schneider, Ashish Hinger, Ranjith Ranganathan, Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, David William Burns, Nao Sugawara Chuei, Eliza Yingzi Du, Ming Yu Chen, Kwokleung Chan, Jin Gu, Esra Vural
  • Publication number: 20160107194
    Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.
    Type: Application
    Filed: October 14, 2015
    Publication date: April 21, 2016
    Inventors: Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, David William Burns, Ravindra Vaman Shenoy, Jon Bradley Lasiter, Nai-Kuei Kuo, Firas Sammoura
  • Publication number: 20150241393
    Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.
    Type: Application
    Filed: February 20, 2015
    Publication date: August 27, 2015
    Inventors: Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai-Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker
  • Publication number: 20150198699
    Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
    Type: Application
    Filed: January 5, 2015
    Publication date: July 16, 2015
    Inventors: Nai-Kuei Kuo, Kostadin Dimitrov Djordjev, Ranjith Ranganathan, Nao Sugawara Chuei
  • Publication number: 20150165479
    Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 18, 2015
    Inventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Evgeni Petrovich Gousev, Hrishikesh Panchawagh, David William Burns, Nai-Kuei Kuo, Jonathan Charles Griffiths, Suryaprakash Ganti