Abstract: A force sensing device includes: a frame; a plurality of contact blocks disposed on a first side of the frame; at least one force sensor disposed between adjacent contact blocks among the plurality of contact blocks; and at least one pressing member protruding outwardly from a second side of the frame, wherein the at least one pressing member is disposed in a region corresponding to one or more of the contact blocks.

Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.

Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.

Abstract: A force sensing device includes: a frame; a plurality of contact blocks disposed on a first side of the frame; at least one force sensor disposed between adjacent contact blocks among the plurality of contact blocks; and at least one pressing member protruding outwardly from a second side of the frame, wherein the at least one pressing member is disposed in a region corresponding to one or more of the contact blocks.

Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

Abstract: A System in Package (SIP) module includes a printed circuit board with at least one cavity formed therein. The module also includes at least one first device mounted in the cavity and a circuit pattern formed on an undersurface of the cavity and electrically connected to the first device. The module further includes at least one second device mounted on a printed circuit board surface corresponding to the undersurface of the cavity.

Abstract: A System in Package (SIP) module. The module includes a printed circuit board with at least one cavity formed therein. The module also includes at least one first device mounted in the cavity and a circuit pattern formed on an undersurface of the cavity and electrically connected to the first device. The module further includes at least one second device mounted on a printed circuit board surface corresponding to the undersurface of the cavity.