Abstract: A method for producing a magnetic recording medium includes heat-curing a coated substrate to cure a non-magnetic back coat on the substrate and to cure a magnetic front coat on the substrate, and calendering the heat-cured coated substrate to produce the magnetic recording medium. The calendering optionally is off-line calendering during which the substrate passes between opposed, generally non-compliant rolls. Other methods, and magnetic recording media produced by the disclosed methods, also are disclosed.

Abstract: In one embodiment, the invention is directed toward inline lapping of magnetic tape. The lapping process is performed inline with one or more other magnetic tape manufacturing processes. In this manner, the number of times the magnetic tape is un-spooled and then re-spooled can be reduced. Consequently, the amount of handling of the individual tape pancakes can also be reduced, thus avoiding damage to the edge of the tape, or other damage associated with tape pancake handling.

Abstract: In one embodiment, the invention is directed to techniques for controlling the abrasivity of magnetic tape without modifying the coating formulas used to create the magnetic tape. For example, the invention may involve controlling or adjusting the abrasivity of magnetic tape using one or more burnishing techniques such as lapping, vaming or scraping. In this manner, the abrasivity of magnetic tape can be controlled or adjusted to ensure that the tape meets the necessary tape specifications without modifying the coating formulas applied during the coating process.

Abstract: In one embodiment, the invention is directed toward inline lapping of magnetic tape. The lapping process is performed inline with one or more other magnetic tape manufacturing processes. In this manner, the number of times the magnetic tape is un-spooled and then re-spooled can be reduced. Consequently, the amount of handling of the individual tape pancakes can also be reduced, thus avoiding damage to the edge of the tape, or other damage associated with tape pancake handling.

Abstract: In one embodiment, the invention is directed toward inline lapping of magnetic tape. The lapping process is performed inline with one or more other magnetic tape manufacturing processes. In this manner, the number of times the magnetic tape is un-spooled and then re-spooled can be reduced. Consequently, the amount of handling of the individual tape pancakes can also be reduced, thus avoiding damage to the edge of the tape, or other damage associated with tape pancake handling.

Abstract: Pixel array including a high resolution mode and a low resolution mode and method of reading out the pixel array in a high and low resolution mode. The pixel array includes a first signal line and a second signal line. An array of pixel elements are provided, each pixel element coupled to the first signal line or the second signal line. A switch mechanism is provided for coupling the first signal line to the second signal line. A mechanism is also provided for conveying a charge associated with each pixel element to the first signal line or the second signal line. A mechanism may also be provided for buffering signals between the first signal line, the second signal line, and an output signal line.

Abstract: A multi-module radiation detecting device, a radiation detecting module for incorporation in a multi-module radiation detecting device, and a method for assembling a multi-module radiation detecting device are provided. The radiation detecting module includes a carrier substrate and a radiation detecting tile mounted over the carrier substrate. The module includes interconnection structure for connecting radiation detecting elements in the radiation detecting tile to conductive contacts on a base substrate. The module facilitates attachment and detachment of the module relative to the base substrate and relative to a test fixture used in test and burn-in operations. The module is constructed to isolate the radiation detecting tile from thermal and/or mechanical stresses produced at the interconnection interface during attachment and detachment for test and burn-in, assembly, and rework operations.

Abstract: A solid state radiation detection panel adapted to receive radiation, having a plurality of modules positioned immediately adjacent each other, with each of the plurality of modules having an array of photosensitive detectors arranged in a plurality of rows and columns, each of the photosensitive detectors having a radiation sensitive area; and circuit means for selectively addressing one of the photosensitive detectors by addressing one of the plurality of rows and one of the plurality of columns and reading the output of the one of the array of photosensitive detectors where each of the plurality of modules being arranged in a three dimensional structure in which the array of photosensitive detectors is arranged on a planar first surface of the module covering substantially the entire area of the planar first surface. The circuit means is located within the module in an area away from the planar first surface opposite from the received radiation.

Abstract: A process for producing a polysilicon thin film transistor includes hydrogenating the thin film transistor and depositing an atomic hydrogen-containing layer on the thin film transistor. The thin film transistor is characterized by leakage current rates as low as 10.sup.-13 A.

Abstract: A process for producing an array of solid state radiation detectors includes depositing on a substrate one or more layers of silicon-based materials and then depositing a metal layer overlying silicon-based substance. The metal layer is formed into an array of metal layer regions, and then the metal layer is used as a mask to remove exposed adjacent silicon-based substance layers thereby forming an array of silicon-based substance layers that are aligned with the array of metal layers for forming an array of photosensitive sensing devices. The process of the present invention reduces the number of microlithography steps that are used in forming an array of layered amorphous silicon photosensitive devices.

Abstract: The growth of a phosphor layer deposited on a patterned substrate containing a multiplicity of recessed ridges of triangular cross section can be controlled by tailoring the geometry of the recessed ridge structures. During the deposition process, little or no phosphor deposition occurs on the recessed ridge structures, and cracks are formed which separate the otherwise uniformly growing phosphor which is present in other regions of the patterned substrate where more substantial phosphor deposition occurs.

Abstract: A solid state radiation detection panel to receive radiation, having a plurality of modules positioned immediately adjacent each other, with each of the plurality of modules having an array of photosensitive detectors arranged in a plurality of rows and columns, each of the photosensitive detectors having a radiation sensitive area; and circuit for selectively addressing one of the photosensitive detectors by addressing one of the plurality of rows and one of the plurality of columns and reading the output of the one of the array of photosensitive detectors where each of the plurality of modules being arranged in a three dimensional structure in which the array of photosensitive detectors is arranged on a planar first surface of the module covering substantially the entire area of the planar first surface. The circuit is located within the module in an area away from the planar first surface opposite from the received radiation.

Abstract: A radiation detection device includes a plurality of pixels, each pixel includes a thin film transistor and a photodiode conductively connected to a gate of the thin film transistor with the photodiode generating a current when the pixel is exposed to x-rays.

Abstract: A pixelized phosphor screen having an array of pixelized phosphors on a support which are separated a width of from greater than 0.0 to 5.0 microns. In order to produce the phosphor screen, phosphor is deposited on a support and then exposed to radiation to create an array of pixelized phosphors separated by slots. The resulting slots between the pixelized phosphors are then filled in with additional phosphor material such that the width between the pixelized phosphors is from greater than 0.0 to 5.0 microns.

Abstract: A light transmissive, electrically conductive oxide comprising tin and a Group II element is doped with a Group III element and with one or more of hydrogen or fluorine. The oxide may be deposited by sputtering at a temperature in the range from 25.degree. to 350.degree. C., or by chemical vapor deposition at temperatures in the range from 80.degree. to 400.degree. C.

Abstract: A radiation detector containing: (a) a fiber optic network; (b) an array of pixelized phosphors on the X-ray incidence side of the fiber optic network; and (c) an array of pixelized sensors optically coupled to the other side of the fiber optic network, wherein: (i) the ratio of the surface area of a phosphor pixel to the surface area of a sensor pixel is in the range of about 1:1 to 1:64, and (ii) the ratio of the surface area of the core of each individual optical fiber of the fiber optic network to the surface area of a phosphor pixel is in the range of about 1:4 to 1:160.

Abstract: A process for forming a phosphor comprising the steps of:(a) providing a substrate for deposition and growth of an alkali halide phosphor,(b) forming a patterned surface on the substrate comprising a plurality of mesas, each of the mesas having an incline, a decline, and a horizontal surface, the mesas being separated from one another by horizontal segments of the substrate and wherein:(i) the ratio of the height of each of the mesas to the width of the horizontal segments is in the range of about 1:20 to 1:4;(ii) the ratio of the width of each of the mesas to the width of the horizontal segments is in the ratio of about 1:30 to 1:4; and(iii) the angles of incline and decline of each of the mesas are between about 5.degree. to 85.degree.; and(c) depositing an alkali halide phosphor on the patterned surface of the substrate of step (b), thereby forming cracks, in the deposited phosphor, originating from the inclines and/or declines of each of the mesas.

Abstract: A process for fabricating a pixelized phosphor having a space between the pixels in the range of about 0.5-25 microns, the process comprising the steps of:(a) depositing a phosphor on a support;(b) exposing the deposited phosphor to a source of electromagnetic radiation through a mask thereby ablating the phosphor segmentally, resulting in a series of structures in both said X and Y directions to produce an array of pixelized phosphors separated by slots;(c) filling the resulting slots between the pixelized phosphors with phosphor material of the same or different composition as utilized in step (a) such that each of the pixelized phosphors on the support are separated by a width of from about 0.5-25 microns; and(d) optionally, planarizing the pixelized phosphors.

Abstract: A photosensor device includes doped and undoped hydrogenated amorphous silicon layers adjacent each other and sandwiched between a conductive layer on one side and a metal layer on the other side with the sensor having been annealed under a hydrogen atmosphere and exhibiting low dark currents. The photosensor device is particularly useful as an X-ray image sensing device with the addition of a luminescent layer having at least one X-ray phosphor.

Abstract: The present invention provides a large area, high pixel density solid state radiation detector with a real-time and a non-destructive read-out. The solid state detector comprises a plurality of field effect transistors deposited onto a substrate to form an array. A planarization layer is deposited over the array of transistors. An energy sensitive layer is deposited onto the planarization layer. Means is provided for electrically connecting the energy sensitive layer with each transistor of the array. A top electrode layer is deposited onto the energy sensitive layer. The solid state detector also comprises circuitry means for providing electronic read-out from each FET of the array.