Patents by Inventor Nao Honda

Nao Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10509316
    Abstract: The invention relates to polysulfonamide compositions for use as redistribution layers as used in the manufacture of semiconductors and semiconductor packages. More specifically it relates to photoimageable polysulfonamide composition for redistribution applications. The invention also relates to the use of the compositions in semiconductor manufacture.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 17, 2019
    Inventors: Daniel J Nawrocki, Qingzhou Cui, Nao Honda
  • Patent number: 10241408
    Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: March 26, 2019
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Patent number: 10012901
    Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: July 3, 2018
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Publication number: 20170329222
    Abstract: The invention relates to polysulfonamide compositions for use as redistribution layers as used in the manufacture of semiconductors and semiconductor packages. More specifically it relates to photoimageable polysulfonamide composition for redistribution applications. The invention also relates to the use of the compositions in semiconductor manufacture.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 16, 2017
    Inventors: Daniel J. Nawrocki, Qingzhou Cui, Nao Honda
  • Patent number: 9684239
    Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: June 20, 2017
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Patent number: 9448479
    Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: September 20, 2016
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Patent number: 9411229
    Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 9, 2016
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
  • Patent number: 9223212
    Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: December 29, 2015
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
  • Publication number: 20150309409
    Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.
    Type: Application
    Filed: November 21, 2013
    Publication date: October 29, 2015
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Publication number: 20150301450
    Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).
    Type: Application
    Filed: October 25, 2013
    Publication date: October 22, 2015
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Publication number: 20150293448
    Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).
    Type: Application
    Filed: October 25, 2013
    Publication date: October 15, 2015
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Publication number: 20150293444
    Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).
    Type: Application
    Filed: November 21, 2013
    Publication date: October 15, 2015
    Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
  • Patent number: 8865392
    Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: October 21, 2014
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi
  • Publication number: 20140186765
    Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.
    Type: Application
    Filed: July 26, 2012
    Publication date: July 3, 2014
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
  • Publication number: 20140099581
    Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.
    Type: Application
    Filed: June 19, 2012
    Publication date: April 10, 2014
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
  • Patent number: 8481248
    Abstract: A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured ph
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: July 9, 2013
    Assignees: Tohoku University, Nippon Kayaku Kabushiki Kaisha
    Inventors: Nao Honda, Satoshi Mori, Shuji Tanaka, Masayoshi Esashi
  • Publication number: 20130108961
    Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).
    Type: Application
    Filed: July 13, 2011
    Publication date: May 2, 2013
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi
  • Publication number: 20090035706
    Abstract: A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge potion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured pho
    Type: Application
    Filed: June 15, 2006
    Publication date: February 5, 2009
    Inventors: Nao Honda, Satoshi Mori, Shuji Tanaka, Masayoshi Esashi
  • Patent number: D772265
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: November 22, 2016
    Assignee: PFU Limited
    Inventors: Nao Honda, Kiichi Taniho, Tetsuo Oda, Shinichiro Kamimaru
  • Patent number: D782510
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: March 28, 2017
    Assignee: PFU Limited
    Inventors: Nao Honda, Kiichi Taniho, Tetsuo Oda, Shinichiro Kamimaru