Abstract: An annular excess portion is disposed, a spline forming male mold is passed through a boss of a sheet metal-made rotary member in which a root portion of the boss and a peripheral portion are previously displaced, and the boss is set to a stationary mold with being fitted into a boss fitting hole of a rotary member holding mold. Thereafter, the annular excess portion is clamped between a pressing mold and the stationary mold to be deformed into a flat shape, and the root portion of the boss is squeezed into spline forming grooves to be plastically deformed, thereby forming a boss spline. According to the configuration, increase in thickness os a sheet metal blank is avoided, the strength of the boss is ensured, and weight reduction is achieved. The production efficiency can be remarkably improved, and cutting chips are eliminated, so that adverse influence on the working environment can be avoided.

Abstract: A photographic lens system for forming an object image is placed in the lens barrel of an electronic camera. In a camera body, a beam splitter for forming branched optical paths and an image sensing element for photoelectrically converting the formed object image are arranged. The beam splitter and the image sensing element are attached and disposed in the outer casing by a holding frame structure. The photographic lens system is attached and disposed in the lens barrel, which has a heat-radiating barrel made of aluminum. A heat-transfer path from the image sensing element to the heat-radiating barrel is formed by a back plate and a prism frame both made of aluminum, which are part of the holding frame structure.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A recording-medium accommodating apparatus of a digital camera includes a connector/card chamber on the left thereof, and a connector cover, to which a waterproof packing is attached and which opens the connector/card chamber. The connector/card chamber includes a card connector, an inserting opening thereof, a video output terminal portion, a USB terminal portion, and a card cover which opens/closes the inserting opening. In the non-connection of the terminal portion, a memory card is attached, the card cover is closed, the connector cover is closed, and data is then written/read to/from the memory card. In the connection of the terminal portion, the data is written/read to/from the memory card with the connector cover opened. The recording-medium accommodating apparatus further includes a cover member which protects a connector portion between the recording medium and an external device, the recording medium is protected and the connector is used.

Abstract: A camera or an electronic apparatus according to the present invention has a waterproof function and comprises an outer casing for waterproofing the inside of main apparatus, a microphone and a speaker installed inside the main apparatus, openings used for sound input or sound output being featured in the outer casing at a position thereof corresponding to the microphone or the speaker, water proofing members each having a characteristic of passing air and blocking moisture and for sealing the opening from the inside, wherein the microphone or the speaker is mounted onto the water proofing member so as to let a space containing the microphone vibration plate or the speaker vibration plate communicate with only a part of space inside the main apparatus.

Abstract: The present invention relates to a disc-shaped material made from metal sheet, provided for the manufacture of a pulley or the like. According to the present invention, even if the metal sheet is thin and light weight, a peripheral wall of sufficient strength can be formed, by the following steps: rotating the material held between a pair of dies and pressing an outer periphery of the material by means of a forming roller, in a radially inward direction, thereby thickening axially the outer periphery of the material to be extended to both sides of a non-processed portion, thus forming the peripheral wall.

Abstract: A lens unit consists of a plurality of lens frames, a stepping motor, and a driving control unit. The plurality of lens frames for holding an imaging optical system lies in a lens barrel and moves over a stowage interval and a zoom interval. The stowage interval is an interval between a position of stowage at which the lens frames are stowed and a ready-to-image position at which imaging is enabled. The zoom interval is an interval over which the ready-to-image position exists and a power varying action is executed. The stepping motor moves the plurality of lens frames. During execution of a thrusting action or storing action, the driving control unit drives and controls the stepping motor in a first driving mode. The thrusting action is executed for moving the plurality of lens frames from the position of stowage to the ready-to-image position. The stowing action is executed for moving the lens frames from any position within the zoom interval to the position of stowage.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An annular excess portion is disposed, a spline forming male mold is passed through a boss of a sheet metal-made rotary member in which a root portion of the boss and a peripheral portion are previously displaced, and the boss is set to a stationary mold with being fitted into a boss fitting hole of a rotary member holding mold. Thereafter, the annular excess portion is clamped between a pressing mold and the stationary mold to be deformed into a flat shape, and the root portion of the boss is squeezed into spline forming grooves to be plastically deformed, thereby forming a boss spline. According to the configuration, increase in thickness os a sheet metal blank is avoided, the strength of the boss is ensured, and weight reduction is achieved. The production efficiency can be remarkably improved, and cutting chips are eliminated, so that adverse influence on the working environment can be avoided.

Abstract: A lens unit consists of a plurality of lens frames, a stepping motor, and a driving control unit. The plurality of lens frames for holding an imaging optical system lies in a lens barrel and moves over a stowage interval and a zoom interval. The stowage interval is an interval between a position of stowage at which the lens frames are stowed and a ready-to-image position at which imaging is enabled. The zoom interval is an interval over which the ready-to-image position exists and a power varying action is executed. The stepping motor moves the plurality of lens frames. During execution of a thrusting action or storing action, the driving control unit drives and controls the stepping motor in a first driving mode. The thrusting action is executed for moving the plurality of lens frames from the position of stowage to the ready-to-image position. The stowing action is executed for moving the lens frames from any position within the zoom interval to the position of stowage.

Abstract: An electronic imaging device is provided which includes a first lens group which takes in a luminous flux from a subject along a first optical axis, an optical axis conversion member which bends the luminous flux along a second optical axis which intersects with the first optical axis, a second lens which images the bent luminous flux to an imaging element, and an optical amount adjustment unit provided between the second lens group and the optical axis conversion member. An AF motor, a driving unit which drives the optical amount adjustment unit, and a zoom motor are each selectively arranged at one of four spaces formed by a first plane defined by the optical amount adjustment unit and a second plane defined by the first and second optical axes. The AF motor, the driving unit, and the zoom motor may all be arranged at one side of the second plane.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract: A cover apparatus according to the present invention protects a protected portion including at least an opening portion of a recording medium storage chamber and a connector portion. The cover apparatus includes first and second covers. The first cover is movable between an open position where it closes the protected portion and an open position where it opens the protected portion. The second cover is located inward of the first cover, and is movable between a closed position where it closes the opening portion of the recording medium storage chamber and an open position where it opens the opening portion of the recording medium storage chamber. Also, in accordance with opening of the first cover, the second cover moves to the open position where it opens the opening portion of the recording medium storage chamber.

Abstract: The first electronic imaging device, which performs a photoelectric-conversion of a subject light with an imaging element and records it, according to the present invention is characterized by comprising a first lens arranged along a first optical axis to take a luminous flux from the subject, an optical axis conversion material which bends the luminous flux which passes the first lens along a second optical axis which intersects with the first optical axis, a second lens which images the luminous flux bent along the second optical axis to the imaging element arranged on the second optical axis, and an optical amount adjustment device provided between the imaging element and the optical axis conversion material.