Patents by Inventor Naoki Matsushima

Naoki Matsushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220170869
    Abstract: A transmission type small-angle scattering device of the present invention includes a goniometer 10 including a rotation arm 11. The rotation arm 11 is freely turnable around a ?-axis extending in a horizontal direction from an origin with a vertical arrangement state of the rotation arm being defined as the origin, and has a vertical arrangement structure in which an X-ray irradiation unit 20 is installed on a lower-side end portion of the rotation arm 11, and a two-dimensional X-ray detector 30 is installed on an upper-side end portion of the rotation arm 11 to form a vertical arrangement structure.
    Type: Application
    Filed: January 8, 2020
    Publication date: June 2, 2022
    Applicant: RIGAKU CORPORATION
    Inventors: Naoki Matsushima, Kiyoshi Ogata, Sei Yoshihara, Yoshiyasu Ito, Kazuhiko Omote, Hiroshi Motono, Shigematsu Asano, Katsutaka Horada, Sensui Yasuda
  • Patent number: 11261540
    Abstract: A method of controlling a convection pattern of a silicon melt includes applying a horizontal magnetic field having an intensity of 0.2 tesla or more to the silicon melt in a rotating quartz crucible to fix a direction of a convection flow in a plane orthogonal to an application direction of the horizontal magnetic field in the silicon melt, the horizontal magnetic field being applied so that a central magnetic field line passes through a point horizontally offset from a center axis of the quartz crucible by 10 mm or more.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 1, 2022
    Assignee: SUMCO CORPORATION
    Inventors: Naoki Matsushima, Ryusuke Yokoyama, Hideki Sakamoto, Wataru Sugimura
  • Patent number: 11079345
    Abstract: An X-ray inspection device of the present invention includes a sample placement unit 11 for placing a sample as an inspection target therein, a sample placement unit positioning mechanism 30 for moving the sample placement unit 11, a goniometer 20 including first and second rotation members 22, 23 that rotate independently of each other, an X-ray irradiation unit 40 installed on the first rotation member 22, and a two-dimensional X-ray detector 50 installed on the second rotation member 23. The sample placement unit positioning mechanism 30 includes a ? rotation mechanism 35 for rotating the sample placement unit 11 and a ?-axis about a ?-axis that is orthogonal to a ?s-axis and a ?d-axis at a measurement point P and extends horizontally.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: August 3, 2021
    Assignee: RIGAKU CORPORATION
    Inventors: Naoki Matsushima, Kiyoshi Ogata, Kazuhiko Omote, Sei Yoshihara, Yoshiyasu Ito, Hiroshi Motono, Hideaki Takahashi, Akifusa Higuchi, Shiro Umegaki, Shigematsu Asano, Ryotaro Yamaguchi, Katsutaka Horada
  • Publication number: 20210116399
    Abstract: This fluorescent X-ray analysis apparatus is provided with an X-ray irradiation unit 20 for irradiating a sample S with: X-rays, having an energy that exceeds the energy absorption edge value of Ag which is selected as a measurement target element, and that is no greater than the energy absorption edge value of Sn which is an adjacent element having a higher energy absorption edge value than Ag; and X-rays having an energy exceeding the energy absorption edge value of Sn which is selected as a measurement target element.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Applicant: RIGAKU CORPORATION
    Inventors: Kiyoshi Ogata, Sei Yoshihara, Shuichi Kato, Kazuhiko Omote, Hiroshi Motono, Naoki Matsushima
  • Publication number: 20210063326
    Abstract: An X-ray inspection device of the present invention includes a sample placement unit 11 for placing a sample as an inspection target therein, a sample placement unit positioning mechanism 30 for moving the sample placement unit 11, a goniometer 20 including first and second rotation members 22, 23 that rotate independently of each other, an X-ray irradiation unit 40 installed on the first rotation member 22, and a two-dimensional X-ray detector 50 installed on the second rotation member 23. The sample placement unit positioning mechanism 30 includes a ? rotation mechanism 35 for rotating the sample placement unit 11 and a ?-axis about a ?-axis that is orthogonal to a ?s-axis and a ?d-axis at a measurement point P and extends horizontally.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 4, 2021
    Applicant: RIGAKU CORPORATION
    Inventors: Naoki Matsushima, Kiyoshi Ogata, Kazuhiko Omote, Sei Yoshihara, Yoshiyasu Ito, Hiroshi Motono, Hideaki Takahashi, Akifusa Higuchi, Shiro Umegaki, Shigematsu Asano, Ryotaro Yamaguchi, Katsutaka Horada
  • Publication number: 20200407875
    Abstract: A method of controlling a convection pattern of a silicon melt includes applying a horizontal magnetic field having an intensity of 0.2 tesla or more to the silicon melt in a rotating quartz crucible to fix a direction of a convection flow in a plane orthogonal to an application direction of the horizontal magnetic field in the silicon melt, the horizontal magnetic field being applied so that a central magnetic field line passes through a point horizontally offset from a center axis of the quartz crucible by 10 mm or more.
    Type: Application
    Filed: February 27, 2019
    Publication date: December 31, 2020
    Applicant: SUMCO CORPORATION
    Inventors: Naoki MATSUSHIMA, Ryusuke YOKOYAMA, Hideki SAKAMOTO, Wataru SUGIMURA
  • Publication number: 20200399783
    Abstract: A convection pattern control method includes: heating a silicon melt in a quartz crucible using a heating portion; and applying a horizontal magnetic field to the silicon melt in the quartz crucible being rotated. In the heating of the silicon, the silicon melt is heated with the heating portion whose heating capacity differs on both sides across an imaginary line passing through a center axis of the quartz crucible and being in parallel to a central magnetic field line of the horizontal magnetic field when the quartz crucible is viewed from vertically above. In the applying of the horizontal magnetic field, the horizontal magnetic field of 0.2 tesla or more is applied to fix a direction of a convection flow in a single direction in a plane orthogonal to an application direction of the horizontal magnetic field in the silicon melt.
    Type: Application
    Filed: February 27, 2019
    Publication date: December 24, 2020
    Applicant: SUMCO CORPORATION
    Inventors: Hideki SAKAMOTO, Wataru SUGIMURA, Ryusuke YOKOYAMA, Naoki MATSUSHIMA
  • Patent number: 9470863
    Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: October 18, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Toshiaki Takai, Yoshinori Sunaga, Masataka Sato, Kinya Yamazaki, Norio Chujo, Naoki Matsushima
  • Publication number: 20150286017
    Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.
    Type: Application
    Filed: April 1, 2015
    Publication date: October 8, 2015
    Applicant: Hitachi Metals, Ltd.
    Inventors: Toshiaki TAKAI, Yoshinori SUNAGA, Masataka SATO, Kinya YAMAZAKI, Norio CHUJO, Naoki MATSUSHIMA
  • Patent number: 8437228
    Abstract: A thermally assisted magnetic recording head with highly efficient optical coupling, while guiding a laser beam from a semiconductor laser element, i.e., a light source, to a leading end thereof, eliminating an influence due to heat generated by the element, and having excellent floating characteristics. The thermally assisted magnetic recording head includes a substrate 2 having a first optical waveguide 1, a semiconductor laser element 100, and a slider 4 having a second optical waveguide 3 formed on an end surface. The semiconductor laser element 100 is fixed on the substrate 2 so that light emitted from the element 100 propagates through the first optical waveguide 1 and a slider 4 is fixed on the substrate 2 so that light emitted from the first optical waveguide 1 propagates through the second optical waveguide 3. High optical coupling efficiency is then achieved, while ensuring both heat-dissipating and floating characteristics.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: May 7, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Naoki Matsushima, Satoshi Arai, Takuya Matsumoto, Jun-ichiro Shimizu, Irizo Naniwa
  • Patent number: 8437584
    Abstract: In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 7, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Yasunobu Matsuoka, Toshiki Sugawara, Koichiro Adachi, Naoki Matsushima, Saori Hamamura, Madoka Minagawa, Norio Chujo
  • Patent number: 8406581
    Abstract: A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devices 2a and 2b are disposed on a circuit board 1, so that they are optically coupled with optical guides 11 formed on the circuit board 1, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film 31, and an electric wiring layer 3 is laminated, so that the electrodes of the optical devices 2 and wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element 4; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: March 26, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Saori Hamamura, Naoki Matsushima, Madoka Minagawa, Satoshi Kaneko, Norio Chujo, Yasunobu Matsuoka, Toshiki Sugawara, Tsutomu Kono
  • Patent number: 8401347
    Abstract: A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI (device) having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: March 19, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Naoki Matsushima, Norio Chujo, Yasunobu Matsuoka, Toshiki Sugawara, Madoka Minagawa, Saori Hamamura, Satoshi Kaneko, Tsutomu Kono
  • Patent number: 8300503
    Abstract: In a thermally assisted magnetic recording head having a light source and a waveguide to lead a laser beam radiated from the light source to a front end of the magnetic head, while blocking an adverse effect of heat generated in the light source and securing a good floating characteristic, the light source and the magnetic head are optically coupled with high efficiency and the magnetic head itself is reduced in size. This invention provides a reflection mirror that is formed of a part or whole of one inclined end surface of the semiconductor laser mounted on the first submount. Near one end surface of the slider is provided the optical waveguide that pierces through the slider in a direction of the thickness thereof.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: October 30, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Satoshi Arai, Naoki Matsushima, Irizo Naniwa, Junichiro Shimizu
  • Patent number: 8269301
    Abstract: Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided. A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: September 18, 2012
    Assignee: Hitachi Kyowa Engineering Co., Ltd.
    Inventors: Shohei Hata, Eiji Sakamoto, Naoki Matsushima, Hideaki Takemori, Masatoshi Seki
  • Publication number: 20120128292
    Abstract: A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devices 2a and 2b are disposed on a circuit board 1, so that they are optically coupled with optical guides 11 formed on the circuit board 1, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film 31, and an electric wiring layer 3 is laminated, so that the electrodes of the optical devices 2 and wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element 4; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing.
    Type: Application
    Filed: June 2, 2010
    Publication date: May 24, 2012
    Applicant: Hitachi-Ltd.
    Inventors: Saori Hamamura, Naoki Matsushima, Madoka Minagawa, Satoshi Kaneko, Norio Chujo, Yasunobu Matsuoka, Toshiki Sugawara, Tsutomu Kono
  • Patent number: 8110907
    Abstract: A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: February 7, 2012
    Assignee: Elpida Memory, Inc.
    Inventors: Masahiro Yamaguchi, Emi Sawayama, Hiroshi Oyama, Shigeharu Tsunoda, Yasuo Amano, Naoki Matsushima
  • Patent number: 8103332
    Abstract: A head-coupled holder the optical measurement of a living body that securely brings a light irradiation module and a light detection module in close contact with the scalp of a person to be examined, and gives the person no excessive pressure feeling. Each light irradiation module and light detection module includes a contactor having a contact portion that comes in contact with the scalp at a leading end thereof, and exposes a leading end of a light guide to the contact portion to form the light guide, and a package having a lower portion to which the contactor is attached. The contactor is fixed to the lower portion of the package through an elastic body, and the package is fixed to an inner upper wall of the insertion hole with a series structure of the elastic body and the viscoelastic body.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: January 24, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Masashi Kiguchi, Naoki Matsushima, Hirokazu Atsumori
  • Publication number: 20110237001
    Abstract: A technique for evaluating a semiconductor chip is provided. The semiconductor chip is mounted on a mount substrate, the semiconductor chip laminating on one surface of a silicone substrate, at least any of a metal wiring film 101 serving as a resistance temperature detector made up of multiple regions and a metal wiring film 102 serving as a heater made up of one or more regions, and an electrode 103 for connecting the metal wiring film 101 and the metal wiring film 102 with the mount substrate. Then, the metal wiring film 101 is electrically connected with an ammeter and a voltmeter, and the metal wiring film 102 is electrically connected with a power source, thereby providing an evaluation system which is capable of evaluating temperature measurement, heating, and temperature profile in each of the regions on the semiconductor chip.
    Type: Application
    Filed: February 24, 2011
    Publication date: September 29, 2011
    Inventors: Takehiko HASEBE, Masako Kato, Yoshihide Yamaguchi, Masashi Nishiki, Naoki Matsushima, Teiichi Inada, Rei Yamamoto, Hiroyuki Temmei, Ukyo Ikeda
  • Patent number: 8027553
    Abstract: An optical element amounted structure includes an optical element having an electrode such as a bump formed on a surface thereof, and a substrate having an electrode that is joined to the optical element formed on the surface. The structure of the electrode of the substrate has a substantially ring configuration or a substantially ring configuration a part of which is notched, and the optical element and the substrate are joined to each other in a configuration where a joining material such as a bump is inserted into an opening portion.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: September 27, 2011
    Assignee: Hitachi Cable, Ltd.
    Inventors: Toshiaki Takai, Naoki Matsushima, Koki Hirano, Hiroki Yasuda