Patents by Inventor Naoki SUEMATSU

Naoki SUEMATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and electronic device
    Patent number: 11013102
    Abstract: A printed circuit board includes a printed wiring board, an electronic element provided on a mounting surface of the printed wiring board, and a heat radiation member provided on an opposite side of a side on which the printed wiring board is positioned with respect to the electronic element, the heat radiation member thermally connected to the electronic element. An end portion of the heat radiation member is disposed closer to the printed wiring board than a connection portion with the electronic element in the heat radiation member, in a state where a space is provided between the end portion and the printed wiring board.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: May 18, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Naoki Suematsu
  • PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
    Publication number: 20200375017
    Abstract: A printed circuit board includes a printed wiring board, an electronic element provided on a mounting surface of the printed wiring board, and a heat radiation member provided on an opposite side of a side on which the printed wiring board is positioned with respect to the electronic element, the heat radiation member thermally connected to the electronic element. An end portion of the heat radiation member is disposed closer to the printed wiring board than a connection portion with the electronic element in the heat radiation member, in a state where a space is provided between the end portion and the printed wiring board.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Naoki SUEMATSU
  • Printed circuit board and electronic device
    Patent number: 10779390
    Abstract: A printed circuit board includes a printed wiring board, an electronic element provided on a mounting surface of the printed wiring board, and a heat radiation member provided on an opposite side of a side on which the printed wiring board is positioned with respect to the electronic element, the heat radiation member thermally connected to the electronic element. An end portion of the heat radiation member is disposed closer to the printed wiring board than a connection portion with the electronic element in the heat radiation member, in a state where a space is provided between the end portion and the printed wiring board.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: September 15, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Naoki Suematsu
  • PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
    Publication number: 20190132939
    Abstract: A printed circuit board includes a printed wiring board, an electronic element provided on a mounting surface of the printed wiring board, and a heat radiation member provided on an opposite side of a side on which the printed wiring board is positioned with respect to the electronic element, the heat radiation member thermally connected to the electronic element. An end portion of the heat radiation member is disposed closer to the printed wiring board than a connection portion with the electronic element in the heat radiation member, in a state where a space is provided between the end portion and the printed wiring board.
    Type: Application
    Filed: October 29, 2018
    Publication date: May 2, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Naoki SUEMATSU