Patents by Inventor Naoki Taya

Naoki Taya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220180773
    Abstract: The present invention relates to a peel detection label that is a laminate having a backing, a pattern layer formed on a part of a surface of the backing, and a pressure sensitive adhesive laminate in this order, the pressure sensitive adhesive laminate having at least an intermediate layer and a pressure sensitive adhesive layer, wherein a tensile modulus Et at 23° C. of the backing is 50 MPa or greater and 1000 MPa or less.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 9, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Yumiko AMINO, Naoki TAYA
  • Publication number: 20220176642
    Abstract: A bonding method for bonding an adherend with a high-frequency dielectric heating adhesive sheet is provided. The adherend includes a fluorine-containing surface at least containing fluorine on a surface thereof. The high-frequency dielectric heating adhesive sheet includes a high-frequency dielectric adhesive layer including a thermoplastic resin and a dielectric filler. A surface free energy of the high-frequency dielectric adhesive layer is in a range from 15 mJ/m2 to 30 mJ/m2. A melting point of the high-frequency dielectric adhesive layer is in a range from 110 degrees C. to 300 degrees C. The bonding method includes bringing the fluorine-containing surface of the adherend into contact with the high-frequency dielectric adhesive layer and applying a high-frequency wave to the high-frequency dielectric adhesive layer to bond the high-frequency dielectric heating adhesive sheet to the fluorine-containing surface.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 9, 2022
    Inventors: Haruka SASAKI, Takuto AOKI, Naoki TAYA
  • Publication number: 20200010730
    Abstract: A dielectric welding film for welding a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including at least one resin selected from the group consisting of an olefin-vinyl acetate copolymer and a maleic anhydride-modified polyolefin, the olefin-vinyl acetate copolymer containing 2 mass % or more constituent unit derived from vinyl acetate.
    Type: Application
    Filed: February 8, 2018
    Publication date: January 9, 2020
    Inventors: Naoki TAYA, Masakazu ISHIKAWA
  • Publication number: 20190352546
    Abstract: A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %.
    Type: Application
    Filed: February 8, 2018
    Publication date: November 21, 2019
    Inventors: Naoki TAYA, Masakazu ISHIKAWA
  • Patent number: 10438831
    Abstract: A base film for dicing sheets that is used in a dicing sheet comprising the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film comprises at least a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film for dicing sheets is wound up. The second resin layer has a crystallinity of 28% to 45%. The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film for dicing sheets is 25% to 80%.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: October 8, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Naoki Taya, Yuki Nito, Yusuke Miyatake
  • Publication number: 20170121570
    Abstract: A base film for dicing sheets includes the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film includes a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film is wound up. The second resin layer has a crystallinity of 28% to 45% The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film is 20% to 60%.
    Type: Application
    Filed: June 18, 2014
    Publication date: May 4, 2017
    Inventors: Naoki TAYA, Yuki NITO, Yusuke MIYATAKE
  • Publication number: 20170121569
    Abstract: A base film for dicing sheets that is used in a dicing sheet comprising the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film comprises at least a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film for dicing sheets is wound up. The second resin layer has a crystallinity of 28% to 45%, The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film for dicing sheets is 25% to 80%.
    Type: Application
    Filed: June 18, 2014
    Publication date: May 4, 2017
    Inventors: Naoki TAYA, Yuki NITO, Yusuke MIYATAKE
  • Publication number: 20170036431
    Abstract: Base film for a dicing sheet comprises a cutting-fragment suppression layer and an expandable layer laminated on one main surface of the cutting-fragment suppression layer. The expandable layer comprises at least one resin-based unit layer. The at least one resin-based unit layer includes a resin-based unit layer that is disposed nearest to the cutting-fragment suppression layer. The resin-based unit layer comprises a linear polyethylene, polypropylene, and thermoplastic elastomer. The cutting-fragment suppression layer comprises a ring-containing resin that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The base film for such a dicing sheet is excellent in the expandability and recoverability.
    Type: Application
    Filed: March 11, 2015
    Publication date: February 9, 2017
    Inventors: Junichi NAKAMURA, Yusuke MIYATAKE, Naoki TAYA, Takeshi KONDO
  • Patent number: 9558983
    Abstract: A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object without imparting physical energy, such as electron beam or ? ray. The base film for a dicing sheet comprises a resin layer. The resin layer comprises: a norbornene-based resin that is a thermoplastic resin having a norbornene-based compound as at least one type of monomer; and an olefin-based thermoplastic resin other than the norbornene-based resin. The norbornene-based resin in the resin layer has a content of more than 3.0 mass %. A dicing sheet is also provided which comprises: the base film for a dicing sheet; and a pressure-sensitive adhesive layer placed on a surface of the film at the resin layer side.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: January 31, 2017
    Assignee: LINTEC CORPORATION
    Inventors: Naoki Taya, Masashi Ueda, Yosuke Sato, Masaharu Ito
  • Patent number: 9546302
    Abstract: A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object without imparting physical energy, such as electron beam or ? ray. The base film for a dicing sheet comprises a resin layer. The resin layer comprises: a ring-containing resin that is a thermoplastic resin having a monomer, as a constitutional unit, having at least one type of an aromatic ring and an aliphatic ring; and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The ring-containing resin in the resin layer has a content of more than 3.0 mass %. A dicing sheet is also provided which comprises: the base film for a dicing sheet; and a pressure-sensitive adhesive layer placed on the base film.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: January 17, 2017
    Assignee: LINTEC CORPORATION
    Inventors: Naoki Taya, Masashi Ueda, Yosuke Sato, Masaharu Ito
  • Patent number: 9525091
    Abstract: Protective sheet 1 for solar cells comprises a base material 11 and a thermoplastic resin layer 12 laminated on at least one surface of the base material 11. The thermoplastic resin layer 12 comprises a first layer 121 laminated on the base material 11 and a second layer 122 laminated on the first layer 121. The first layer 121 contains as the main component a copolymer of ethylene and at least one type selected from the group consisting of (meth)acrylic acid, (meth)acrylic acid ester, glycidyl (meth)acrylate and vinyl acetate. The second layer 122 contains an olefin-based resin as the main component. The protective sheet 1 for solar cells has excellent adhesiveness between the base material and the thermoplastic resin layer and can suppress the warping caused in a solar cell module.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: December 20, 2016
    Assignee: LINTEC CORPORATION
    Inventors: Yasunari Takanashi, Naoki Taya, Marina Temchenko, David William Avison
  • Publication number: 20160297179
    Abstract: A base film (2) of a dicing sheet includes a cutting-fragment suppression layer (A) and an expandable layer (B) laminated on one main surface of the cutting-fragment suppression layer (A). The expandable layer (B) has a laminate structure of a plurality of resin-based sublayer, including a resin-based sublayer (B1) located nearest to the cutting-fragment suppression layer (A) and a resin-based sublayer (B2) that is at least one of other resin-based sublayers than the resin-based sublayer (B1). The resin-based sublayer (B1) comprises a linear polyethylene as a primary resin. The resin-based sublayer (B2) comprises an ethylene-(meth)acrylic acid series copolymer as a primary resin. The cutting-fragment suppression layer (A) comprises a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).
    Type: Application
    Filed: November 7, 2014
    Publication date: October 13, 2016
    Inventors: Junichi Nakamura, Kentaro Miyazaki, Naoki Taya
  • Publication number: 20160297180
    Abstract: A base film (2) includes an expandable layer (B) laminated on a cutting-fragment suppression layer (A) and having a laminate structure of a plurality of resin-based sublayers. The resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R1) after 5 minutes of 10%-stretching. The resin-based sublayer (B2) other than the resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R2) after 5 minutes of 10%-stretching. The cutting-fragment suppression layer (A) contains a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).
    Type: Application
    Filed: November 7, 2014
    Publication date: October 13, 2016
    Inventors: Junichi NAKAMURA, Kentaro MIYAZAKI, Naoki TAYA
  • Patent number: 9315692
    Abstract: A base material film used for a dicing sheet, the dicing sheet including the base material film and a pressure-sensitive adhesive layer laminated on one surface of the base material film. The base material film includes a single layer of resin film or multiple layers of resin films, at least the resin film in contact with the pressure-sensitive adhesive layer being formed from a resin composition containing ethylene-(meth)acrylic acid copolymer as a main constituent, the resin composition further containing 0.3 to 17.0 parts by mass of an epoxy compound based on 100 parts by mass of the ethylene-(meth)acrylic acid copolymer. The dicing sheet that uses the base material film does not require application of physical energy such as an electron beam or a ?-ray, and can be reduced in dicing dust that is generated during the dicing of a cut object.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: April 19, 2016
    Assignee: LINTEC CORPORATION
    Inventors: Naoki Taya, Takashi Morioka
  • Publication number: 20150357225
    Abstract: A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object in the full-cut dicing without imparting physical energy, such as electron beam or ? ray, and which has an enhanced expanding property in the expanding process. The base film for a dicing sheet comprises a resin layer that contains a polyethylene and an ethylene-tetracyclododecene copolymer. A dicing sheet that comprises the base film for a dicing sheet is also provided.
    Type: Application
    Filed: March 4, 2013
    Publication date: December 10, 2015
    Inventors: Naoki TAYA, Masashi UEDA, Masaharu ITO
  • Publication number: 20150348819
    Abstract: A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a norbornene-based resin (a1) that is a thermoplastic resin containing a structural unit derived from a norbornene-based compound; a styrene-based elastomer (a2); and an olefin-based thermoplastic resin (a3) other than the norbornene-based resin (a1) and other than the styrene-based elastomer (a2). The dicing sheet base film suppresses the occurrence of dicing debris, in particular filament-like dicing debris, during the dicing of a cut object without imparting physical energy such as electron rays and ? rays, and has sufficient expandability in the expanding process.
    Type: Application
    Filed: October 9, 2013
    Publication date: December 3, 2015
    Applicant: Lintec Corporation
    Inventors: Naoki TAYA, Masashi UEDA, Masaharu ITO
  • Publication number: 20150348820
    Abstract: A dicing sheet base film includes a resin layer (A). The resin layer (A) contains: a polyethylene (a1) that has a density of 0.900 g/cm3 or more; and a styrene-based elastomer (a2). The polyethylene (a1) has a content of 50 mass % or more and 90 mass % or less to a total resin component contained in the resin layer (A), while the styrene-based elastomer (a2) has a content of 10 mass % or more and 50 mass % or less to the total resin component. The dicing sheet base film suppresses the occurrence of dicing debris during the dicing of a cut object without imparting physical energy such as electron rays and ? rays, and has sufficient expandability in the expanding process.
    Type: Application
    Filed: October 9, 2013
    Publication date: December 3, 2015
    Inventors: Naoki TAYA, Masashi UEDA, Masaharu ITO
  • Patent number: 9102833
    Abstract: Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: August 11, 2015
    Assignee: LINTEC CORPORATION
    Inventors: Masaharu Ito, Wataru Iwaya, Hironobu Fujimoto, Naoki Taya
  • Patent number: 9023913
    Abstract: The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: May 5, 2015
    Assignee: Lintec Corporation
    Inventors: Masaharu Ito, Wataru Iwaya, Hironobu Fujimoto, Naoki Taya
  • Patent number: 8980399
    Abstract: A pressure-sensitive adhesive sheet includes a base material and a pressure-sensitive adhesive layer and is formed therein with a plurality of through-holes passing through from one surface to the other surface, wherein the base material comprises a resin composition, and the resin composition contains: 50 to 88 wt % of a polyolefin-based resin (A); 10 to 48 wt % of a styrene-based resin and/or an acrylic-based resin (B) excluding the polyolefin-based resin (A); and 2.0 to 30 wt % of a pigment (C). According to such pressure-sensitive adhesive sheet, air entrapments and blisters can be prevented or removed via the through-holes and the inner diameter of the through-holes is suppressed from expanding, and thereby the pressure-sensitive adhesive sheet has a good appearance.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: March 17, 2015
    Assignee: Lintec Corporation
    Inventors: Takashi Morioka, Naoki Taya