Patents by Inventor Naoki Toda

Naoki Toda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120286451
    Abstract: The injection molding method for injecting a resin into a cavity formed within a mold is provided with a heating step in which the temperature of a cavity surface forming the cavity of the mold is heated to a temperature equal to or higher than a heat distortion temperature of the resin and an injection step in which after the heating step, during a decrease in temperature of the cavity surface of the mold, the resin is injected into the cavity.
    Type: Application
    Filed: March 18, 2010
    Publication date: November 15, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD
    Inventors: Naoki Toda, Satoshi Imaeda, Toshihiko Kariya, Takeshi Yamaguchi
  • Publication number: 20120211921
    Abstract: The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.
    Type: Application
    Filed: April 7, 2010
    Publication date: August 23, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.
    Inventors: Naoki Toda, Satoshi Imaeda, Takeshi Yamaguchi, Toshihiko Kariya
  • Patent number: 8035979
    Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 11, 2011
    Assignees: CMK Corporation, Renesas Eastern Japan Semiconductor, Inc.
    Inventors: Yutaka Yoshino, Takahiro Shirai, Shinji Kadono, Mineo Kawamoto, Minoru Enomoto, Masakatsu Goto, Makoto Araki, Naoki Toda
  • Publication number: 20110090657
    Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
    Type: Application
    Filed: December 13, 2010
    Publication date: April 21, 2011
    Applicants: CMK CORPORATION, RENESAS EASTERN JAPAN SEMICONDUCTOR INC.
    Inventors: Yutaka YOSHINO, Takahiro Shirai, Shinji Kadono, Mineo Kawamoto, Minoru Enomoto, Masakatsu Goto, Makoto Araki, Naoki Toda
  • Publication number: 20110049762
    Abstract: An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.
    Type: Application
    Filed: August 5, 2009
    Publication date: March 3, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY Co., Ltd.
    Inventors: Toshihiko Kariya, Satoshi Miyagawa, Naoki Toda, Gen Hamada, Michitaka Hattori
  • Patent number: 7894200
    Abstract: The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: February 22, 2011
    Assignees: CMK Corporation, Renesas Eastern Japan Semiconductor, Inc.
    Inventors: Yutaka Yoshino, Takahiro Shirai, Shinji Kadono, Mineo Kawamoto, Minoru Enomoto, Masakatsu Goto, Makoto Araki, Naoki Toda
  • Patent number: 7323127
    Abstract: A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: January 29, 2008
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Osamu Muranaka, Naoki Toda, Masahiro Bessho
  • Publication number: 20070184139
    Abstract: A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained.
    Type: Application
    Filed: February 21, 2007
    Publication date: August 9, 2007
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Osamu Muranaka, Naoki Toda, Masahiro Bessho, Satoshi Miyagawa, Koji Kubota
  • Publication number: 20050179157
    Abstract: A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 18, 2005
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Osamu Muranaka, Naoki Toda, Masahiro Bessho, Satoshi Miyagawa, Koji Kubota
  • Patent number: 6511621
    Abstract: A method for injection-molding a plastics propeller fan by using a fixed-side mold section and movable-side mold section, comprises the steps of providing a movable core at an area corresponding to a thicker portion of a blade section of the propeller fan; after a predetermined amount of plastics material has been injected into a blade space of a mold cavity defined by the fixed-side mold section, movable-side metal section and movable core and conforming to the propeller fan, pushing out the movable core into the mold cavity and, after this step, bringing the movable core back to a normal position conforming to a mold shape defining the blade space and forming a proper fan.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: January 28, 2003
    Assignees: Mitsubishi Heavy Industries, Ltd., Yagyu Rubber Co., Ltd., Idemitsu Petrochemical Co., Ltd.
    Inventors: Atsushi Suzuki, Masashi Inoue, Fumio Kondoh, Naoki Toda, Matsuo Sakuma, Hirofumi Gouda, Manabu Nomura
  • Publication number: 20020089078
    Abstract: A method for injection-molding a plastics propeller fan by using a fixed-side mold section and movable-side mold section, comprises the steps of providing a movable core at an area corresponding to a thicker portion of a blade section of the propeller fan; after a predetermined amount of plastics material has been injected into a blade space of a mold cavity defined by the fixed-side mold section, movable-side metal section and movable core and conforming to the propeller fan, pushing out the movable core into the mold cavity and, after this step, bringing the movable core back to a normal position conforming to a mold shape defining the blade space and forming a proper fan.
    Type: Application
    Filed: January 11, 2001
    Publication date: July 11, 2002
    Inventors: Atsushi Suzuki, Masashi Inoue, Fumio Kondoh, Naoki Toda, Matsuo Sakuma, Hirofumi Gouda, Manabu Nomura
  • Patent number: 5615000
    Abstract: The present invention provides a conveying apparatus comprising a plurality of rotary members; a frame for supporting the plurality of rotary members; and an endless belt wound around the plurality of rotary members and moved by rotation of the rotary members to convey a sheet, the belt including a core embedded within the belt and formed by weaving threads extending in a circumferential direction of the belt and threads extending in a widthwise direction of the belt; and wherein, in order to cancel a deflection force of the belt generated by the cause of distortion of the frame when the rotary members are rotated to shift the belt, each of the threads extending in the circumferential direction in the core has a constant twist direction to generate a deflection force opposite to the aforementioned deflection force.
    Type: Grant
    Filed: March 9, 1993
    Date of Patent: March 25, 1997
    Assignees: Canon Kabushiki Kaisha, Nitto Kogyo Co., Ltd.
    Inventors: Noriyoshi Ueda, Naoki Toda
  • Patent number: 5240531
    Abstract: An endless conveyor belt that has a nonexpansible and noncontractive core member and an elastic laminate layer bonded to one of the core surfaces. The core member and the laminate layer are preformed as an endless belt, respectively, and bonded together to constitute an endless conveyor belt. The conveyor belt is used for conveying an original paper to a predetermined position on a contact glass where the original paper is operated a predetermined treatment. The conveyor belt is assembled within an ADF in cooperation with belt rollers to rotary drive the conveyor belt. The belt is formed by a method that includes: a core belt forming process in which an endless core belt is formed from a nonexpansible and noncontractive material; a laminate layer forming process in which a laminate layer in a form of an endless belt is formed from an elastic thermoplastic material; and a bonding process in which the laminate layer is bonded to at least one of the surfaces of the endless core belt.
    Type: Grant
    Filed: October 20, 1989
    Date of Patent: August 31, 1993
    Assignees: Ricoh Company, Ltd., Nitto Kogyo Co., Ltd.
    Inventors: Naoki Toda, Katuo Akimoto, Takashi Taruki, Goro Mori