Patents by Inventor Naoki Toda
Naoki Toda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130072624Abstract: A molded resin product for a vehicle structural member or an aircraft structural member according to the present invention is formed by injection-molding of thermoplastic resin feedstock containing reinforcement fibers by using a screw provided at a leading end portion thereof with a mixer protruding in a radial direction. In the injection-molded product, the reinforcement fiber content ratio is greater than or equal to 20% by weight and the weight-average fiber length of the reinforcement fibers in an evaluation target area having a certain size is greater than or equal to 1 mm and less than or equal to 3 mm.Type: ApplicationFiled: November 8, 2010Publication date: March 21, 2013Inventors: Toshihiko Kariya, Naoki Toda, Munehiro Nobuta
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Patent number: 8360766Abstract: An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.Type: GrantFiled: August 5, 2009Date of Patent: January 29, 2013Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.Inventors: Toshihiko Kariya, Satoshi Miyagawa, Naoki Toda, Gen Hamada, Michitaka Hattori
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Publication number: 20130001817Abstract: A method for manufacturing a fiber-reinforced composite material of the present invention includes: the step (a) of placing a non-woven fabric N made of a reinforcement fiber in a movable mold 12; and the step (b) of moving the movable mold 12 toward a fixed mold 11 to close the mold and then injecting a thermoplastic resin into the mold to obtain a molded article formed of the non-woven fabric N and the thermoplastic resin. The mechanical strength of the obtained fiber-reinforced composite material can be enhanced by applying an injection compression molding process as the injection molding process in the step (b).Type: ApplicationFiled: March 25, 2011Publication date: January 3, 2013Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.Inventors: Masahiro Bessho, Shiki Matsuo, Wataru Nishimura, Toshihiko Kariya, Naoki Toda
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Publication number: 20130000606Abstract: A fuel injection control system for an internal combustion engine is provided which is designed to perform pilot injection of fuel into the engine through a fuel injector prior to main injection. The system monitors a combustion state parameter representing a combustion state of the fuel within a combustion chamber of the engine which has been sprayed in the event of the pilot injection. When the combustion state parameter is determined as lying out of a stable combustion range where the fuel is to burn stably, the system changes the number of pilot injections to be executed prior to the main injection and/or the quantity of the fuel to be sprayed in each pilot injection, thereby enhancing the ignitability of the fuel in the pilot injection.Type: ApplicationFiled: July 2, 2012Publication date: January 3, 2013Applicant: DENSO CORPORATIONInventors: Hiroki Watanabe, Naoki Toda, Shinya Hoshi, Satoru Sasaki
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Publication number: 20120286451Abstract: The injection molding method for injecting a resin into a cavity formed within a mold is provided with a heating step in which the temperature of a cavity surface forming the cavity of the mold is heated to a temperature equal to or higher than a heat distortion temperature of the resin and an injection step in which after the heating step, during a decrease in temperature of the cavity surface of the mold, the resin is injected into the cavity.Type: ApplicationFiled: March 18, 2010Publication date: November 15, 2012Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTDInventors: Naoki Toda, Satoshi Imaeda, Toshihiko Kariya, Takeshi Yamaguchi
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Publication number: 20120211921Abstract: The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.Type: ApplicationFiled: April 7, 2010Publication date: August 23, 2012Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.Inventors: Naoki Toda, Satoshi Imaeda, Takeshi Yamaguchi, Toshihiko Kariya
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Patent number: 8035979Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.Type: GrantFiled: December 13, 2010Date of Patent: October 11, 2011Assignees: CMK Corporation, Renesas Eastern Japan Semiconductor, Inc.Inventors: Yutaka Yoshino, Takahiro Shirai, Shinji Kadono, Mineo Kawamoto, Minoru Enomoto, Masakatsu Goto, Makoto Araki, Naoki Toda
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Publication number: 20110090657Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.Type: ApplicationFiled: December 13, 2010Publication date: April 21, 2011Applicants: CMK CORPORATION, RENESAS EASTERN JAPAN SEMICONDUCTOR INC.Inventors: Yutaka YOSHINO, Takahiro Shirai, Shinji Kadono, Mineo Kawamoto, Minoru Enomoto, Masakatsu Goto, Makoto Araki, Naoki Toda
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Publication number: 20110049762Abstract: An injection molding machine is provided with a mold forming a cavity into which a resin is injected, a liquid supplying device which supplies a liquid continuously to an internal flow channel of the mold during a preparation period prior to injection of the resin and an injection period in which the resin after the preparation period is injected, an electricity supplying device which supplies electricity to an electric heater arranged on the mold at least during a part of the preparation period, thereby heating the mold, and a controller which carries out a predetermined procedure for making different a temperature of a liquid in the internal flow channel between the preparation period and the injection period.Type: ApplicationFiled: August 5, 2009Publication date: March 3, 2011Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY Co., Ltd.Inventors: Toshihiko Kariya, Satoshi Miyagawa, Naoki Toda, Gen Hamada, Michitaka Hattori
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Patent number: 7894200Abstract: The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element.Type: GrantFiled: November 28, 2006Date of Patent: February 22, 2011Assignees: CMK Corporation, Renesas Eastern Japan Semiconductor, Inc.Inventors: Yutaka Yoshino, Takahiro Shirai, Shinji Kadono, Mineo Kawamoto, Minoru Enomoto, Masakatsu Goto, Makoto Araki, Naoki Toda
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Patent number: 7323127Abstract: A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained.Type: GrantFiled: January 31, 2005Date of Patent: January 29, 2008Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Osamu Muranaka, Naoki Toda, Masahiro Bessho
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Publication number: 20070184139Abstract: A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained.Type: ApplicationFiled: February 21, 2007Publication date: August 9, 2007Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Osamu Muranaka, Naoki Toda, Masahiro Bessho, Satoshi Miyagawa, Koji Kubota
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Publication number: 20050179157Abstract: A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained.Type: ApplicationFiled: January 31, 2005Publication date: August 18, 2005Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Osamu Muranaka, Naoki Toda, Masahiro Bessho, Satoshi Miyagawa, Koji Kubota
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Patent number: 6511621Abstract: A method for injection-molding a plastics propeller fan by using a fixed-side mold section and movable-side mold section, comprises the steps of providing a movable core at an area corresponding to a thicker portion of a blade section of the propeller fan; after a predetermined amount of plastics material has been injected into a blade space of a mold cavity defined by the fixed-side mold section, movable-side metal section and movable core and conforming to the propeller fan, pushing out the movable core into the mold cavity and, after this step, bringing the movable core back to a normal position conforming to a mold shape defining the blade space and forming a proper fan.Type: GrantFiled: January 11, 2001Date of Patent: January 28, 2003Assignees: Mitsubishi Heavy Industries, Ltd., Yagyu Rubber Co., Ltd., Idemitsu Petrochemical Co., Ltd.Inventors: Atsushi Suzuki, Masashi Inoue, Fumio Kondoh, Naoki Toda, Matsuo Sakuma, Hirofumi Gouda, Manabu Nomura
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Publication number: 20020089078Abstract: A method for injection-molding a plastics propeller fan by using a fixed-side mold section and movable-side mold section, comprises the steps of providing a movable core at an area corresponding to a thicker portion of a blade section of the propeller fan; after a predetermined amount of plastics material has been injected into a blade space of a mold cavity defined by the fixed-side mold section, movable-side metal section and movable core and conforming to the propeller fan, pushing out the movable core into the mold cavity and, after this step, bringing the movable core back to a normal position conforming to a mold shape defining the blade space and forming a proper fan.Type: ApplicationFiled: January 11, 2001Publication date: July 11, 2002Inventors: Atsushi Suzuki, Masashi Inoue, Fumio Kondoh, Naoki Toda, Matsuo Sakuma, Hirofumi Gouda, Manabu Nomura
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Patent number: 5615000Abstract: The present invention provides a conveying apparatus comprising a plurality of rotary members; a frame for supporting the plurality of rotary members; and an endless belt wound around the plurality of rotary members and moved by rotation of the rotary members to convey a sheet, the belt including a core embedded within the belt and formed by weaving threads extending in a circumferential direction of the belt and threads extending in a widthwise direction of the belt; and wherein, in order to cancel a deflection force of the belt generated by the cause of distortion of the frame when the rotary members are rotated to shift the belt, each of the threads extending in the circumferential direction in the core has a constant twist direction to generate a deflection force opposite to the aforementioned deflection force.Type: GrantFiled: March 9, 1993Date of Patent: March 25, 1997Assignees: Canon Kabushiki Kaisha, Nitto Kogyo Co., Ltd.Inventors: Noriyoshi Ueda, Naoki Toda
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Patent number: 5240531Abstract: An endless conveyor belt that has a nonexpansible and noncontractive core member and an elastic laminate layer bonded to one of the core surfaces. The core member and the laminate layer are preformed as an endless belt, respectively, and bonded together to constitute an endless conveyor belt. The conveyor belt is used for conveying an original paper to a predetermined position on a contact glass where the original paper is operated a predetermined treatment. The conveyor belt is assembled within an ADF in cooperation with belt rollers to rotary drive the conveyor belt. The belt is formed by a method that includes: a core belt forming process in which an endless core belt is formed from a nonexpansible and noncontractive material; a laminate layer forming process in which a laminate layer in a form of an endless belt is formed from an elastic thermoplastic material; and a bonding process in which the laminate layer is bonded to at least one of the surfaces of the endless core belt.Type: GrantFiled: October 20, 1989Date of Patent: August 31, 1993Assignees: Ricoh Company, Ltd., Nitto Kogyo Co., Ltd.Inventors: Naoki Toda, Katuo Akimoto, Takashi Taruki, Goro Mori