Patents by Inventor Naoko Tsuji

Naoko Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220002494
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Application
    Filed: August 4, 2021
    Publication date: January 6, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro KUWANA, Nobuhiko HARADA, Maya MASUI, Ichiro TAKASE, Shinji MAETANI, Naoko TSUJI
  • Publication number: 20210391165
    Abstract: An object of the present invention is to provide a technique suitable for achieving low wiring resistance and reducing a variation in the resistance value between semiconductor elements to be multilayered in a method of manufacturing a semiconductor device in which the semiconductor elements are multilayered through laminating semiconductor wafers via an adhesive layer. The method of the present invention includes first to third processes. In the first process, a wafer laminate Y is prepared, the wafer laminate Y having a laminated structure including a wafer 3, wafers 1T with a thickness from 1 to 20 um, and an adhesive layer 4 with a thickness from 0.5 to 4.5 ?m interposed between a main surface 3a of the wafer 3 and a back surface 1b of the wafer 1T. In the second process, holes extending from the main surface 1a of the wafer 1T and reaching a wiring pattern of the wafer 3 are formed by a predetermined etching treatment.
    Type: Application
    Filed: October 18, 2019
    Publication date: December 16, 2021
    Applicant: DAICEL CORPORATION
    Inventor: Naoko TSUJI
  • Publication number: 20210384184
    Abstract: Provided is a semiconductor device manufacturing method in which semiconductor elements are formed into multiple layers through the lamination of wafers in which the semiconductor elements are fabricated, the method being suited for efficiently creating multiple layers of thin wafers while suppressing warping of a wafer laminate. The method of the present invention includes a preparation step, a thinning step, a bonding step, a removal step, and a multilayering step. In the preparation step, a reinforced wafer is prepared, the reinforced wafer having a laminated structure that includes: a wafer including an element forming surface and a back surface opposite from the element forming surface; a supporting substrate; and a temporary adhesive layer for forming temporary adhesion, the temporary adhesive layer being provided between the element forming surface side of the wafer and the supporting substrate.
    Type: Application
    Filed: October 18, 2019
    Publication date: December 9, 2021
    Applicant: DAICEL CORPORATION
    Inventor: Naoko TSUJI
  • Publication number: 20210384183
    Abstract: Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin.
    Type: Application
    Filed: October 18, 2019
    Publication date: December 9, 2021
    Applicant: DAICEL CORPORATION
    Inventor: Naoko TSUJI
  • Publication number: 20210358867
    Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 18, 2021
    Applicant: DAICEL CORPORATION
    Inventors: Naoko TSUJI, Akira YAMAKAWA, Katsuhiko SUMITA
  • Publication number: 20210358884
    Abstract: Provided is a semiconductor device manufacturing method through which semiconductor elements are multilayered through the lamination of wafers in which the semiconductor elements are fabricated, the method thereof being suited for efficiently manufacturing semiconductor devices while realizing a large number of wafer lamination.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 18, 2021
    Applicant: DAICEL CORPORATION
    Inventor: Naoko TSUJI
  • Patent number: 11149118
    Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 19, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Hiroto Miyake, Naoko Tsuji, Akira Yamakawa
  • Patent number: 11111337
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 7, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Akihiro Kuwana, Nobuhiko Harada, Maya Masui, Ichiro Takase, Shinji Maetani, Naoko Tsuji
  • Patent number: 11066586
    Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 20, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Naoko Tsuji, Akira Yamakawa
  • Publication number: 20210139652
    Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.
    Type: Application
    Filed: April 26, 2018
    Publication date: May 13, 2021
    Applicant: DAICEL CORPORATION
    Inventors: Hiroto MIYAKE, Naoko TSUJI, Akira YAMAKAWA
  • Publication number: 20210134622
    Abstract: Provide are: a method for producing a laminate having an adhesive layer on one surface of a semiconductor wafer, with the adhesive layer being less likely to foam during wafer bonding under reduced pressure, curing of an adhesive being less likely to occur, and also allowing a tact time to be shortened; and an adhesive layer forming device to be used in the method. The adhesive layer forming device for forming an adhesive layer by removing a solvent in a coating film coated and formed on one surface of a semiconductor wafer includes: a lower plate on which the semiconductor wafer is placed; an upper cover configured to form a closed space together with the lower plate, the closed space having a volume of 10 liters or less; and pressure reducing means for reducing pressure in the closed space.
    Type: Application
    Filed: April 18, 2018
    Publication date: May 6, 2021
    Applicant: DAICEL CORPORATION
    Inventors: Yoshinori FUNAKI, Naoko TSUJI
  • Publication number: 20210111072
    Abstract: Provided is a method for manufacturing a semiconductor device suitable for achieving low wiring resistance between semiconductor elements that is bonded via an adhesive layer and multi-layered. The method according to the present invention is as follows. First, a wafer laminate (W) is prepared, the wafer laminate (W) including a wafer (10) having a circuit forming surface (10a), a wafer (20) having a main surface (20a) and a back surface (20b), and an adhesive layer (30) containing an SiOC-based polymer. Then, a hole (H) is formed in the wafer laminate (W) by etching the wafer laminate (W) from the wafer (20) side via a mask pattern masking a portion of the main surface (20a) side of the wafer (20), the hole (H) extending through the wafer (20) and the adhesive layer (30) and reaching a wiring pattern (12b) in the wafer (10). Then, an insulating film (41) is formed on an inner surface of the hole (H). Then, the insulating film (41) on a bottom surface of the hole (H) is removed.
    Type: Application
    Filed: May 27, 2019
    Publication date: April 15, 2021
    Applicant: DAICEL CORPORATION
    Inventor: Naoko TSUJI
  • Publication number: 20200148926
    Abstract: The present invention is to provide a curable composition for adhesive agents that cures at a low temperature and that can form a cured article having excellent heat resistance, crack resistance, and adhesive properties and tight bonding properties for adhereds.
    Type: Application
    Filed: May 16, 2018
    Publication date: May 14, 2020
    Applicant: DAICEL CORPORATION
    Inventors: Akira YAMAKAWA, Naoko TSUJI
  • Patent number: 10619047
    Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: April 14, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Naoko Tsuji, Hiroki Tanaka, Akira Yamakawa, Akihiro Shibamoto, Nobuhiko Harada
  • Publication number: 20200071579
    Abstract: Provided is an adhesive composition that can be cured at low temperatures and can form a cured product having excellent insulating property, heat resistance, and adhesiveness. The adhesive composition according to the present invention includes polyorganosilsesquioxane (A) including a constituent unit represented by Formula (1) below, R1SiO3/2(1), in Formula (1), R1 represents a group containing a radically polymerizable group. In the polyorganosilsesquioxane (A), a proportion of the constituent unit represented by Formula (1) and a constituent unit represented by the following Formula (2), relative to a total amount (100 mol %) of siloxane constituent units, is from 55 to 100 mol %, R1SiO2/2(OR2) (2), in Formula (2), R1 is as defined above, and R2 is a hydrogen atom or an alkyl group having from 1 to 4 carbons. The polyorganosilsesquioxane (A) has a number average molecular weight from 1500 to 50000 and a molecular weight dispersity (weight average molecular weight/number average molecular weight) from 1.
    Type: Application
    Filed: May 16, 2018
    Publication date: March 5, 2020
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro SHIBAMOTO, Shinji MAETANI, Kazuhiro NISHIDA, Daisuke USA, Akira YAMAKAWA, Naoko TSUJI
  • Publication number: 20180282485
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Application
    Filed: June 5, 2018
    Publication date: October 4, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro KUWANA, Nobuhiko HARADA, Maya MASUI, Ichiro TAKASE, Shinji MAETANI, Naoko TSUJI
  • Patent number: 10047257
    Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: August 14, 2018
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Katsuhiro Nakaguchi, Kiyoharu Tsutsumi, Yousuke Ito, Naoko Tsuji
  • Publication number: 20180171193
    Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.
    Type: Application
    Filed: June 13, 2016
    Publication date: June 21, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Hiroki TANAKA, Naoko TSUJI, Akira YAMAKAWA
  • Publication number: 20180163049
    Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
    Type: Application
    Filed: June 7, 2016
    Publication date: June 14, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Naoko TSUJI, Hiroki TANAKA, Akira YAMAKAWA, Akihiro SHIBAMOTO, Nobuhiko HARADA
  • Publication number: 20160297933
    Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.
    Type: Application
    Filed: November 14, 2014
    Publication date: October 13, 2016
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro KUWANA, Nobuhiko HARADA, Maya MASUI, Ichiro TAKASE, Shinji MAETANI, Naoko TSUJI