Patents by Inventor Naonori SHIBATA

Naonori SHIBATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-Transfer Roller for Sputtering and Method of Making the Same
    Publication number: 20210050196
    Abstract: This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.
    Type: Application
    Filed: November 4, 2020
    Publication date: February 18, 2021
    Inventors: Hiroshi IWATA, Toshiyuki NEDU, Yuta TAKAKUWA, Naoya OKADA, Ippei SATO, Naonori SHIBATA, Keiichi HASHIMOTO
  • HEAT-TRANSFER ROLLER FOR SPUTTERING AND METHOD OF MAKING THE SAME
    Publication number: 20200303173
    Abstract: This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 24, 2020
    Inventors: Hiroshi IWATA, Toshiyuki NEDU, Yuta TAKAKUWA, Naoya OKADA, Ippei SATO, Naonori SHIBATA, Keiichi HASHIMOTO
  • Sputtering cathode, sputtering device, and method for producing film-formed body
    Patent number: 10692708
    Abstract: This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: June 23, 2020
    Assignee: KEIHIN RAMTECH CO., LTD.
    Inventors: Hiroshi Iwata, Toshiyuki Nedu, Yuta Takakuwa, Naoya Okada, Ippei Sato, Naonori Shibata, Keiichi Hashimoto
  • Sputtering Cathode, Sputtering Device, and Method for Producing Film-Formed Body
    Publication number: 20190203346
    Abstract: This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.
    Type: Application
    Filed: March 8, 2019
    Publication date: July 4, 2019
    Inventors: Hiroshi IWATA, Toshiyuki NEDU, Yuta TAKAKUWA, Naoya OKADA, Ippei SATO, Naonori SHIBATA, Keiichi HASHIMOTO
  • SPUTTERING CATHODE, SPUTTERING DEVICE, AND METHOD FOR PRODUCING FILM-FORMED BODY
    Publication number: 20180171464
    Abstract: This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.
    Type: Application
    Filed: January 25, 2017
    Publication date: June 21, 2018
    Inventors: Hiroshi IWATA, Toshiyuki NEDU, Yuta TAKAKUWA, Naoya OKADA, Ippei SATO, Naonori SHIBATA, Keiichi HASHIMOTO