Abstract: An objective of the present invention is to achieve both prevention of scum generation in an open area and improvement in sensitivity in patterning process of the positive photosensitive resin composition. This objective can be achieved by a positive photosensitive resin composition comprising an alkali-soluble resin (A) containing an ingredient having a molecular weight of 80,000 or more in 0.5% or less and a photosensitizing agent (B), wherein the amount of said photosensitizing agent (B) is 10 parts by weight or more and 40 parts by weight or less to 100 parts by weight of said alkali-soluble resin (A).

Abstract: A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.

Abstract: A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.

Abstract: By using a polyamic acid ester comprising the following structural units (1a), (1b) and (1c) as a photosensitive resin and a sulfonamide compound or a specific glycol ether acetate as a stabilizer, a photo-sensitive resin composition excellent especially in viscosity stability can be obtained, and by using the above photosensitive resin and a specific developer, a relief pattern of high resolution can be formed.

Abstract: A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.

Abstract: The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent.

Abstract: The present invention provides an oligomer having an inherent viscosity .eta. of 0.001-0.5 dl/g as measured at a concentration of 0.5 g/dl in N-methyl-2-pyrrolidone at 30.degree. C., which has been obtained by subjecting to polymerization and imidization (a) an acid component consisting of an aromatic tetracarboxylic acid dianhydride and/or a derivative thereof and (b) a diamine component consisting of 5-100 mole % of a diaminosiloxane represented by the undermentioned formula (I) and 95-0 mole % of an organic diamine other than the formula (I): ##STR1## wherein R.sub.1 is a divalent aliphatic group of 1-5 carbon atoms or a divalent aromatic group of 6 or more carbon atoms; R.sub.2 and R.sub.3 are each a monovalent aliphatic or aromatic group and may be the same or different; and m is an integer of 1-100, as well as an oligomer solution obtained by dissolving the above oligomer in an organic solvent.