Patents by Inventor Naotaka Kinjou
Naotaka Kinjou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8189149Abstract: A liquid crystal panel has a first optical film (4) adhered to a viewing side of a liquid crystal cell (2) through a first pressure-sensitive adhesive layer (3), and a second optical film (6) adhered to the reverse side of the liquid crystal cell (2) through a second pressure-sensitive adhesive layer (5). A creep value (L1) of the first pressure-sensitive adhesive layer (3) is from 50 to 3000 ?m. A creep value (L2) of the second pressure-sensitive adhesive layer (5) is from 10 to 400 ?m. The creep value (L1) of the first pressure-sensitive adhesive layer (3) is larger than the creep value (L2) of the second pressure-sensitive adhesive layer (5). The creep value means the shift amount after one hour of the pressure-sensitive adhesive layer having a thickness of 20 ?m in a case where a tensile shearing force of 4.9 N is applied to an adhesive area of 10 mm2 at 23° C.Type: GrantFiled: June 8, 2007Date of Patent: May 29, 2012Assignee: Nitto Denko CorporationInventors: Masayuki Satake, Yuusuke Toyama, Naotaka Kinjou, Takashi Shimizu, Kentarou Yoshida
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Publication number: 20090322994Abstract: A liquid crystal panel has a first optical film (4) adhered to a viewing side of a liquid crystal cell (2) through a first pressure-sensitive adhesive layer (3), and a second optical film (6) adhered to the reverse side of the liquid crystal cell (2) through a second pressure-sensitive adhesive layer (5). A creep value (L1) of the first pressure-sensitive adhesive layer (3) is from 50 to 3000 ?m. A creep value (L2) of the second pressure-sensitive adhesive layer (5) is from 10 to 400 ?m. The creep value (L1) of the first pressure-sensitive adhesive layer (3) is larger than the creep value (L2) of the second pressure-sensitive adhesive layer (5). The creep value means the shift amount after one hour of the pressure-sensitive adhesive layer having a thickness of 20 ?m in a case where a tensile shearing force of 4.9 N is applied to an adhesive area of 10 mm2 at 23° C.Type: ApplicationFiled: June 8, 2007Publication date: December 31, 2009Applicant: NITTO DENKO CORPORATIONInventors: Masayuki Satake, Yuusuke Toyama, Naotaka Kinjou, Takashi Shimizu, Kentarou Yoshida
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Publication number: 20080007680Abstract: The present invention provides a liquid crystal panel having a high contrast ratio in the front direction. The liquid crystal panel includes a first polarizing plate, a second polarizing plate, and a liquid crystal cell, in which the first polarizing plate is arranged on a display surface side and the second polarizing plate is arranged on a back surface side of the liquid crystal cell. The first polarizing plate includes a first polarizer and a first retardation layer arranged between the first polarizer and the liquid crystal cell. The second polarizing plate includes a second polarizer and a second retardation layer arranged between the second polarizer and the liquid crystal cell. An index ellipsoid of the first retardation layer satisfies nx>ny?nz, and an index ellipsoid of the second retardation layer satisfies nx=ny>nz. The transmittance of the second polarizing plate is greater than that of the first polarizing plate.Type: ApplicationFiled: July 9, 2007Publication date: January 10, 2008Applicant: NITTO DENKO CORPORATIONInventors: Takeharu KITAGAWA, Naotaka KINJOU, Daisuke HAYASHI, Takeshi NISHIBE, Hideki ISHIDA
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Patent number: 7167629Abstract: An optical waveguide and a production method thereof that can provide increased production efficiency, improved workability, and/or production stability. According to non-limiting example embodiments a photopolymerizable resin composition comprising a fluorene derivative and a photoacid generator is coated over an under clad layer and then is dried, to form a resin layer having substantially no surface tack. The resin layer is exposed to light in the state of being contacted with a photo mask by a contact exposure method and then is developed, to form the resin layer into a pattern. Thereafter, the resin layer is cured to form a core layer and then an over clad layer is formed on the under clad layer in such a manner as to cover the core layer, to thereby produce an optical waveguide.Type: GrantFiled: February 15, 2005Date of Patent: January 23, 2007Assignee: Nitto Denko CorporationInventors: Kazunori Mune, Amane Mochizuki, Yusuke Shimizu, Naotaka Kinjou
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Publication number: 20060159898Abstract: To provide a semi-conducting resin composition capable of forming a semi-conducting layer which exhibits a less variable surface resistivity even when subjected to ultrasonic cleaning and effectively discharges static electricity and also provide a wired circuit board comprising the semi-conducting layer composed of the semi-conducting resin composition, an imide resin or a precursor of an imide resin and conducting particles are mixed in a solvent so that the semi-conducting resin composition containing the imide resin or imide resin precursor dissolved therein and the conducting particles dispersed therein is prepared. Then, the semi-conducting resin composition is coated on a surface of an insulating cover layer (5) including the terminal portion (6) of a suspension board with circuit (1) and dried to form a semi-conducting layer (7). Thereafter, the semi-conducting layer 7 formed in the terminal portion (6) is removed by etching.Type: ApplicationFiled: January 11, 2006Publication date: July 20, 2006Applicant: Nitto Denko CorporationInventors: Hisae Uchiyama, Naotaka Kinjou, Takashi Kondou, Takahiro Fukuoka, Jun Ishii
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Patent number: 7022377Abstract: A method of producing porous polyimide resin that enables pores to be formed in a precursor of polyimide resin, with its form of microphase-separated structure wherein a dispersive compound is dispersed in the precursor of polyimide resin being kept unchanged, so as to provide significantly reduced dielectric constant and also provide improvement in mechanical strength and heat resistance, and the porous polyimide resin produced in the same producing method. A coating comprising porous polyimide resin is formed by applying resin solution comprising a precursor of polyimide resin and a dispersive compound and then drying a solvent, to form a coating in which the dispersive compound is dispersed in the precursor of polyimide resin; extracting the dispersive compound from the coating for removal to make the precursor of the polyimide resin porous; and imidizing the coating after preheated in a temperature range of 190–250° C.Type: GrantFiled: July 10, 2002Date of Patent: April 4, 2006Assignee: Nitto Denko CorporationInventors: Mitsuhiro Kanada, Takahiro Fukuoka, Naotaka Kinjou
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Publication number: 20050201714Abstract: A production method of an optical waveguide that can provide increased production efficiency and can also provide improved workability and production stability and provide an optical waveguide produced by the production method of the optical waveguide. A varnish comprising photopolymerizable resion composition comprising a fluorene derivative and a photoacid generator is coated over an under clad layer 2 and then is dried, to form a resin layer 4 having substantial no surface tack. Sequentially, the resin layer 4 is exposed to light in the state of being contacted with a photo mask 5 by a contact exposure method and then is developed, to form the resin layer 4 into a pattern. Thereafter, the resin layer 4 is cured to form a core layer 3 and then an over clad layer 6 is formed on the under clad layer 2 in such a manner as to cover the core layer 3, to thereby produce an optical waveguide.Type: ApplicationFiled: February 15, 2005Publication date: September 15, 2005Applicant: Nitto Denko CorporationInventors: Kazunori Mune, Amane Mochizuki, Yusuke Shimizu, Naotaka Kinjou
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Publication number: 20040101626Abstract: A method of producing porous polyimide resin that enables pores to be formed in a precursor of polyimide resin, with its form of microphase-separated structure wherein a dispersive compound is dispersed in the precursor of polyimide resin being kept unchanged, so as to provide significantly reduced dielectric constant and also provide improvement in mechanical strength and heat resistance, and the porous polyimide resin produced in the same producing method. A coating comprising porous polyimide resin is formed by applying resin solution comprising a precursor of polyimide resin and a dispersive compound and then drying a solvent, to form a coating in which the dispersive compound is dispersed in the precursor of polyimide resin; extracting the dispersive compound from the coating for removal to make the precursor of the polyimide resin porous; and imidizing the coating after preheated in a temperature range of 190-250° C.Type: ApplicationFiled: March 13, 2003Publication date: May 27, 2004Inventors: Mitsuhiro Kanada, Takahiro Fukuoka, Naotaka Kinjou