Patents by Inventor Naoto Sugie

Naoto Sugie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5766038
    Abstract: Waterproof connector in which the inner wall of a waterproof rubber packing is prevented from being damaged and waterproof function is not deteriorated. The waterproof connector comprises: a terminal accommodating chamber; and a waterproof rubber packing mounted on a terminal insertion side of the terminal accommodating chamber, wherein a side wall of the terminal accommodating chamber on the terminal insertion side has notches to form a resilient wall.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: June 16, 1998
    Assignee: Yazaki Corporation
    Inventor: Naoto Sugie
  • Patent number: 5643018
    Abstract: A terminal for waterproof connectors is provided which includes a receptor portion. The receptor portion comprises a bottom plate and lateral walls provided upright on opposite sides of the bottom plate. A slanting insertion guide surface extends from an intermediate height of a front end of each lateral wall to a retreated front end of the bottom plate so as to provide a cutaway portion therebelow. The terminal for waterproof connectors does not give damages to an insertion hole in a waterproof stopper when passed therethrough.
    Type: Grant
    Filed: April 19, 1995
    Date of Patent: July 1, 1997
    Assignee: Yazaki Corporation
    Inventors: Hitoshi Sakai, Naoto Sugie
  • Patent number: 5609505
    Abstract: A terminal, and methods for manufacturing the terminal, in which the opening defined by the electric contact portion is filled with a material. As a result, plating solutions will not become entrapped in the opening so that corrosion of the terminal will be prevented. The terminal includes an electrically conductive plate including a wire connecting portion for clamping a wire thereto and an electric contact portion for mating with another terminal, the contact portion including a cavity therein; and a filler material disposed in the cavity. As a result, when the terminal is subjected to metal plating, solutions associated with the metal plating are substantially prevented from entering into the cavity. According to one method, the filler material is first adhered to the conductive plate before the plate is bent into the shape of the terminal. According to a second method, the filler material is injected into the cavity of the contact portion after the terminal has been bent.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: March 11, 1997
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Naoto Sugie