Patents by Inventor Naoto Yoshitaka
Naoto Yoshitaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9960069Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.Type: GrantFiled: January 24, 2014Date of Patent: May 1, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Shintaro Sugihara, Naoto Yoshitaka, Shigenori Kitahara, Keizo Hirose
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Patent number: 9922859Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.Type: GrantFiled: January 24, 2014Date of Patent: March 20, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Shintaro Sugihara, Naoto Yoshitaka, Shigenori Kitahara, Keizo Hirose
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Patent number: 9919509Abstract: A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.Type: GrantFiled: December 16, 2011Date of Patent: March 20, 2018Assignees: TOKYO ELECTRON LIMITED, INTEL CORPORATIONInventors: Osamu Hirakawa, Naoto Yoshitaka, Masaru Honda, Xavier Francois Brun, Charles Wayne Singleton, Jr.
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Patent number: 9716002Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the backType: GrantFiled: July 7, 2016Date of Patent: July 25, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Yasushi Takiguchi, Taro Yamamoto, Akihiro Fujimoto, Shuuichi Nishikido, Dai Kumagai, Naoto Yoshitaka, Takahiro Kitano, Yoichi Tokunaga
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Patent number: 9607869Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.Type: GrantFiled: August 12, 2014Date of Patent: March 28, 2017Assignee: Tokyo Electron LimitedInventors: Masataka Matsunaga, Naoto Yoshitaka, Satoshi Nishimura
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Publication number: 20160314958Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the backType: ApplicationFiled: July 7, 2016Publication date: October 27, 2016Applicant: TOKYO ELECTRON LIMITEDInventors: Yasushi TAKIGUCHI, Taro YAMAMOTO, Akihiro FUJIMOTO, Shuuichi NISHIKIDO, Dai KUMAGAI, Naoto YOSHITAKA, Takahiro KITANO, Yoichi TOKUNAGA
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Patent number: 9330898Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.Type: GrantFiled: March 4, 2011Date of Patent: May 3, 2016Assignee: Tokyo Electron LimitedInventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
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Patent number: 9165758Abstract: A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus.Type: GrantFiled: December 26, 2011Date of Patent: October 20, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Naoto Yoshitaka, Yasuharu Iwashita, Masataka Matsunaga
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Patent number: 9120120Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.Type: GrantFiled: August 14, 2014Date of Patent: September 1, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Taro Yamamoto, Naoto Yoshitaka, Shuichi Nishikido, Yoichi Tokunaga
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Publication number: 20150059985Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.Type: ApplicationFiled: August 12, 2014Publication date: March 5, 2015Inventors: Masataka Matsunaga, Naoto Yoshitaka, Satoshi Nishimura
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Publication number: 20140352736Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.Type: ApplicationFiled: August 14, 2014Publication date: December 4, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Taro YAMAMOTO, Naoto YOSHITAKA, Shuichi NISHIKIDO, Yoichi TOKUNAGA
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Patent number: 8851092Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.Type: GrantFiled: February 5, 2009Date of Patent: October 7, 2014Assignee: Tokyo Electron LimitedInventors: Taro Yamamoto, Naoto Yoshitaka, Shuichi Nishikido, Yoichi Tokunaga
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Publication number: 20140284000Abstract: A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction.Type: ApplicationFiled: June 10, 2014Publication date: September 25, 2014Inventors: Yasutaka SOMA, Naoto YOSHITAKA, Hiroshi KOMEDA, Eiji MANABE, Osamu HIRAKAWA, Masatoshi DEGUCHI, Takeshi TAMURA
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Patent number: 8819923Abstract: In a joint apparatus, a transfer region and a processing region are formed. In the transfer region, a transfer mechanism transferring a first substrate, a second substrate, or a superposed substrate, a position adjusting mechanism adjusting an orientation in a horizontal direction of the first substrate or the second substrate, and a reversing mechanism reversing front and rear surfaces of the second substrate are provided. In the processing region, a first holding member mounting and holding the first substrate on an upper surface thereof, a second holding member holding the second substrate on a lower surface thereof, and a pressing and moving member bringing one end portion of the first substrate and one end portion of the second substrate into abutment with each other and pressing the one end portions when joining the first substrate and the second substrate together are provided.Type: GrantFiled: February 21, 2011Date of Patent: September 2, 2014Assignee: Tokyo Electron LimitedInventors: Takahiro Nishibayashi, Tatsuya Kitayama, Naoto Yoshitaka
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Publication number: 20140208557Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.Type: ApplicationFiled: January 24, 2014Publication date: July 31, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Shintaro SUGIHARA, Naoto YOSHITAKA, Shigenori KITAHARA, Keizo HIROSE
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Publication number: 20140208556Abstract: A joining device for joining substrates together includes a first chuck configured to draw and hold a first substrate on a lower surface thereof, a second chuck provided below the first chuck and configured to draw and hold a second substrate on an upper surface thereof, and a chuck holding unit provided below the second chuck, the chuck holding unit including an upper surface and suction grooves annularly formed on the upper surface of the chuck holding unit, the suction grooves configured to vacuum-suck the second chuck to draw and hold the second chuck.Type: ApplicationFiled: January 24, 2014Publication date: July 31, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Shintaro SUGIHARA, Naoto YOSHITAKA, Shigenori KITAHARA, Keizo HIROSE
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Publication number: 20140158303Abstract: This bonding system comprises a bonding processing station and a carry in/out station which carries a substrate to be processed, a supporting substrate or a bonded substrate that is obtained by bonding a substrate to be processed and a supporting substrate into/out of the bonding processing station. The bonding processing station comprises a coating device which applies an adhesive to the substrate to be processed or the supporting substrate and a heat treatment device that heats the substrate, to which the adhesive has been applied. In addition, a bonding device turns over one of the substrates, and presses the overturned substrate against the other substrate with an adhesive therebetween, thereby bonding the substrates together. A conveyance region conveys the substrate(s) to the coating device, the heat treatment device and the bonding device.Type: ApplicationFiled: June 25, 2012Publication date: June 12, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
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Publication number: 20140102474Abstract: A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back surface facing down; a second substrate supporting portion supporting the substrate at a second area of the substrate back surface, the second area being separated from the first area; a cleaning liquid supplying portion supplying cleaning liquid to the substrate back surface; a drying portion drying the second area of the substrate back surface; and a cleaning portion cleaning a third area of the substrate back surface when the substrate is supported by the first substrate supporting portion, the third area including the second area, and cleaning a fourth area of the substrate back surface when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area.Type: ApplicationFiled: October 9, 2013Publication date: April 17, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Yasushi TAKIGUCHI, Taro YAMAMOTO, Akihiro FUJIMOTO, Shuuichi NISHIKIDO, Dai KUMAGAI, Naoto YOSHITAKA, Takahiro KITANO, Yoichi TOKUNAGA
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Patent number: 8578953Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the backType: GrantFiled: December 14, 2007Date of Patent: November 12, 2013Assignee: Tokyo Electron LimitedInventors: Yasushi Takiguchi, Taro Yamamoto, Akihiro Fujimoto, Shuuichi Nishikido, Dai Kumagai, Naoto Yoshitaka, Takahiro Kitano, Yoichi Tokunaga
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Publication number: 20130280825Abstract: A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus.Type: ApplicationFiled: December 26, 2011Publication date: October 24, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Naoto Yoshitaka, Yasuharu Iwashita, Masataka Matsunaga