Patents by Inventor Naoya Matsumoto

Naoya Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11563451
    Abstract: A radio frequency module including a module substrate including a first principal surface and a second principal surface; a power amplifier; an inductor disposed on the second principal surface and connected to the power amplifier; and an external connection terminal configured to receive a power supply voltage. The first external connection terminal is disposed on the second principal surface and connected to the power amplifier via the inductor.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: January 24, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Naoya Matsumoto
  • Publication number: 20230006708
    Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.
    Type: Application
    Filed: September 9, 2022
    Publication date: January 5, 2023
    Inventors: Dai NAKAGAWA, Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Ryohei OKABE, Hiromichi KITAJIMA
  • Publication number: 20230001129
    Abstract: To better fulfill a sleep-inducing function for a seated person, a seat device includes a pressing device provided in a seat back and configured to press a back or a waist of a seated person to induce breathing; at least one of a temperature adjusting device configured to change a temperature of a seat cushion and/or the seat back and a shape adjusting device configured to change a surface shape of the seat cushion and/or the seat back; and a controller configured to control the pressing device to press the back or the waist of the seated person at a set cycle corresponding to a breathing cycle of a person at a sleeping time, and control the at least one of the temperature adjusting device and the shape adjusting device.
    Type: Application
    Filed: December 2, 2020
    Publication date: January 5, 2023
    Inventors: Takayoshi ITO, Kensuke MIZOI, Kohei KOWATA, Taro MURAYAMA, Yuki YOSHIOKA, Kazuhiro OHSHIMA, Akira MIYOSHI, Ryuta KASHINO, Hajime YOSHIDA, Yichen LI, Naoya MATSUMOTO
  • Patent number: 11528044
    Abstract: A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: December 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Naoya Matsumoto, Takayuki Shinozaki
  • Patent number: 11499509
    Abstract: An exhaust gas recirculation system for a multi-cylinder engine is provided, which includes an exhaust manifold connected to a cylinder head, a catalyst connected to a downstream end of the exhaust manifold in terms of an exhaust gas flow, an EGR gas outlet provided downstream of the catalyst, an in-head EGR passage penetrating the cylinder head, and an EGR pipe extending from the EGR gas outlet and directly connected to an inlet of the in-head EGR passage to lead EGR gas thereto. The catalyst is disposed so that the exhaust gas flows therein from a first side to a second side in an engine cylinder lined-up direction. The EGR gas outlet is located on the second side with respect to the center of the engine in the cylinder lined-up direction, and the inlet of the in-head EGR passage is located in the first side with respect to the engine center.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: November 15, 2022
    Assignee: Mazda Motor Corporation
    Inventors: Tomonori Nishida, Yuji Kojima, Noriaki Fujita, Ken Yoshida, Takashi Kariya, Takayuki Tominaga, Naoya Matsumoto, Yusaku Matsumura, Yuki Koda, Takuya Nishihara, Hiroyuki Ohmura, Arashi Imura, Fusatoshi Tanaka, Takuya Yamada, Shintaro Umesaki
  • Patent number: 11489551
    Abstract: A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: November 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Naoya Matsumoto
  • Patent number: 11476226
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Uejima, Yuji Takematsu, Naoya Matsumoto, Shou Matsumoto, Tetsuro Harada, Dai Nakagawa, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 11463117
    Abstract: A radio frequency module includes: a power amplifier; an inductor connected between the power amplifier and a power-supply terminal to supply a power-supply voltage to the power amplifier; a capacitor connected between a ground and a node that is located between the inductor and the power-supply terminal; a module substrate including a first principal surface and a second principal surface opposite to each other; and a plurality of post electrodes disposed on the second principal surface. Here, the inductor is disposed on the first principal surface or inside of the module substrate, and at least one of the power amplifier or the capacitor is disposed on the second principal surface.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: October 4, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Naoya Matsumoto
  • Patent number: 11454793
    Abstract: A microscope apparatus includes SLMs each having a modulation plane, an objective lens disposed on an optical path between the modulation plane and an object, and a computer for controlling the SLMs on the basis of a modulation pattern including a correction pattern for correcting aberration caused by a refractive index interface of the object. The computer determines a position of the correction pattern in the modulation pattern on the basis of inclination information of the refractive index interface with respect to a plane perpendicular to an optical axis of the objective lens.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: September 27, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Naoya Matsumoto
  • Patent number: 11440695
    Abstract: A method for manufacturing a metal bottle having a mouthpiece in an upper part of a bottomed cylindrical bottle body, including forming a screw part on the mouthpiece and then forming a curl at a tip of the mouthpiece. During formation of the screw part, a height of the first-stage screw thread from a tip side in a complete screw part and a height of the second-stage screw thread from the tip side are substantially equal and a distance between an apex part of the first-stage screw thread and a bottle axis is smaller than a distance between the apex part of the second-stage screw thread and the bottle axis. After formation of the curl, a distance between the apex part of the first-stage screw thread and the bottle axis and a distance between the apex part of the second-stage screw thread and the bottle axis are substantially equal.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: September 13, 2022
    Assignee: TOYO SEIKAN CO., LTD.
    Inventors: Takeshi Aihara, Masaomi Tamura, Toshiyuki Hasegawa, Takeshi Murase, Tomohiko Nakamura, Naoya Matsumoto, Nobuhiro Sasajima
  • Patent number: 11431363
    Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier, the first power amplifier being configured to amplify a radio frequency signal of a first communication band, the second power amplifier being configured to amplify a radio frequency signal of a second communication band, the second communication band being different from the first communication band; and a second semiconductor device containing a control circuit configured to control the first power amplifier and the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: August 30, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Naoya Matsumoto, Takayuki Shinozaki
  • Patent number: 11413599
    Abstract: A catalytic reactor according to an embodiment includes a catalytic unit including at least one catalyst having a honeycomb structure in which a plurality of passages extending in an axial direction are formed, a reactor housing accommodating the catalytic unit, and a seal plate sealing between an outer periphery of the catalytic unit and an inner periphery of the reactor housing. The seal plate seals between the outer periphery of the catalytic unit and the inner periphery of the reactor housing at an upstream end portion of the catalytic unit with respect to a flow of a fluid flowing in the reactor housing.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: August 16, 2022
    Assignee: Mitsubishi Heavy Industries Engineering, Ltd.
    Inventors: Kaori Yoshida, Rikio Kan, Naoya Matsumoto
  • Patent number: 11411586
    Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: August 9, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidetaka Takahashi, Satoshi Goto, Yoshiki Yasutomo, Daerok Oh, Yuuto Aoki, Yoshihiro Daimon, Naoya Matsumoto
  • Patent number: 11381265
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface; a first power amplifier; a second power amplifier; a first output transformer connected to the first power amplifier; and a second output transformer connected to the second power amplifier. The first power amplifier and the second power amplifier are disposed on the first principal surface. The first output transformer and the second output transformer are disposed inside the module board or on the second principal surface.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: July 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Naoya Matsumoto, Takayuki Shinozaki
  • Publication number: 20220128019
    Abstract: An exhaust gas recirculation system for a multi-cylinder engine is provided, which includes an exhaust manifold connected to a cylinder head, a catalyst connected to a downstream end of the exhaust manifold in terms of an exhaust gas flow, an EGR gas outlet provided downstream of the catalyst, an in-head EGR passage penetrating the cylinder head, and an EGR pipe extending from the EGR gas outlet and directly connected to an inlet of the in-head EGR passage to lead EGR gas thereto. The catalyst is disposed so that the exhaust gas flows therein from a first side to a second side in an engine cylinder lined-up direction. The EGR gas outlet is located on the second side with respect to the center of the engine in the cylinder lined-up direction, and the inlet of the in-head EGR passage is located in the first side with respect to the engine center.
    Type: Application
    Filed: October 20, 2021
    Publication date: April 28, 2022
    Inventors: Tomonori Nishida, Yuji Kojima, Noriaki Fujita, Ken Yoshida, Takashi Kariya, Takayuki Tominaga, Naoya Matsumoto, Yusaku Matsumura, Yuki Koda, Takuya Nishihara, Hiroyuki Ohmura, Arashi Imura, Fusatoshi Tanaka, Takuya Yamada, Shintaro Umesaki
  • Patent number: 11309925
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: April 19, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Sho Matsumoto, Takanori Uejima, Yuji Takematsu, Tetsuro Harada, Dai Nakagawa, Naoya Matsumoto, Yutaka Sasaki, Yuuki Fukuda
  • Publication number: 20220019094
    Abstract: Provided is a light shaping device including: an intensity modulation unit that modulates a spectrum intensity of an optical pulse that is input light, and outputs the optical pulse of which a temporal width is narrowed as output light. The intensity modulation unit modulates the spectrum intensity of the optical pulse with a mask expressed by a starting end wavelength from a central wavelength of the input light and a wavelength width.
    Type: Application
    Filed: July 8, 2021
    Publication date: January 20, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Koyo WATANABE, Naoya MATSUMOTO, Hisanari TAKAHASHI, Kyohei SHIGEMATSU, Takashi INOUE
  • Publication number: 20210409062
    Abstract: A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.
    Type: Application
    Filed: April 8, 2021
    Publication date: December 30, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Naoya MATSUMOTO
  • Publication number: 20210394248
    Abstract: [Object] A pressing die and a press working method that can achieve both facilitation of management of an appropriate clearance and working durability at a high level are provided. [Solving Means] The pressing die of the present invention is a pressing die for press working a metal material using a punch part and a die part. A working surface of one of the punch part and the die part is coated with a diamond film the working surface contacting with the metal material. A working surface of the other one of the punch part and the die part is coated with a surface treatment film having a Vickers hardness of 8000 Hv or less the working surface contacting with the metal material.
    Type: Application
    Filed: September 18, 2019
    Publication date: December 23, 2021
    Inventors: Takuho KUMAGAI, Ryozo SHIROISHI, Tomohiro OGAWA, Naoya MATSUMOTO, Masahiro SHIMAMURA
  • Publication number: 20210354191
    Abstract: Provided is a machining jig on which a carbon film (3) is formed on a machining surface of a rigid substrate (1), in which the carbon film (3) indicates a Raman spectroscopy spectrum with an intensity ratio, represented by the formula: ID/IG (where ID is the maximum peak intensity at 1333±10 cm?1 in the Raman spectroscopy spectrum of the carbon film surface, and IG is the maximum peak intensity at 1500±100 cm?1 in the Raman spectroscopy spectrum of the carbon film surface), exceeding 0.6. Also provided is a method of manufacturing seamless can bodies, the method including a step of using a mold machining member, on which a diamond film is formed on a machining surface, to press work a metal material onto the machining surface of the mold machining member in a state where a coolant is interposed.
    Type: Application
    Filed: October 17, 2019
    Publication date: November 18, 2021
    Inventors: Ryozo SHIROISHI, Naoya MATSUMOTO, Masahiro SHIMAMURA, Takuho KUMAGAI, Tomohiro OGAWA