Abstract: Provided are an electroconductive composition capable of affording a conductor having excellent stretchability and excellent electrical resistance stability; a conductor obtained from the electroconductive composition; and a flexible printed wiring board including a patterned conductor formed using the electroconductive composition. It is an electroconductive composition or the like containing: at least one selected from a block copolymer and a functional group-containing elastomer; and a chain-like silver powder in the form of aggregate particles into which microparticles have aggregated, in which the chain-like silver powder has a tap density of 2.0 g/cm3 or less. The block copolymer is preferably a block copolymer represented by the below-mentioned formula (I): X1—Y—X2??(I) (wherein, X1 and X2 independently represent a polymer unit having a glass transition point Tg of 0° C. or more; and Y represents a polymer unit having a glass transition point Tg of less than 0° C.).

Abstract: Provided is an electroconductive composition which not only shows excellent adhesion to a substrate and can easily form a smooth film, but also is applicable to the formation of a fine-pitched circuit and the like and capable of providing high electroconductivity even when dried at a relatively low temperature. The electroconductive composition comprises (A) a crystalline flake silver powder and (B) an organic binder, wherein the blending ratio of the (A) crystalline flake silver powder is 90% by mass to 98% by mass with respect the total solid content of the composition. In a preferred embodiment, the (A) crystalline flake silver powder contains polygonal single particles and has an average particle size (D50), which is determined by a laser diffraction-scattering particle size distribution analysis, of 1 ?m to 3 ?m.

Abstract: A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.

Abstract: A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.

Abstract: A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes.

Abstract: A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40° C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.

Abstract: To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.

Abstract: A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes.

Abstract: A gas discharge panel with a plurality of electrically conductive oxide cathode electrodes and a plurality of anode electrodes that are arranged in a matrix in a sealed container. This electrically conductive oxide cathode electrode is formed using, for example, lanthanum chromite, lanthanum calcium chromite, alumina-doped zinc oxide, or antimony-doped tin oxide.