Patents by Inventor Natasha V. Kachenko

Natasha V. Kachenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200003649
    Abstract: A pressure sensing device includes a support structure, an isolated diaphragm, a working oil, and a MEMS die sensing element. The support structure defines a portion of a sealed cavity. The isolated diaphragm is mounted to the support structure. The isolated diaphragm has in inner side that defines an end of the sealed cavity and an outer side opposite the inner side. The working oil is contained within the sealed cavity. The MEMS die sensing element is enclosed within the support structure. The MEMS die sensing element is exposed to the working oil within the sealed cavity. A pressure exerted on the outer side of the isolated diaphragm by a fluid medium is transferred via the working oil to the MEMS die sensing element to measure the pressure of the fluid medium. The working oil has a low vapor pressure and a low volatility content.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Applicant: Measurement Specialties, Inc.
    Inventors: Natasha V. Kachenko, Jonathan Tran
  • Patent number: 10371591
    Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: August 6, 2019
    Assignee: Measurement Specialties, Inc.
    Inventors: David E. Wagner, Natasha V. Kachenko, James H. Hoffman
  • Patent number: 10203255
    Abstract: A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: February 12, 2019
    Assignee: Measurement Specialties, Inc.
    Inventors: David E. Wagner, James H. Hoffman, Natasha V. Kachenko
  • Publication number: 20180136066
    Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.
    Type: Application
    Filed: November 11, 2016
    Publication date: May 17, 2018
    Inventors: David E. Wagner, Natasha V. Kachenko, James H. Hoffman
  • Publication number: 20180058963
    Abstract: A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.
    Type: Application
    Filed: August 25, 2016
    Publication date: March 1, 2018
    Inventors: David E. Wagner, James H. Hoffman, Natasha V. Kachenko
  • Patent number: 9534975
    Abstract: A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: January 3, 2017
    Assignee: MEASUREMENT SPECIALTIES, INC.
    Inventors: Natasha V. Kachenko, David E. Wagner, Weijun Xie
  • Patent number: 9310267
    Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: April 12, 2016
    Assignee: Measurement Specialities, Inc.
    Inventors: David E. Wagner, Natasha V. Kachenko, Vincent M. Wong
  • Publication number: 20160054192
    Abstract: A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.
    Type: Application
    Filed: August 25, 2014
    Publication date: February 25, 2016
    Applicant: MEASUREMENT SPECIALTIES, INC.
    Inventors: Natasha V. Kachenko, David E. Wagner, Weijun Xie
  • Publication number: 20150247774
    Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.
    Type: Application
    Filed: February 28, 2014
    Publication date: September 3, 2015
    Applicant: Measurement Specialities, Inc.
    Inventors: David E. Wagner, Natasha V. Kachenko, Vincent M. Wong