Patents by Inventor Natasha V. Kachenko
Natasha V. Kachenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11193846Abstract: A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.Type: GrantFiled: March 16, 2020Date of Patent: December 7, 2021Assignees: TE CONNECTIVITY SERVICES GMBH, MEASUREMENT SPECIALTIES, INC.Inventors: Megan Hoarfrost Beers, Miguel Morales, Vishrut Vipul Mehta, Yilang Wu, Ting Gao, Vincent Wong, Jonathan Tran, Natasha V. Kachenko
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Patent number: 11162860Abstract: A pressure sensing device includes a support structure, an isolated diaphragm, a working oil, and a MEMS die sensing element. The support structure defines a portion of a sealed cavity. The isolated diaphragm is mounted to the support structure. The isolated diaphragm has in inner side that defines an end of the sealed cavity and an outer side opposite the inner side. The working oil is contained within the sealed cavity. The MEMS die sensing element is enclosed within the support structure. The MEMS die sensing element is exposed to the working oil within the sealed cavity. A pressure exerted on the outer side of the isolated diaphragm by a fluid medium is transferred via the working oil to the MEMS die sensing element to measure the pressure of the fluid medium. The working oil has a low vapor pressure and a low volatility content.Type: GrantFiled: June 28, 2019Date of Patent: November 2, 2021Assignee: MEASUREMENT SPECIALTIES, INC.Inventors: Natasha V. Kachenko, Jonathan Tran
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Publication number: 20210285837Abstract: A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.Type: ApplicationFiled: March 16, 2020Publication date: September 16, 2021Applicants: TE Connectivity Services GmbH, Measurement Specialities, Inc.Inventors: Megan Hoarfrost Beers, Miguel Morales, Vishrut Vipul Mehta, Yilang Wu, Ting Gao, Vincent Wong, Jonathan Tran, Natasha V. Kachenko
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Patent number: 11070008Abstract: The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor.Type: GrantFiled: February 7, 2020Date of Patent: July 20, 2021Assignees: Measurement Specialties (China) Ltd., Measurement Specialities, Inc.Inventors: Jun Li, Lin Zhang, Natasha V. Kachenko, Vincent Wong, Tuyen Nguyen
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Publication number: 20200259299Abstract: The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor.Type: ApplicationFiled: February 7, 2020Publication date: August 13, 2020Inventors: Jun LI, Lin ZHANG, Natasha V. KACHENKO, Vincent WONG, Tuyen NGUYEN
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Publication number: 20200003649Abstract: A pressure sensing device includes a support structure, an isolated diaphragm, a working oil, and a MEMS die sensing element. The support structure defines a portion of a sealed cavity. The isolated diaphragm is mounted to the support structure. The isolated diaphragm has in inner side that defines an end of the sealed cavity and an outer side opposite the inner side. The working oil is contained within the sealed cavity. The MEMS die sensing element is enclosed within the support structure. The MEMS die sensing element is exposed to the working oil within the sealed cavity. A pressure exerted on the outer side of the isolated diaphragm by a fluid medium is transferred via the working oil to the MEMS die sensing element to measure the pressure of the fluid medium. The working oil has a low vapor pressure and a low volatility content.Type: ApplicationFiled: June 28, 2019Publication date: January 2, 2020Applicant: Measurement Specialties, Inc.Inventors: Natasha V. Kachenko, Jonathan Tran
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Patent number: 10371591Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.Type: GrantFiled: November 11, 2016Date of Patent: August 6, 2019Assignee: Measurement Specialties, Inc.Inventors: David E. Wagner, Natasha V. Kachenko, James H. Hoffman
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Patent number: 10203255Abstract: A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.Type: GrantFiled: August 25, 2016Date of Patent: February 12, 2019Assignee: Measurement Specialties, Inc.Inventors: David E. Wagner, James H. Hoffman, Natasha V. Kachenko
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Publication number: 20180136066Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.Type: ApplicationFiled: November 11, 2016Publication date: May 17, 2018Inventors: David E. Wagner, Natasha V. Kachenko, James H. Hoffman
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Publication number: 20180058963Abstract: A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.Type: ApplicationFiled: August 25, 2016Publication date: March 1, 2018Inventors: David E. Wagner, James H. Hoffman, Natasha V. Kachenko
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Patent number: 9534975Abstract: A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.Type: GrantFiled: August 25, 2014Date of Patent: January 3, 2017Assignee: MEASUREMENT SPECIALTIES, INC.Inventors: Natasha V. Kachenko, David E. Wagner, Weijun Xie
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Patent number: 9310267Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.Type: GrantFiled: February 28, 2014Date of Patent: April 12, 2016Assignee: Measurement Specialities, Inc.Inventors: David E. Wagner, Natasha V. Kachenko, Vincent M. Wong
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Publication number: 20160054192Abstract: A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.Type: ApplicationFiled: August 25, 2014Publication date: February 25, 2016Applicant: MEASUREMENT SPECIALTIES, INC.Inventors: Natasha V. Kachenko, David E. Wagner, Weijun Xie
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Publication number: 20150247774Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.Type: ApplicationFiled: February 28, 2014Publication date: September 3, 2015Applicant: Measurement Specialities, Inc.Inventors: David E. Wagner, Natasha V. Kachenko, Vincent M. Wong