Patents by Inventor Nathan A. Nuttall
Nathan A. Nuttall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10748832Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: GrantFiled: January 17, 2019Date of Patent: August 18, 2020Assignee: Elenion Technologies, LLCInventor: Nathan A. Nuttall
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Patent number: 10678005Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: GrantFiled: January 16, 2019Date of Patent: June 9, 2020Assignee: Elenion Technologies, LLCInventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Publication number: 20200057216Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: October 28, 2019Publication date: February 20, 2020Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Patent number: 10495830Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: GrantFiled: June 20, 2018Date of Patent: December 3, 2019Assignee: Elenion Technologies, LLCInventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20190189531Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: ApplicationFiled: January 17, 2019Publication date: June 20, 2019Inventor: Nathan A. Nuttall
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Publication number: 20190179091Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: ApplicationFiled: January 16, 2019Publication date: June 13, 2019Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Patent number: 10222565Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: GrantFiled: October 13, 2017Date of Patent: March 5, 2019Assignee: Elenion Technologies, LLCInventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Patent number: 10211121Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: GrantFiled: November 29, 2017Date of Patent: February 19, 2019Assignee: Elenion Technologies, LLCInventor: Nathan A. Nuttall
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Publication number: 20180314017Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: June 20, 2018Publication date: November 1, 2018Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Patent number: 10025045Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: GrantFiled: March 23, 2017Date of Patent: July 17, 2018Assignee: Elenion Technologies, LLCInventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20180090410Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: ApplicationFiled: November 29, 2017Publication date: March 29, 2018Inventor: Nathan A. Nuttall
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Publication number: 20180052290Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: ApplicationFiled: October 13, 2017Publication date: February 22, 2018Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Patent number: 9859186Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: GrantFiled: December 6, 2016Date of Patent: January 2, 2018Assignee: Elenion Technologies, LLCInventor: Nathan A. Nuttall
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Patent number: 9817197Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: GrantFiled: March 31, 2016Date of Patent: November 14, 2017Assignee: Elenion Technologies, LLCInventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Publication number: 20170205594Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: March 23, 2017Publication date: July 20, 2017Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20170131491Abstract: A hybrid pin connecting apparatus and method for connecting a thermally susceptible high-speed optoelectronic device to a PCB, comprising a combination of one or more flat pins or gull wing pins capable of transmitting high-speed electrical signals above 5 Gbps for being locally soldered to one or more matching surface mount pads on the PCB, and a pin grid array capable of transmitting only low-speed electrical signals below 5 Gbps mounted on the substrate for fitting into and connecting to a geometrically matching array of through-hole connections on the PCB.Type: ApplicationFiled: November 10, 2015Publication date: May 11, 2017Inventors: Asres Y. Seyoum, Nathan A. Nuttall
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Patent number: 9638859Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: GrantFiled: January 12, 2016Date of Patent: May 2, 2017Assignee: Elenion Technologies, LLCInventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20170103934Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: ApplicationFiled: December 6, 2016Publication date: April 13, 2017Inventor: Nathan A. Nuttall
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Patent number: 9543226Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.Type: GrantFiled: October 7, 2015Date of Patent: January 10, 2017Assignee: Coriant Advanced Technology, LLCInventor: Nathan A. Nuttall
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Publication number: 20160291265Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: ApplicationFiled: March 31, 2016Publication date: October 6, 2016Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi