Abstract: An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): (A) an epoxy resin; (B) a clathrate compound of a carboxylic acid derivative represented by formula (I): R(COOH)n??(I); and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).

Abstract: A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R3 to R5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

Abstract: The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Abstract: A solid semiconductor sealing composition that includes (A) an epoxy resin, and (B) a clathrate complex. The clathrate complex contains (b1) at least one of 5-hydroxyisophthalic acid and 5-nitroisophthalic acid; and (b2) at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. A method of sealing a solid semiconductor using the sealing composition.

Abstract: The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Abstract: An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): (A) an epoxy resin; (B) a clathrate compound of a carboxylic acid derivative represented by formula (I): R(COOH)n??(I); and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).

Abstract: A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R3 to R5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

Abstract: The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Abstract: A clathrate compound containing a polymolecular host compound as a host compound and an agricultural chemical active ingredient having a saturated solubility in water at 25° C. of not less than 500 ppm as a guest compound.

Abstract: A clathrate compound containing a polymolecular host compound as a host compound and an agricultural chemical active ingredient having a saturated solubility in water at 25° C. of not less than 500 ppm as a guest compound.

Abstract: It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R2 represents a hydrogen atom, etc.; R3 to R5 represent a hydrogen atom, etc.).

Abstract: The present invention provides a clathrate compound characterized by containing: a polymolecular host compound as a host compound; and an agricultural chemical active ingredient having a saturated solubility in water at 25° C. of not less than 500 ppm as a guest compound. The present invention also provides a method for controlling the concentration of an aqueous agricultural chemical active ingredient solution, characterized by containings a step of including an agricultural chemical active ingredient having high saturated solubility in an interior space formed of a polymolecular host compound, thereby maintaining the saturated solubility of the agricultural chemical active ingredient in water within a predetermined concentration range. The present invention also provides an agricultural chemical formulation containing the clathrate compound. The present invention also provides an agricultural active composition containing the clathrate compound and a synthetic pyrethroid.

Abstract: The present invention provides a curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound comprises at least an isophthalic acid compound represented by a formula (1) [wherein R1 represents a C1 to C6 alkyl group or the like] and an imidazole compound represented by a formula (II) [wherein R2 represents a hydrogen atom or a C1 to C10 alkyl group or the like, and R3 to R5 each independently represents a hydrogen atom or a nitro group or the like].

Abstract: The present invention provides a clathrate compound characterized by containing: a polymolecular host compound as a host compound; and an agricultural chemical active ingredient having a saturated solubility in water at 25° C. of not less than 500 ppm as a guest compound. The present invention also provides a method for controlling the concentration of an aqueous agricultural chemical active ingredient solution, characterized by containings a step of including an agricultural chemical active ingredient having high saturated solubility in an interior space formed of a polymolecular host compound, thereby maintaining the saturated solubility of the agricultural chemical active ingredient in water within a predetermined concentration range. The present invention also provides an agricultural chemical formulation containing the clathrate compound. The present invention also provides an agricultural active composition containing the clathrate compound and a synthetic pyrethroid.