Abstract: In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

Abstract: Various techniques are disclosed for bolometer circuits and related methods for thermal imaging in a difference domain, where each pixel value represents a difference in incident IR radiation intensity between adjacent bolometers. For example, a bolometer circuit may include an array of bolometers each configured to generate a pixel signal in response to a bias and incident infrared radiation. Each column of the bolometer array may comprise an amplifier, a first plurality of switches each configured to selectively provide a supply voltage to a respective one of bolometers of the each column, a second plurality of switches each configured to selectively route a difference of the pixel signals of a respective adjacent pair of the bolometers of the each column to an input of the amplifier, and a third plurality of switches configured to selectively provide a common voltage to a respective one of the bolometers of the each column.

Abstract: Various systems and methods are disclosed for monitoring and controlling using small infrared imaging modules to enhance occupant safety and energy efficiency of buildings and structures. In one example, thermal images captured by infrared imaging modules may be analyzed to detect presence of persons, identify and classify power-consuming objects, and monitor environmental conditions. Based on the processed thermal images, various power-consuming objects (e.g., an HVAC system, lighting, a water heater, and other appliances) may be controlled to increase energy efficiency. In another example, thermal images captured by infrared imaging modules may be analyzed to detect various hazardous conditions, such as a combustible gas leak, a CO gas leak, a water leak, fire, smoke, and, an electrical hotspot. If such hazardous conditions are detected, an appropriate warning may be generated and/or various objects may be controlled to remedy the conditions.

Abstract: Various techniques are provided for using one or more thermal infrared (IR) imaging modules to enhance the dynamic range of images. In one example, devices and methods provide a first IR imaging module that captures a first image, a second IR imaging module optimized for higher IR irradiance that captures a second image, and a processing system that detects saturated pixels of the first image, determines pixels of the second image corresponding to the saturated pixels of the first image, and generates a combined image based on non-saturated pixels of the first image and the pixels of the second image. The IR imaging modules may be a microbolometer focal plane array (FPA) configured for high-gain, and a microbolometer FPA configured for low-gain. The IR imaging modules may be a photon detector FPA and a microbolometer FPA.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken.

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Abstract: A partially attenuating shutter may be used to identify and reduce fixed pattern noise (FPN) associated with imaging devices. In one example, a system includes an image capture component configured to capture images in response to incident radiation from a scene along an optical path. The system includes a shutter configured to attenuate a first portion of the incident radiation and permit a second portion of the incident radiation to pass. The system also includes an actuator configured to translate the shutter between an open position out of the optical path, and a closed position in the optical path between the scene and the image capture component. The system also includes a processor configured to determine a plurality of FPN correction terms using images captured by the image capture component while the shutter is in the open and closed positions. Related systems and methods are also provided.

Abstract: Various techniques are disclosed for smart surveillance camera systems and methods using thermal imaging to intelligently control illumination and monitoring of a surveillance scene. For example, a smart camera system may include a thermal imager, an IR illuminator, a visible light illuminator, a visible/near IR (NIR) light camera, and a processor. The camera system may capture thermal images of the scene using the thermal imager, and analyze the thermal images to detect a presence and an attribute of an object in the scene. In response to the detection, various light sources may be selectively operated to illuminate the object only when needed or desired, with a suitable type of light source, with a suitable beam angle and width, or in otherwise desirable manner The visible/NIR light camera may also be selectively operated based on the detection to capture or record surveillance images containing objects of interest.

Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

Abstract: Various techniques are disclosed for systems and methods using thermal imaging to monitor an infant or other persons that may need observation. For example, an infant monitoring system may include an infrared imaging module, a visible light camera, a processor, a display, a communication module, and a memory. The monitoring system may capture thermal images of a scene including at least a partial view of an infant, using the infrared imaging module enclosed in a portable or mountable housing configured to be positioned for remote monitoring of the infant. Various thermal image processing and analysis operations may be performed on the thermal images to generate monitoring information relating to the infant. The monitoring information may include various alarms that actively provide warnings to caregivers, and user-viewable images of the scene. The monitoring information may be presented at external devices or the display located remotely for convenient viewing by caregivers.

Abstract: Various techniques are provided to capture one or more thermal image frames using an infrared sensor array that is fixably positioned to substantially de-align rows and columns of infrared sensors. In one example, an infrared imaging system includes an infrared sensor array comprising a plurality of infrared sensors arranged in rows and columns and adapted to capture a thermal image frame of a scene exhibiting at least one substantially horizontal or substantially vertical feature. The infrared imaging system also includes a housing. The infrared sensor array is fixably positioned within the housing to substantially de-align the rows and columns from the feature while the thermal image frame is captured.

Abstract: Various techniques are provided for systems and methods to process images to reduce consumption of an available output dynamic range by the sky in images. For example, according to one or more embodiments of the disclosure, a region or area in images that may correspond to the sky may be identified based on the location of the horizon in the images. A distribution of irradiance levels in the identified sky region may be analyzed to determine a dynamic range attributable to the sky region. A transfer function that compresses the dynamic range attributable to the sky region may be generated and applied so that the sky in the images may be suppressed, thereby advantageously preserving more dynamic range for terrestrial objects and other objects of interest in the images.

Abstract: Various techniques are disclosed for providing object recognition using thermal imaging. Unique thermal features of an object such as a human face can be detected using a thermal imaging module. The thermal imaging module may be included in an authentication system that performs authentication operations for users of a secure system based on the detected thermal features. The thermal features may include a thermal map of a user's face. An object recognition system such as an authentication system may include a non-thermal imaging module that captures non-thermal images of the object. The object recognition system may recognize objects using thermal images and non-thermal images in separate object recognition operations or by combining the thermal and non-thermal images and performing object recognition operations using the combined image. A thermal imaging authentication system may help eliminate user passwords on phones, tablets, computers and/or other secure access systems.

Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Abstract: Wearable systems with thermal imaging capabilities may be provided for detecting the presence and location of persons or animals in an environment surrounding the system in accordance with an embodiment. A wearable system may include a wearable structure such as a helmet with a plurality of imaging modules mounted to the wearable structure. An imaging module may include one or more imaging components such as infrared imaging modules and visible light cameras. Thermal images captured using the infrared imaging modules may be used to detect the presence of a person in the thermal images. The wearable imaging system may include one or more alert components that alert the wearer when a person is detected in the thermal images. The alert components may be used to generate a location-specific alert that alerts the wearer to the location of the detected person. A wearable imaging system may be a multidirectional threat monitoring helmet.

Abstract: Various techniques are provided to identify anomalous pixels in images captured by imaging devices. In one example, an infrared image frame is received. The infrared image frame is captured by a plurality of infrared sensors based on infrared radiation passed through an optical element. A pixel of the infrared image frame is selected. A plurality of neighborhood pixels of the infrared image frame are selected. Values of the selected pixel and the neighborhood pixels are processed to determine whether the value of the selected pixel exhibits a disparity in relation to the neighborhood pixels that exceeds a maximum disparity associated with a configuration of the optical element and the infrared sensors. The selected pixel is selectively designated as an anomalous pixel based on the processing.

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor aspects of a power system. A system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and modules to control components of a power system. Infrared imaging modules may be mounted on, installed in, or otherwise integrated with a power system having one or more power system components. The infrared imaging modules may be configured to capture thermal images of portions of the power system. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating conditions and temperatures of portions of the power system. Monitoring information may be generated based on the determined conditions and temperatures and then presented to a user of the power system.

Abstract: Systems and methods disclosed herein provide for some embodiments infrared camera systems for maritime applications. For example in one embodiment, a watercraft includes a plurality of image capture components coupled to the watercraft to capture infrared images around at least a substantial portion of a perimeter of the watercraft; a memory component adapted to store the captured infrared images; a processing component adapted to process the captured infrared images according to a man overboard mode of operation to provide processed infrared images and determine if a person falls from the watercraft; and a display component adapted to display the processed infrared images.

Abstract: Various techniques are disclosed for performing non-uniformity correction (NUC) for infrared imaging devices. Intentionally blurred image frames may be obtained and processed to correct for FPN (e.g., random spatially uncorrelated FPN in one embodiment) associated with infrared sensors of the infrared imaging device. Intentionally blurred image frames may be used to distinguish between FPN associated with the infrared sensors and desired scene information. Advantageously, such techniques may be implemented without requiring the use of a shutter to perform flat field correction for the infrared imaging device.