Patents by Inventor Nicholas Medendorp, Jr.
Nicholas Medendorp, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11791442Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.Type: GrantFiled: December 18, 2020Date of Patent: October 17, 2023Assignee: CreeLED, Inc.Inventors: Bernd Keller, Nicholas Medendorp, Jr., Thomas Yuan
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Publication number: 20210143302Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.Type: ApplicationFiled: December 18, 2020Publication date: May 13, 2021Inventors: Bernd Keller, Nicholas Medendorp, JR., Thomas Yuan
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Patent number: 9070850Abstract: An LED package includes a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages includes providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.Type: GrantFiled: October 31, 2007Date of Patent: June 30, 2015Assignee: Cree, Inc.Inventors: Bernd Keller, Nicholas Medendorp, Jr., Thomas Cheng-Hsin Yuan
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Patent number: 8378374Abstract: A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.Type: GrantFiled: January 12, 2010Date of Patent: February 19, 2013Assignee: Cree, Inc.Inventors: Ban P. Loh, Nicholas Medendorp, Jr., Bernd Keller
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LED LAMP OR BULB WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION WITH ENHANCED SCATTERING PROPERTIES
Publication number: 20110267801Abstract: An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.Type: ApplicationFiled: January 31, 2011Publication date: November 3, 2011Inventors: Tao Tong, Ronan Le Toquin, Bernd Keller, Eric Tarsa, Mark Youmans, Theodore Lowes, Nicholas Medendorp, JR., Antony van de Ven, Gerald Negley -
Publication number: 20100109029Abstract: A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.Type: ApplicationFiled: January 12, 2010Publication date: May 6, 2010Inventors: Ban P. Loh, Nicholas Medendorp, JR., Bernd Keller
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Patent number: 7655957Abstract: A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.Type: GrantFiled: April 27, 2006Date of Patent: February 2, 2010Assignee: Cree, Inc.Inventors: Ban P. Loh, Nicholas Medendorp, Jr., Bernd Keller
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Publication number: 20090108281Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.Type: ApplicationFiled: October 31, 2007Publication date: April 30, 2009Inventors: Bernd Keller, Nicholas Medendorp, JR., Thomas Cheng-Hsin Yuan
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Patent number: D615504Type: GrantFiled: October 31, 2007Date of Patent: May 11, 2010Assignee: Cree, Inc.Inventors: Bernd Keller, Nicholas Medendorp, Jr., Thomas Cheng-Hsin Yuan