Abstract: Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.

Abstract: A seek-scan probe (SSP) memory involves multiple-wafer bonding needing precision small gaps in between. Solder reflow bonding is typically used to join the wafers due to its reliability and ability to hermetically seal. However, solder reflow bonding may not provide a consistently controllable gap due to flowing solder during the bonding process. Thus, a bond stop technique and process is used to provide accurate cantilever to media gap control.

Abstract: A seek-scan probe (SSP) memory involves multiple-wafer bonding needing precision small gaps in between. Solder reflow bonding is typically used to join the wafers due to its reliability and ability to hermetically seal. However, solder reflow bonding may not provide a consistently controllable gap due to flowing solder during the bonding process. Thus, a bond stop technique and process is used to provide accurate cantilever to media gap control.

Abstract: Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.

Abstract: Methods of fabricating 3-dimensional force input control devices are disclosed. These roughly comprise: providing a first substrate, fabricating stress-sensitive IC components and signal processing IC on a side one of the first substrate, fabricating one or more closed trenches on a side two of the first substrate within each die area, creating elastic element, frame area and rigid island, providing a second substrate, patterning a side two of the second substrate to define areas for deep etching, creating a layer of bonding material in local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing the two bonded substrates into multiple separate dice.

Abstract: A wireless sensing module with extended service life containing at least one sensor of a physical parameter, a data acquisition hardware acquiring output electrical signals from at least one sensor and converting it into digital measurement data, a microcontroller, a non-volatile memory, at least one transceiver for wireless communication with external wireless devices, at least one battery, including at least one re-chargeable battery, at least one energy harvesting device, a power management circuit, and at least one antenna. All components of the wireless sensing module are mounted on a printed circuit board and placed into an enclosure providing mechanical, chemical, electrical and environmental protection. The wireless sensing modules can be used in different applications, including long-term condition monitoring of structures.

Abstract: In one embodiment a micro-electro mechanical system is disclosed. A MEMS structure can include a frame, a movable structure and a set of structural beams to suspend the movable structure from the frame. The system can also include a set of conductor routing beams. The conductor routing beams can provide a conductive path from the frame to the movable structure. The set of structural beams can have a spring rate that is more than ten times the spring rate of the set of conductor routing beams. Accordingly, multiple routing beams can be utilized to support multiple conductors without significantly affecting the mechanical movement or dynamic properties of the movable structure.

Abstract: A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices along with other applications like medical equipment, robotics, security systems and wireless sensor networks is disclosed. The device can be one-axis or two-axis or three-axis sensitive broadening the range of applications. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, and electrical connection elements for mounting and/or wire bonding. Signal conditioning and processing integrated circuit can be integrated within some devices. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element cooperated with the sensor die for transferring an external force to the force sensor die.

Abstract: Methods of fabricating 3-dimensional force input control devices are disclosed. These roughly comprise: providing a first substrate, fabricating stress-sensitive IC components and signal processing IC on a side one of the first substrate, fabricating one or more closed trenches on a side two of the first substrate within each die area, creating elastic element, frame area and rigid island, providing a second substrate, patterning a side two of the second substrate to define areas for deep etching, creating a layer of bonding material in local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing the two bonded substrates into multiple separate dice.

Abstract: A system and a method of long-term condition monitoring of structures are based on use of autonomous sensing modules, centers for storing and processing data and software for data analysis. An autonomous sensing module contains a set of sensors for measurements of parameters related to the condition of a monitored structure, a non-volatile memory, a wireless data transfer unit, a controller, a clock circuit, a battery, an energy harvesting device and a power management unit. The autonomous sensing module provides a very long-term (40 years or more) functionality and reliability due to both use of at least near hermetic packages for the controller, the non-volatile memory, the battery, the clock circuit and the power management unit and choosing the duration of periods when the sensing module works in active mode in such a way that the average energy consumed by the autonomous sensing module is fully compensated by the average energy harvested by the energy harvesting device.

Abstract: Method of fabricating 3-dimensional force input control device are disclosed.

Abstract: A packaged memory device for storing information comprises a stack, a package lid, a first magnet structure fixedly connected to the package lid, a package body and a second magnet structure connected with the package body. The stack includes a tip substrate, a cap, and a media arranged between the tip substrate and cap and movable relative to the tip substrate. The tip substrate includes a plurality of tips extending from the tip substrate so that the tips can access the media. The first magnet structure includes a first magnet connected with a first flux plate. The second magnet structure includes a second magnet connected with a second flux plate. The second flux plate is integrated with the package body so that the second flux plate provides structural rigidity to the package body. The stack is connected to one or both of the package body and the second magnet.

Abstract: Methods of wafer-to-wafer bonding are disclosed. These methods use a force-transposing substrate providing redistribution of the applied force to the local bonding areas across the wafer. Certain versions of the Present Invention also provide a compliant force-distributing member along with applying bonding material to bonding areas in select locations. A predetermined sequence of external force loading and temperature steps ensure creating bonds between the wafers in the bonding areas. The disclosed methods improve wafer bonding, by increasing its uniformity and strength across the wafer, increasing both reproducibility and yield process and decreasing cost of semiconductor and MEMS devices.

Abstract: A method of fabricating an information storage device comprises providing a media substrate including a first side and a second side, forming a media on the first side of the media substrate, adhesively associating the media with a carrier substrate, thinning a surface of the second side of the media substrate while supporting and protecting the media with the carrier substrate, and forming circuitry on the thinned second side of the media substrate.

Abstract: A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices along with other applications like medical equipment, robotics, security systems and wireless sensor networks is disclosed. The device can be one-axis or two-axis or three-axis sensitive broadening the range of applications. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, and electrical connection elements for mounting and/or wire bonding. Signal conditioning and processing integrated circuit can be integrated within some devices. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element cooperated with the sensor die for transferring an external force to the force sensor die.

Abstract: An information storage device comprises a ferroelectric media, write circuitry to provide a first signal and a second signal to the ferroelectric media, a tip platform and a cantilever operably associated with the tip platform. A tip extends from the cantilever toward the ferroelectric media and includes a first conductive material communicating the first signal from the write circuitry to the ferroelectric media and a second conductive material communicating the second signal from the write circuitry to the ferroelectric media. A insulating material arranged between the first conductive material and the second conductive material to electrically isolate the first conductive material from the second conductive material.

Abstract: In one embodiment a micro-electro mechanical system is disclosed. A MEMS structure can include a frame, a movable structure and a set of structural beams to suspend the movable structure from the frame. The system can also include a set of conductor routing beams. The conductor routing beams can provide a conductive path from the frame to the movable structure. The set of structural beams can have a spring rate that is more than ten times the spring rate of the set of conductor routing beams. Accordingly, multiple routing beams can be utilized to support multiple conductors without significantly affecting the mechanical movement or dynamic properties of the movable structure.

Abstract: A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices is disclosed. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, connection elements for either flip chip mounting or wire bonding. Signal conditioning and processing integrated circuit is integrated within the device. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element coupled to the sensor die for transferring an external force to the force sensor die. A button, which has multiple ergonomical designs, is mechanically coupled to the force-transferring element of the package for providing an interface with the external force.

Abstract: Systems in accordance with the present invention can include a tip contactable with a media, the media including a substrate and a plurality of cells disposed over the substrate, one or more of the cells being electrically isolated from the other of the cells by a material having insulating properties. One or more of the plurality of cells can include a phase change material. The media is either grounded or electrically connected with a voltage source such that when the tip is placed in contact with the media and a voltage is applied to the tip, a current is drawn through the cell over which the tip is arranged. The current is drawn through the isolated cell at least a portion of the phase change material within the cell beneath the tip is heated to a sufficient temperature such that the material become amorphous in structure. The current is then removed from the phase change material, which is quickly cooled to form an amorphous domain having a resistance representing a “1” (or a “0”).

Abstract: Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The tip can be formed by depositing a first metal layer over silicon thereby defining a cantilever structure, depositing a second metal layer at least partially over the first metal layer, and at least partially over a cone structure of the silicon to define the tip structure. The silicon can then be removed from beneath the cantilever and from within the deposited second metal layer by etching, thereby leaving a low-mass metal tip associated with a metal cantilever. An alternative embodiment, the silicon can be removed from beneath the cantilever by etching, but endpointed such that at least a portion of the cone structure remains beneath the second metal layer. The silicon/metal tip can have good wear characteristics and a slightly higher mass.