Patents by Inventor Nicole Schulze-Ollmert

Nicole Schulze-Ollmert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR WAFER INCLUDING A TEST STRUCTURE
    Publication number: 20250112097
    Abstract: Disclosed is a semiconductor wafer including a test structure. The test structure includes a pad arrangement arranged above a kerf region of a semiconductor wafer. The pad arrangement includes: contact pads arranged in series in a first direction; and two alignment pads arranged in series with the contact pads in the first direction such that the contact pads are arranged between the two alignment pads. Each of the contact pads comprises a metal. Each of the alignment pads is different from each of the contact pads and is configured to be irreversibly deformed when coming into contact with a probe needle.
    Type: Application
    Filed: September 26, 2024
    Publication date: April 3, 2025
    Inventors: Nicole Schulze-Ollmert, Jürgen Bostjancic, Christian Fachmann, Ingo Muri, Holger Busch
  • Semiconductor device having alignment pads and method of manufacturing the same
    Patent number: 11616032
    Abstract: A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: March 28, 2023
    Assignee: Infineon Technologies AG
    Inventors: Daniel Maurer, Christof Altstaetter, Thomas Beyreder, Oliver Blank, Jürgen Bostjancic, Andreas Kleinbichler, Josef Liegl, Nicole Schulze-Ollmert
  • SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210242148
    Abstract: A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.
    Type: Application
    Filed: January 20, 2021
    Publication date: August 5, 2021
    Inventors: Daniel Maurer, Christof Altstaetter, Thomas Beyreder, Oliver Blank, Jürgen Bostjancic, Andreas Kleinbichler, Josef Liegl, Nicole Schulze-Ollmert