Abstract: A method of forming a package-on-package semiconductor device is provided. The method includes mounting a packaged radio frequency (RF) semiconductor device on a first major side of a package substrate. The packaged RF semiconductor device includes a semiconductor die, an encapsulant encapsulating the semiconductor die, and a redistribution layer (RDL) formed over an active side of the semiconductor die and a portion of the encapsulant. A signal launcher is formed from a conductive layer of the RDL. The signal launcher is configured for propagation of an RF signal through a waveguide formed through the package substrate.

Abstract: A device includes a substrate and at least one electrically conducting portion supported by the substrate, the at least one electrically conducting portion including a signal line and a ground plane electrically isolated from the signal line. The electrically conducting portion includes a layer of a first electrically conducting material and a layer of a metal oxide material including anodic aluminum oxide (AAO) and one or more nanowires (NW) of a second electrically conducting material each formed within a corresponding pore extending through the AAO from a first side of the layer to a second side of the layer of the metal oxide material opposite the first side.

Abstract: In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: A device includes a substrate and at least one electrically conducting portion supported by the substrate, the at least one electrically conducting portion including a signal line and a ground plane electrically isolated from the signal line. The electrically conducting portion includes a layer of a first electrically conducting material and a layer of a metal oxide material including anodic aluminum oxide (AAO) and one or more nanowires (NW) of a second electrically conducting material each formed within a corresponding pore extending through the AAO from a first side of the layer to a second side of the layer of the metal oxide material opposite the first side.

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.