Patents by Inventor Nirmal Sharma

Nirmal Sharma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080013298
    Abstract: Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 17, 2008
    Inventors: Nirmal Sharma, Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engel, William P. Taylor, Kirsten Doogue, Jay Gagnon
  • Publication number: 20070279053
    Abstract: An integrated current sensor includes a current conductor, a magnetic field transducer, and an electromagnetic shield. The magnetic field transducer includes a sensor die. The electromagnetic shield is disposed proximate to the sensor die. The electromagnetic shield has at least one feature selected to reduce an eddy current in the electromagnetic shield.
    Type: Application
    Filed: July 11, 2007
    Publication date: December 6, 2007
    Inventors: William Taylor, John Cummings, Michael Doogue, Jay Gagnon, Vijay Mangtani, Nirmal Sharma
  • Publication number: 20070099348
    Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.
    Type: Application
    Filed: November 1, 2005
    Publication date: May 3, 2007
    Inventors: Nirmal Sharma, Virgil Ararao
  • Publication number: 20060219436
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.
    Type: Application
    Filed: May 12, 2006
    Publication date: October 5, 2006
    Inventors: William Taylor, Michael Doogue, Nirmal Sharma, Jay Gagnon, Vijay Mangtani
  • Patent number: 6995315
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: February 7, 2006
    Assignee: Allegro Microsystems, Inc.
    Inventors: Nirmal Sharma, Richard Dickinson, Michael Doogue, Jay Gagnon
  • Publication number: 20050248336
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors.
    Type: Application
    Filed: May 27, 2005
    Publication date: November 10, 2005
    Inventors: Nirmal Sharma, Richard Dickinson, Michael Doogue, Jay Gagnon
  • Patent number: 6646343
    Abstract: A method and an integrated circuit package support a high-speed integrated circuit operating at 10 GHz or higher switching speeds. The packaged integrated circuit has external terminals, a semiconductor die having conventional bonding pads, a substrate (e.g., printed circuit board) having conductive traces to couple input, output or bi-directional signals between bonding finger areas of the conductive traces and the external terminals. A ground plate that is electrically isolated from a conductive trace is positioned in the vicinity of the bonding finger area of the conductive trace. Bond wires connect the bonding pads of the electronic circuit and the bonding finger areas of the conductive traces. The ground plate improves integrity in a high-speed signal by canceling the complex impedance of a bond wire.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: November 11, 2003
    Assignee: BitBlitz Communications, Inc.
    Inventors: Nirmal Sharma, Ge Gong, Jason Chen