Abstract: Apparatus and methods associated with an enclosure or structure including two sections that are adapted with a snap-fit interlocking structure. Various embodiments of the enclosure or structures are formed with various case hardening or embrittlement processes to increase embrittlement or hardness of the enclosure or structure so as to create a structure or enclosure which has a desired fragmentation capacity while still maintaining sufficient material properties to permit snap-fit insertion of one section into another section and withstand substantial impacts. Embodiments also provide an interlocking structure that minimizes differences in fragmentation or fracturing capacity as contrasted with other portions of the structure or enclosure. An embodiment of the invention includes an enclosure where one section of the enclosure or structure has a first thickness and the second section has a second thickness, wherein the first and second thicknesses are different.

Abstract: Apparatus and methods associated with an enclosure or structure including two sections that are adapted with a snap-fit interlocking structure. Various embodiments of the enclosure or structures are formed with various case hardening or embrittlement processes to increase embrittlement or hardness of the enclosure or structure so as to create a structure or enclosure which has a desired fragmentation capacity while still maintaining sufficient material properties to permit snap-fit insertion of one section into another section and withstand substantial impacts. Embodiments also provide an interlocking structure that minimizes differences in fragmentation or fracturing capacity as contrasted with other portions of the structure or enclosure. An embodiment of the invention includes an enclosure where one section of the enclosure or structure has a first thickness and the second section has a second thickness, wherein the first and second thicknesses are different.

Abstract: A fragmentation structure is provided with improved performance e.g., fragmentation, projectile generation, storage, and manufacturing. An embodiment can include an open fragmentation structure that can be separated into individual components that can include a structure body section with a compartment, a removable initiator or detonator, a top cap section having an aperture configured to accept the removable initiator or removable detonator, and an explosive. An exemplary explosive can be preassembled to fit within the structure without a need for pouring in an explosive. An exemplary structure or top cap of the structure can receive an embrittlement treatment increasing its fragmentation characteristics. An ability of the structure to be easily disassembled allows for safer storage and a longer shelf life. A design of an exemplary embodiment of the structure allows it to be used with a wide range of explosive materials in addition to many types of removable initiators or detonators.

Abstract: A fragmentation structure is provided with improved performance e.g., fragmentation, projectile generation, storage, and manufacturing. An embodiment can include an open fragmentation structure that can be separated into individual components that can include a structure body section with a compartment, a removable initiator or detonator, a top cap section having an aperture configured to accept the removable initiator or removable detonator, and an explosive. An exemplary explosive can be preassembled to fit within the structure without a need for pouring in an explosive. An exemplary structure or top cap of the structure can receive an embrittlement treatment increasing its fragmentation characteristics. An ability of the structure to be easily disassembled allows for safer storage and a longer shelf life. A design of an exemplary embodiment of the structure allows it to be used with a wide range of explosive materials in addition to many types of removable initiators or detonators.

Abstract: The present invention relates application of conformal coatings made up of nano-fiber, nano-particle, and/or nano-capsule materials to be applied on electrical component parts in general and printed circuit boards (PCB) in particular. A conformal coating material, such as Parlyne, can be combined with nano-materials to produce desired results. Benefits of this invention include enhancement of conventional conformal coatings performance in terms of properties such as mechanical, electrical, magnetic and in particular to prevent or obstruct the growth of tin whiskers or any other manufacturing defect that can develop on the surface of a PCB.

Abstract: A fragmentation structure is provided with improved performance e.g., fragmentation, projectile generation, storage, and manufacturing. An embodiment can include an open fragmentation structure that can be separated into individual components that can include a structure body section with a compartment, a removable initiator or detonator, a top cap section having an aperture configured to accept the removable initiator or removable detonator, and an explosive. An exemplary explosive can be preassembled to fit within the structure without a need for pouring in an explosive. An exemplary structure or top cap of the structure can receive an embrittlement treatment increasing its fragmentation characteristics. An ability of the structure to be easily disassembled allows for safer storage and a longer shelf life. A design of an exemplary embodiment of the structure allows it to be used with a wide range of explosive materials in addition to many types of removable initiators or detonators.

Abstract: The present invention relates application of conformal coatings made up of nano-fiber, nano-particle, and/or nano-capsule materials to be applied on electrical component parts in general and printed circuit boards (PCB) in particular. A conformal coating material, such as Parlyne, can be combined with nano-materials to produce desired results. Benefits of this invention include enhancement of conventional conformal coatings performance in terms of properties such as mechanical, electrical, magnetic and in particular to prevent or obstruct the growth of tin whiskers or any other manufacturing defect that can develop on the surface of a PCB.