Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

Abstract: Provided is an ultraviolet curable silicone composition capable of being ejected via inkjet ejection. The composition of the invention is an ultraviolet curable silicone composition comprising: (A) an organopolysiloxane represented by the following general formula (1) wherein each R1 independently represents a group selected from a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group, while the component (A) has per molecule at least two groups selected from an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group; n represents a number satisfying 10?n?1,000; (B) a monofunctional (meth)acrylate compound having no siloxane structure; and/or (C) a multifunctional (meth)acrylate compound having no siloxane structure; and (D) a photopolymerization initiator.

Abstract: A silicone composition is provided comprising (A) an alkenyl-containing organopolysiloxanc having a viscosity of 1.0-100 Pa·s at 25° C., (B) an organopolysiloxane of formula (1), (C) an organohydrogenpolysiloxane of formula (2), (D) an organohydrogenpolysiloxane of formula (3), (E) a filler, (F) a platinum group metal catalyst, and (G) a reaction inhibitor. The composition has a low viscosity and good moldability prior to curing and cures into a dilatant product that exhibits a low storage elastic modulus at a low strain rate and a high storage elastic modulus at a high strain rate.

Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

Abstract: A slurry for forming an insulating layer of the present invention includes heat-resistant insulating fine particles, a thickening agent, and a dispersion medium. The insulating fine particles are dispersed in the dispersion medium. The slurry for forming an insulating layer has a viscosity of 5 to 500 mPa·s. The proportion of particles with a particle size of 1 ?m or less in the insulating fine particles is 30 vol % or more and the proportion of particles with a particles size of 3 ?m or more in the insulating fine particles is 10 vol % or less. An electrochemical device of the present invention includes a separator for an electrochemical device of the present invention that is produced using the slurry for forming an electrochemical device of the present invention.

Abstract: An electrochemical device of the present invention includes a positive electrode, a negative electrode, a non-aqueous electrolyte, and a separator. The separator includes a first porous layer composed mainly of a thermoplastic resin and a second porous layer composed mainly of insulating particles with a heat-resistant temperature of 150° C. or higher. The first porous layer is disposed to face the negative electrode.

Abstract: A UV curable silicone composition comprises: (A) 100 parts by mass of an organopolysiloxane represented by formula (1) wherein n represents a number satisfying 1?n?100, Ar represents an aromatic group, each of F1 and F2 is selected from groups of formulae (2) and (3), and a ratio of the number of terminal groups of the formula (3) to a total number of all the terminal groups is not lower than 20%, wherein each R1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, wherein m represents a number satisfying 0?m?10, each R1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, R2 represents an oxygen atom or an alkylene group, and R3 represents an acryloyl group, a methacryloyl group, an acryloyloxyalkyl group or a methacryloyloxyalkyl group; and (B) 0.1 to 10 parts by mass of a photopolymerization initiator.

Abstract: Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

Abstract: Thermally-conductive silicone composition, a cured material of which does not impose stress to integrated-circuit packages even upon standing at high temperature, and semi-conductor device provided with cured material obtained by curing the composition, the composition comprising (A) 100 parts by mass of an organopolysiloxane having ?2 alkenyl groups per molecule and a dynamic viscosity at 25° C. of 10-100,000 mm2/s, (B) an organohydrogenpolysiloxane of formula (1): (C) an organohydrogenpolysiloxane of formula (2): (D) an organohydrogenpolysiloxane of formula (3): (E) 400-3000 parts by mass of thermally conductive filler, (F) a catalytic amount of platinum group metal catalyst, and (G) 0.01-1 part by mass of reaction retardant, wherein the variables in formulas (1)-(3) are as defined in the specification and the amounts of components (B)-(D) enable satisfaction of the relationships regarding Si—H groups and alkenyl groups in components (A)-(D) are as defined in the specification.

Abstract: Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (A) an organopolysiloxane having a viscosity of 100 to 100,000 mPa·s at 25° C.

Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

Abstract: A thermally conductive silicone composition is provided, a cured material from which does not impose stress to IC packages, even left at a high temperature. The silicone composition has a viscosity at 25 degrees C. of 10 to 1,000 Pa·s, and comprises (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule and a dynamic viscosity at 25 degrees C. of 10 to 100,000 mm2/s, (B) an organohydrogenpolysiloxane represented by the following formula (1): wherein n and m are positive integers which meet the equations: 10?n+m?100 and 0.01?n/(m+n)?0.

Abstract: A nonaqueous battery having a high level of safety and high-temperature storability, a heat-resistant porous film capable of serving as a separator material for separating positive and negative electrodes from each other and capable of forming the nonaqueous battery, and a separator capable of forming the nonaqueous battery are provided.

Abstract: Provided is a room temperature and humidity thickening thermo-conductive silicone grease composition with high shape retention characteristics and good workability despite a low viscosity in an initial phase. Essential components of the room temperature and humidity thickening thermo-conductive silicone grease composition of the present invention are: (A) organopolysiloxane with a viscosity of between 0.1 Pa·s and 1,000 Pa·s at 25° C.

Abstract: Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

Abstract: A slurry for forming an insulating layer of the present invention includes heat-resistant insulating fine particles, a thickening agent, and a dispersion medium. The insulating fine particles are dispersed in the dispersion medium. The slurry for forming an insulating layer has a viscosity of 5 to 500 mPa·s. The proportion of particles with a particle size of 1 ?m or less in the insulating fine particles is 30 vol % or more and the proportion of particles with a particles size of 3 ?m or more in the insulating fine particles is 10 vol % or less. An electrochemical device of the present invention includes a separator for an electrochemical device of the present invention that is produced using the slurry for forming an electrochemical device of the present invention.

Abstract: Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (A) an organopolysiloxane having a viscosity of 100 to 100,000 mPa·s at 25° C.

Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

Abstract: The present invention provides a lithium secondary battery using a separator including a porous film formed by binding inorganic oxide particles together with a binder. The inorganic oxide particles are treated so that an amount of alkali metal elements eluted therefrom when they are immersed in ion exchange water is reduced to 1000 ppm or less. As a result, it is possible to provide a lithium secondary battery with a high degree of reliability, whose characteristics deteriorate less when it is used or stored for an extended period.

Abstract: A separator for an electrochemical device of the present invention includes a porous film including: a filler; an organic binder; and at least one resin selected from resin A that has a melting point of 80 to 140° C. and resin B that absorbs a non-aqueous electrolyte and swells upon heating and whose swelling degree increases with increasing temperature, and the filler contains boehmite having a secondary particle structure in which primary particles are connected.