Abstract: [Object] To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate. [Solving Means] A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N/cm or more.

Abstract: [Object] To provide a copper clad laminate that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate. [Solving Means] A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 ??·cm or lower.

Abstract: Provided are a thin hard disk substrate that is scratch-resistant on the disk surface and wobbles less during rotation and a hard disk device including such a hard disk substrate. The hard disk substrate 1 includes an aluminum alloy substrate 2 having NiP plating films 3 on the surfaces. The aluminum alloy substrate 2 has the Vickers hardness of 60 Hv or more, the ratio between the thickness of the NiP plating films 3 and the thickness of the Al alloy substrate 2 is 3.8% or more, the Young's modulus of the hard disk substrate 1 is 74.6 GPa or more, and the Vickers hardness of the hard disk substrate 1 is 293 Hv or more.

Abstract: A separator for fuel cells is provided. The separator includes: a base material; an underlying plate layer formed on the base material; and a gold plate layer formed on the underlying plate layer by means of electroless plating. The separator is characterized in that a face of the underlying plate layer facing the gold plate layer has an arithmetic average roughness Ra of 80 nm or less. According to the present invention, there can be provided a separator for fuel cells in which the gold plate layer can be uniformly formed for irregular parts that constitute gas flow channels and the occurrence of unformed parts and pinholes in the gold plate layer is prevented without increasing the film thickness of the gold plate layer and which is excellent in the corrosion resistance and the conductivity.

Abstract: An alloy plate coated material including a base material and an alloy plate layer which is formed on the base material to constitute an outermost layer and is formed from a M1-M2-M3 alloy. M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn. M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru. M3 is at least one element selected from P and B. The alloy plate layer has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.

Abstract: Provided are a thin hard disk substrate that is scratch-resistant on the disk surface and wobbles less during rotation and a hard disk device including such a hard disk substrate. The hard disk substrate 1 includes an aluminum alloy substrate 2 having NiP plating films 3 on the surfaces. The aluminum alloy substrate 2 has the Vickers hardness of 60 Hv or more, the ratio between the thickness of the NiP plating films 3 and the thickness of the Al alloy substrate 2 is 3.8% or more, the Young's modulus of the hard disk substrate 1 is 74.6 GPa or more, and the Vickers hardness of the hard disk substrate 1 is 293 Hv or more.

Abstract: There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

Abstract: There is provided a gold plate coated stainless material characterized by comprising: a stainless steel sheet formed with a passivation film having a surface of which a Cr/O value is within a range of 0.05 to 0.2 and a Cr/Fe value is within a range of 0.5 to 0.8 when measured by Auger electron spectroscopy analysis; and a gold plated layer formed on the passivation film of the stainless steel sheet. According to the present invention, there can be provided a gold plate coated stainless material which can be improved in the coverage and interfacial adhesion property of the gold plated layer formed on the stainless steel sheet even when reducing the thickness of the gold plated layer, thereby to be excellent in corrosion resistance and conductivity and advantageous in cost.

Abstract: An alloy plate coated material including a base material and an alloy plate layer which is formed on the base material to constitute an outermost layer and is formed from a M1-M2-M3 alloy. M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn. M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru. M3 is at least one element selected from P and B. The alloy plate layer has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.

Abstract: There is provided a palladium plate coated material (100) comprising: a base material (10); an underlying alloy layer (20) formed on the base material (10); and a palladium plated layer (30) formed on the underlying alloy layer (20). The palladium plate coated material (100) is characterized in that the underlying alloy layer (20) is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

Abstract: A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

Abstract: Provided is an alloy plate coated material including a base material, and an alloy plate layer which is formed on the base material to constitute an outermost layer and is formed from a M1-M2-M3 alloy (provided that M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn; M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru; and M3 is at least one element selected from P and B), in which the alloy plate layer has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.

Abstract: There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

Abstract: A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

Abstract: Provided is an alloy plate coated material including a base material, and an alloy plate layer which is formed on the base material to constitute an outermost layer and is formed from a M1-M2-M3 alloy (provided that M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn; M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru; and M3 is at least one element selected from P and B), in which the alloy plate layer has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.

Abstract: A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

Abstract: There is provided a method of electroless gold plating, wherein the method includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the method is characterized in that the underlying alloy layer is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

Abstract: There is provided a palladium plate coated material (100) comprising: a base material (10); an underlying alloy layer (20) formed on the base material (10); and a palladium plated layer (30) formed on the underlying alloy layer (20). The palladium plate coated material (100) is characterized in that the underlying alloy layer (20) is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

Abstract: There is provided a gold plate coated stainless material characterized by comprising: a stainless steel sheet formed with a passivation film having a surface of which a Cr/O value is within a range of 0.05 to 0.2 and a Cr/Fe value is within a range of 0.5 to 0.8 when measured by Auger electron spectroscopy analysis; and a gold plated layer formed on the passivation film of the stainless steel sheet. According to the present invention, there can be provided a gold plate coated stainless material which can be improved in the coverage and interfacial adhesion property of the gold plated layer formed on the stainless steel sheet even when reducing the thickness of the gold plated layer, thereby to be excellent in corrosion resistance and conductivity and advantageous in cost.

Abstract: An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions.